F59L4G161KA-25BCIG2R

The F59L4G161KA-25BCIG2R from ESMT is a Single-Level Cell (SLC) NAND Flash memory device organized as 256M × 16, providing 4.295 Gbit of non-volatile storage in a parallel x16 interface. It is a JEDEC-qualified, surface-mount memory offered in a 67-ball BGA package for compact board-level integration.

Designed for industrial applications, this SLC NAND Flash delivers predictable access and program timing along with a wide supply voltage and operating temperature range, making it suitable for embedded systems that require robust non-volatile storage.

Key Features

• Memory Architecture  SLC NAND Flash organized as 256M × 16 providing 4.295 Gbit of non-volatile storage.
• Interface  Parallel x16 memory interface for direct integration with parallel memory controllers and legacy bus architectures.
• Performance  20 ns access time for read operations and a 400 µs page/program write cycle time for word/page operations, enabling predictable memory timing.
• Power  Wide supply voltage range of 2.7 V to 3.6 V to accommodate 3.3 V systems and tolerate supply variation.
• Package & Mounting  Surface-mount 67-ball BGA (BGA-67) package for compact, board-level mounting and reliable soldered connections.
• Industrial Temperature Range  Rated for operation from −40 °C to 85 °C to meet temperature demands of industrial environments.
• Standards & Compliance  JEDEC qualification and RoHS-compliant manufacturing for regulatory and environmental adherence.

Typical Applications

• Industrial Embedded Systems  Non-volatile storage for controllers and embedded devices operating across −40 °C to 85 °C.
• Data Logging  Parallel SLC NAND for reliable event and log storage in industrial monitoring equipment.
• Firmware Storage  On-board firmware and configuration storage where JEDEC-qualified SLC NAND is required.
• Legacy Parallel Memory Designs  Direct replacement or new designs that utilize a parallel x16 memory interface and BGA footprint.

Unique Advantages

• Deterministic Read Timing: 20 ns access time supports predictable read performance for time-sensitive functions.
• Predictable Program Timing: 400 µs word/page program cycle time provides clear timing characteristics for write operations.
• Wide Supply Range: 2.7 V to 3.6 V operation allows compatibility with common 3.3 V system domains and tolerance for voltage variations.
• Industrial Temperature Capability: −40 °C to 85 °C rating supports deployment in harsh and outdoor environments.
• Compact BGA Packaging: 67-ball BGA surface-mount package enables space-efficient board integration with robust soldered connections.
• Standards-Compliant: JEDEC qualification and RoHS compliance simplify regulatory considerations for industrial product designs.

Why Choose F59L4G161KA-25BCIG2R?

The F59L4G161KA-25BCIG2R positions itself as a rugged, JEDEC-qualified SLC NAND Flash option for industrial embedded designs that require reliable non-volatile storage with predictable timing. Its 256M × 16 organization, parallel x16 interface and compact 67-BGA package make it straightforward to integrate into board-level systems that prioritize space and deterministic memory behavior.

Manufactured by ESMT as part of the F59L4G161KA series, this device is suited to engineers and procurement teams developing industrial equipment, data logging solutions, and embedded controllers where defined electrical, thermal and packaging specifications are required.

Request a quote today to evaluate the F59L4G161KA-25BCIG2R for your next industrial storage design. Submit a quote request or contact sales to receive pricing and availability information.