F59L4G81KA-25TG2R
| Part Description |
SLC NAND Flash, 4Gbit, 3.3V, x8, 25ns, 48-pin TSOPI |
|---|---|
| Quantity | 1,648 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | TSOPI-48 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 4 Gbit | Access Time | 20 ns | Grade | Commercial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C – 70°C | Write Cycle Time Word Page | 400 µs | Packaging | 48-TSOPI | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 512M x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59L4G81KA-25TG2R – SLC NAND Flash, 4Gbit, 3.3V, x8, 25ns, 48-pin TSOPI
The F59L4G81KA-25TG2R from ESMT is a 4.295 Gbit Single-Level Cell (SLC) NAND Flash device organized as 512M × 8. It implements a parallel I/O architecture with command/address/data multiplexed on the DQ port and supports 3.3 V operation (Vcc: 2.7 V to 3.6 V).
This device targets high-density non-volatile storage needs in embedded designs such as solid-state file storage, voice recording and image memory for still cameras, offering page- and block-level operations with on-die features that support boot and automatic memory download use cases.
Key Features
- Memory Core — 4.295 Gbit SLC NAND organized as 512M × 8, supporting robust single-bit-per-cell storage.
- Page and Block Architecture — Page size (4K + 256) bytes and block size of 64 pages = (256K + 16K) bytes; data register size (4K + 256) bytes for 4352-byte program/read transfers.
- Performance — Parallel interface with a 25 ns device speed grade and listed access characteristics; Random read maximum 25 µs and read cycle 25 ns as described in the datasheet.
- Program/Erase Timing — Typical page program time 400 µs (700 µs max) and block erase typical 3.5 ms (10 ms max), enabling predictable programming and erase windows.
- Power and Voltage — Single-supply operation Vcc = 3.3 V with an allowable range of 2.7 V to 3.6 V for flexible system integration.
- Reliability — Endurance rated for 60K program/erase cycles and uncycled data retention of 10 years at 55 °C; ECC requirement specified as 8-bit/512-byte.
- On-Die Features — Automatic program/erase execution, cache program/read, copy-back operation, EDO mode, automatic Page 0 read at power-up, boot-from-NAND and automatic memory download support.
- Package and Temperature — Supplied in a 48-pin TSOPI surface-mount package; commercial operating temperature range 0 °C to 70 °C.
- Standards and Protection — Hardware data protection with program/erase lockout during power transitions and compliance to JESD47K as documented in the datasheet.
Typical Applications
- Solid-State File Storage — Use as high-density non-volatile storage for embedded file systems and removable storage devices that require SLC endurance and retention characteristics.
- Imaging Devices — Store image files and buffers for still cameras and imaging modules where page-based reads/writes and reliable retention are required.
- Voice and Audio Recorders — Local non-volatile storage for audio capture and playback systems, leveraging the device’s page program and cache read support.
- Embedded Boot Memory — Boot-from-NAND capability and automatic Page 0 read at power-up make the device suitable for systems requiring on-board firmware storage and boot support.
Unique Advantages
- SLC Endurance and Retention: 60K P/E cycles and 10-year retention at 55 °C provide long-term data stability for demanding embedded storage applications.
- Predictable Timing: Documented page program and block erase typical/max timings (400 µs / 700 µs and 3.5 ms / 10 ms respectively) support deterministic design planning.
- Flexible Voltage Range: 2.7 V to 3.6 V supply operation allows compatibility with a variety of system power rails.
- Integrated Data Management: On-die features like cache program/read, copy-back and automatic memory download reduce host-side complexity for common data operations.
- Compact Surface-Mount Package: 48-pin TSOPI package (12 mm × 20 mm body, 0.5 mm pin pitch) simplifies PCB layout for space-constrained designs.
Why Choose F59L4G81KA-25TG2R?
The F59L4G81KA-25TG2R combines SLC NAND cell reliability with a block- and page-oriented architecture that is well suited to embedded storage, imaging and audio recording applications. Its documented program/erase timing, endurance spec and ECC requirement allow engineers to design predictable storage subsystems with clear reliability targets.
Manufactured by ESMT and provided in a compact 48-pin TSOPI surface-mount package, this device is aimed at commercial-grade designs that require durable non-volatile memory with boot support and on-die data management capabilities.
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Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
Certifications and Memberships: N/A