F59L4G81KA-25TG2R

4Gb NAND Flash
Part Description

SLC NAND Flash, 4Gbit, 3.3V, x8, 25ns, 48-pin TSOPI

Quantity 1,648 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageTSOPI-48Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size4 GbitAccess Time20 nsGradeCommercial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C – 70°CWrite Cycle Time Word Page400 µsPackaging48-TSOPI
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization512M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of F59L4G81KA-25TG2R – SLC NAND Flash, 4Gbit, 3.3V, x8, 25ns, 48-pin TSOPI

The F59L4G81KA-25TG2R from ESMT is a 4.295 Gbit Single-Level Cell (SLC) NAND Flash device organized as 512M × 8. It implements a parallel I/O architecture with command/address/data multiplexed on the DQ port and supports 3.3 V operation (Vcc: 2.7 V to 3.6 V).

This device targets high-density non-volatile storage needs in embedded designs such as solid-state file storage, voice recording and image memory for still cameras, offering page- and block-level operations with on-die features that support boot and automatic memory download use cases.

Key Features

  • Memory Core — 4.295 Gbit SLC NAND organized as 512M × 8, supporting robust single-bit-per-cell storage.
  • Page and Block Architecture — Page size (4K + 256) bytes and block size of 64 pages = (256K + 16K) bytes; data register size (4K + 256) bytes for 4352-byte program/read transfers.
  • Performance — Parallel interface with a 25 ns device speed grade and listed access characteristics; Random read maximum 25 µs and read cycle 25 ns as described in the datasheet.
  • Program/Erase Timing — Typical page program time 400 µs (700 µs max) and block erase typical 3.5 ms (10 ms max), enabling predictable programming and erase windows.
  • Power and Voltage — Single-supply operation Vcc = 3.3 V with an allowable range of 2.7 V to 3.6 V for flexible system integration.
  • Reliability — Endurance rated for 60K program/erase cycles and uncycled data retention of 10 years at 55 °C; ECC requirement specified as 8-bit/512-byte.
  • On-Die Features — Automatic program/erase execution, cache program/read, copy-back operation, EDO mode, automatic Page 0 read at power-up, boot-from-NAND and automatic memory download support.
  • Package and Temperature — Supplied in a 48-pin TSOPI surface-mount package; commercial operating temperature range 0 °C to 70 °C.
  • Standards and Protection — Hardware data protection with program/erase lockout during power transitions and compliance to JESD47K as documented in the datasheet.

Typical Applications

  • Solid-State File Storage — Use as high-density non-volatile storage for embedded file systems and removable storage devices that require SLC endurance and retention characteristics.
  • Imaging Devices — Store image files and buffers for still cameras and imaging modules where page-based reads/writes and reliable retention are required.
  • Voice and Audio Recorders — Local non-volatile storage for audio capture and playback systems, leveraging the device’s page program and cache read support.
  • Embedded Boot Memory — Boot-from-NAND capability and automatic Page 0 read at power-up make the device suitable for systems requiring on-board firmware storage and boot support.

Unique Advantages

  • SLC Endurance and Retention: 60K P/E cycles and 10-year retention at 55 °C provide long-term data stability for demanding embedded storage applications.
  • Predictable Timing: Documented page program and block erase typical/max timings (400 µs / 700 µs and 3.5 ms / 10 ms respectively) support deterministic design planning.
  • Flexible Voltage Range: 2.7 V to 3.6 V supply operation allows compatibility with a variety of system power rails.
  • Integrated Data Management: On-die features like cache program/read, copy-back and automatic memory download reduce host-side complexity for common data operations.
  • Compact Surface-Mount Package: 48-pin TSOPI package (12 mm × 20 mm body, 0.5 mm pin pitch) simplifies PCB layout for space-constrained designs.

Why Choose F59L4G81KA-25TG2R?

The F59L4G81KA-25TG2R combines SLC NAND cell reliability with a block- and page-oriented architecture that is well suited to embedded storage, imaging and audio recording applications. Its documented program/erase timing, endurance spec and ECC requirement allow engineers to design predictable storage subsystems with clear reliability targets.

Manufactured by ESMT and provided in a compact 48-pin TSOPI surface-mount package, this device is aimed at commercial-grade designs that require durable non-volatile memory with boot support and on-die data management capabilities.

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