F59L4G81KA-25TIG2R

The F59L4G81KA-25TIG2R is a 4.295 Gbit single-level cell (SLC) NAND flash memory organized as 512M × 8. Designed for industrial embedded storage, it provides robust non-volatile data storage with parallel x8 interface and a JEDEC-qualified architecture.

This device targets applications requiring high endurance, long data retention, and predictable performance — delivering page- and block-level program/erase operations, boot and cache-read/program support, and a compact 48-pin TSOPI surface-mount package.

Key Features

• Memory Architecture 4.295 Gbit SLC NAND organized as 512M × 8 with 4352‑byte data/register increments and a page size of (4K + 256) bytes; block size is 64 pages = (256K + 16K) bytes.
• Performance Access time 20 ns (device spec) with a read cycle of 25 ns and random read up to 25 µs (max). Typical page program time is 400 µs (700 µs max); block erase typical 3.5 ms (10 ms max).
• Interface & Operation Parallel x8 interface with command/address/data multiplexed on the DQ port. Supports cache program/read, copy-back, automatic program/erase, and automatic page‑0 read at power-up for boot-from-NAND scenarios.
• Power Single-supply operation across 2.7 V to 3.6 V (VCC = 3.3 V nominal).
• Reliability & Endurance SLC technology with endurance rated at 60K program/erase cycles, ECC requirement 8-bit per 512‑byte, and an uncycled data retention of 10 years at 55°C. Compliant to JESD47K specifications.
• Package & Temperature 48-pin TSOPI surface-mount package (TSOPI-48); industrial operating range of −40°C to 85°C. RoHS compliant.

Typical Applications

• Industrial Embedded Storage — Reliable non-volatile storage for firmware, configuration data, and logs where wide temperature range and endurance are required.
• Boot and System Flash — Supports automatic page‑0 read at power-up and boot-from-NAND usage for system boot code and firmware images.
• Multimedia and Data Logging — Suitable for image file memory, voice recording, and solid-state file storage that require high-density, long-lived writes.
• Consumer and Professional Devices — High-endurance SLC memory for devices requiring robust program/erase cycles and predictable retention.

Unique Advantages

• SLC Endurance — 60K P/E cycle rating provides long service life for write-intensive applications.
• Industrial Temperature Range — −40°C to 85°C operation enables deployment in harsh environments.
• JEDEC-Grade Reliability — Compliant with JESD47K specifications for improved robustness and qualification traceability.
• Boot and High-Performance Modes — Automatic page-0 read at power-up, cache program/read, and copy-back operations streamline system boot and data transfer workflows.
• Flexible Power and Interface — 2.7 V–3.6 V supply range with a parallel x8 DQ port simplifies integration into existing system designs.
• Compact Surface-Mount Package — TSOPI-48 footprint for space-constrained PCBs while maintaining high-density storage.

Why Choose F59L4G81KA-25TIG2R?

The F59L4G81KA-25TIG2R is positioned for engineers who need durable, high-density SLC NAND storage with predictable program/erase performance and long-term data retention. Its combination of JEDEC-class qualification, 60K endurance, ECC guidance, and industrial temperature rating makes it well suited for embedded systems, boot storage, and data-logging applications where reliability and lifecycle matter.

Packaged in a compact 48-pin TSOPI surface-mount format and operating across a wide voltage range, this device is a practical choice for designs that require straightforward parallel interface integration and documented performance metrics from the manufacturer.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time details for the F59L4G81KA-25TIG2R.