F59L4G81KA-25BCIG2R

4Gb NAND Flash Ind.
Part Description

SLC NAND Flash Memory, 4 Gbit, x8, 3.3V, Industrial 67-ball BGA

Quantity 1,634 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageBGA-67Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size4 GbitAccess Time20 nsGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page400 µsPackaging67-BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization512M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.71

Overview of F59L4G81KA-25BCIG2R – SLC NAND Flash Memory, 4 Gbit, x8, 3.3V, Industrial 67-ball BGA

The F59L4G81KA-25BCIG2R is a 4.295 Gbit single-level cell (SLC) NAND flash memory organized as 512M × 8. It implements a parallel command/address/data multiplexed DQ port and supports automatic program/erase operations, making it suitable for high-density non-volatile storage in industrial systems.

Designed for industrial environments, this device offers a 2.7 V–3.6 V supply range, JEDEC qualification, and an operating temperature range of −40 °C to 85 °C, delivering reliable storage for embedded file systems, image or voice recording, and other solid-state storage applications.

Key Features

  • Memory Architecture 4.295 Gbit capacity organized as 512M × 8 with a page size of (4K + 256) bytes and block size of 64 pages = (256K + 16K) bytes.
  • SLC NAND Technology Single-level cell (1 bit/cell) NAND flash for endurance and data retention characteristics.
  • Performance Access time listed as 20 ns; read cycle 25 ns and random read up to 25 µs. Page program time typically 400 µs (700 µs max); block erase typically 3.5 ms (10 ms max).
  • Power and Interface 3.3 V nominal supply (operating range 2.7 V–3.6 V) with a parallel multiplexed command/address/data DQ interface and hardware data protection features including program/erase lockout during power transitions.
  • Reliability & Endurance Endurance rated at 60K program/erase cycles with uncycled data retention of 10 years at 55 °C and an ECC requirement of 8-bit per 512 bytes.
  • System and Boot Features Supports automatic page 0 read at power-up, boot-from-NAND support, automatic memory download, cache program/read, copy-back and EDO mode to aid system integration.
  • Package & Temperature 67-ball BGA (BGA-67) surface-mount package, JEDEC-qualified, and specified for industrial operating temperatures from −40 °C to 85 °C.

Typical Applications

  • Solid-State File Storage High-density non-volatile storage for embedded file systems where reliable page/block program and erase operations are required.
  • Imaging Devices Image file memory for still cameras and imaging modules that need large page sizes and block organization.
  • Voice Recording & Media Storage for voice or audio recorders that benefit from automatic program/erase and cache program/read operations.
  • Industrial Embedded Systems Persistent code and data storage in industrial controllers and devices needing JEDEC-qualified, temperature-rated SLC NAND.

Unique Advantages

  • SLC Endurance and Retention 60K program/erase cycles and 10-year data retention at 55 °C provide long-term reliability for demanding embedded applications.
  • Robust Power Range 2.7 V–3.6 V supply flexibility accommodates a variety of 3.3 V system designs.
  • System-Friendly Features Automatic page 0 read at power-up, boot-from-NAND support and automatic memory download simplify system boot and firmware update flows.
  • Integrated Data Protection Hardware data protection and program/erase lockout during power transitions help protect stored data during critical power events.
  • High-Density, Compact Package 67-ball BGA in a surface-mount form factor offers a compact footprint for high-density storage integration on space-constrained PCBs.
  • JEDEC Qualification Compliance to JESD47K specifications provides a baseline reliability qualification expected in industrial deployments.

Why Choose F59L4G81KA-25BCIG2R?

The F59L4G81KA-25BCIG2R combines SLC NAND endurance and retention with system-level features such as cache program/read, copy-back, and boot support to address embedded storage needs in industrial applications. Its JEDEC qualification, wide voltage range, and −40 °C to 85 °C operating range make it appropriate for designs that require robust, long-lived non-volatile memory.

This part is well suited for engineering teams building industrial controllers, imaging products, audio/voice recorders, or other devices that need high-density, reliable NAND storage in a compact BGA package with clearly defined timing and endurance characteristics.

Request a quote or submit an inquiry to our sales team to check availability, lead times, and pricing for the F59L4G81KA-25BCIG2R.

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