F59L4G81KA-25BCIG2R
| Part Description |
SLC NAND Flash Memory, 4 Gbit, x8, 3.3V, Industrial 67-ball BGA |
|---|---|
| Quantity | 1,634 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | BGA-67 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 4 Gbit | Access Time | 20 ns | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C – 85°C | Write Cycle Time Word Page | 400 µs | Packaging | 67-BGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 512M x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59L4G81KA-25BCIG2R – SLC NAND Flash Memory, 4 Gbit, x8, 3.3V, Industrial 67-ball BGA
The F59L4G81KA-25BCIG2R is a 4.295 Gbit single-level cell (SLC) NAND flash memory organized as 512M × 8. It implements a parallel command/address/data multiplexed DQ port and supports automatic program/erase operations, making it suitable for high-density non-volatile storage in industrial systems.
Designed for industrial environments, this device offers a 2.7 V–3.6 V supply range, JEDEC qualification, and an operating temperature range of −40 °C to 85 °C, delivering reliable storage for embedded file systems, image or voice recording, and other solid-state storage applications.
Key Features
- Memory Architecture 4.295 Gbit capacity organized as 512M × 8 with a page size of (4K + 256) bytes and block size of 64 pages = (256K + 16K) bytes.
- SLC NAND Technology Single-level cell (1 bit/cell) NAND flash for endurance and data retention characteristics.
- Performance Access time listed as 20 ns; read cycle 25 ns and random read up to 25 µs. Page program time typically 400 µs (700 µs max); block erase typically 3.5 ms (10 ms max).
- Power and Interface 3.3 V nominal supply (operating range 2.7 V–3.6 V) with a parallel multiplexed command/address/data DQ interface and hardware data protection features including program/erase lockout during power transitions.
- Reliability & Endurance Endurance rated at 60K program/erase cycles with uncycled data retention of 10 years at 55 °C and an ECC requirement of 8-bit per 512 bytes.
- System and Boot Features Supports automatic page 0 read at power-up, boot-from-NAND support, automatic memory download, cache program/read, copy-back and EDO mode to aid system integration.
- Package & Temperature 67-ball BGA (BGA-67) surface-mount package, JEDEC-qualified, and specified for industrial operating temperatures from −40 °C to 85 °C.
Typical Applications
- Solid-State File Storage High-density non-volatile storage for embedded file systems where reliable page/block program and erase operations are required.
- Imaging Devices Image file memory for still cameras and imaging modules that need large page sizes and block organization.
- Voice Recording & Media Storage for voice or audio recorders that benefit from automatic program/erase and cache program/read operations.
- Industrial Embedded Systems Persistent code and data storage in industrial controllers and devices needing JEDEC-qualified, temperature-rated SLC NAND.
Unique Advantages
- SLC Endurance and Retention 60K program/erase cycles and 10-year data retention at 55 °C provide long-term reliability for demanding embedded applications.
- Robust Power Range 2.7 V–3.6 V supply flexibility accommodates a variety of 3.3 V system designs.
- System-Friendly Features Automatic page 0 read at power-up, boot-from-NAND support and automatic memory download simplify system boot and firmware update flows.
- Integrated Data Protection Hardware data protection and program/erase lockout during power transitions help protect stored data during critical power events.
- High-Density, Compact Package 67-ball BGA in a surface-mount form factor offers a compact footprint for high-density storage integration on space-constrained PCBs.
- JEDEC Qualification Compliance to JESD47K specifications provides a baseline reliability qualification expected in industrial deployments.
Why Choose F59L4G81KA-25BCIG2R?
The F59L4G81KA-25BCIG2R combines SLC NAND endurance and retention with system-level features such as cache program/read, copy-back, and boot support to address embedded storage needs in industrial applications. Its JEDEC qualification, wide voltage range, and −40 °C to 85 °C operating range make it appropriate for designs that require robust, long-lived non-volatile memory.
This part is well suited for engineering teams building industrial controllers, imaging products, audio/voice recorders, or other devices that need high-density, reliable NAND storage in a compact BGA package with clearly defined timing and endurance characteristics.
Request a quote or submit an inquiry to our sales team to check availability, lead times, and pricing for the F59L4G81KA-25BCIG2R.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
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