F59L2G81XA-25TIG2B

The F59L2G81XA-25TIG2B is a 2 Gbit single-level cell (SLC) NAND flash memory organized as 256M × 8. Designed for industrial applications, it delivers a parallel 8-bit asynchronous interface in a compact 48-pin TSOPI surface-mount package and operates from a 2.7 V to 3.6 V supply.

With JEDEC qualification and a wide operating temperature range of −40 °C to +85 °C, this device targets embedded systems and industrial storage where endurance, data retention and a standardized NAND interface are required.

Key Features

• Memory Organization 2.147 Gbit device organized as 256M × 8 with 2 planes × 1,024 blocks per plane and a device total of 2,048 blocks.
• Page and Block Geometry 2,176-byte page format (2,048 bytes + 128 bytes) and 64 pages per block (128 KB + 8 KB per block).
• Performance Asynchronous I/O with typical array timing: read page ~25 µs, program page ~200 µs (typical), and erase block ~2 ms (typical). Order code denotes 25 ns timing grade for command/address cycle timing.
• Interface and Protocol Standard 8-bit multiplexed parallel interface with control signals CE#, CLE, ALE, WE#, RE#, and hardware status via R/B#. ONFI 1.0-compliant command set and asynchronous NAND protocol.
• Reliability and Endurance Designed for long-term data retention (JESD47G-compliant) and rated for 100,000 program/erase cycles with uncycled data retention of 10 years.
• Advanced Command and Data Management Supports program page cache mode, read page cache mode, permanent block locking (blocks 47:0), one-time programmable (OTP) mode, read unique ID, and internal data move within a plane.
• System Integration and Control Ready/Busy# (R/B#) and operation status byte provide hardware and software methods to detect operation completion and write-protect status; RESET (FFh) required after power-on.
• Power and Packaging 3.3 V nominal operation (2.7 V to 3.6 V range) in a surface-mount 48-pin TSOPI (TSOPI-48) package suitable for board-level flash implementations.
• Industrial Grade Operating temperature range of −40 °C to +85 °C and RoHS compliance for industrial deployments.

Typical Applications

• Industrial Automation Reliable non-volatile storage for configuration, logging and firmware in controllers and PLCs across wide temperature ranges.
• Embedded Storage On-board code and data storage for embedded systems that require SLC endurance and extended data retention.
• Networking and Communications Equipment Firmware and parameter storage in industrial networking devices where standardized NAND interfaces and hardware status signals simplify integration.
• Test & Measurement Instruments Non-volatile data and firmware storage for instrumentation that demands durable program/erase cycles and JEDEC-qualified memory behavior.

Unique Advantages

• High Endurance: 100,000 program/erase cycles support frequent updates and long lifecycle operation in fielded equipment.
• Long-Term Data Retention: JESD47G-compliant retention and 10-year uncycled retention provide confidence for archived data and firmware.
• Standardized ONFI Interface: ONFI 1.0 compliance and an 8-bit multiplexed bus enable straightforward integration with existing NAND controllers and legacy designs.
• Industrial Temperature Range: −40 °C to +85 °C rating ensures operation in harsh environments common to industrial and infrastructure applications.
• Flexible System Control: Hardware signals (R/B#, WP#) and an operation status byte allow both hardware and software-level monitoring of device operations.
• Compact Board-Level Package: TSOPI-48 surface-mount package offers a low pin-count footprint while maintaining a consistent pinout across densities for future upgrades.
• Regulatory and Environmental Compliance: JEDEC qualification and RoHS compliance support regulatory and manufacturing requirements.

Why Choose F59L2G81XA-25TIG2B?

The F59L2G81XA-25TIG2B combines SLC NAND robustness with an ONFI-compliant parallel interface, making it a strong choice for industrial embedded designs that require durable non-volatile storage, predictable program/erase endurance and long data retention. Its 2 Gbit capacity, standardized command set and compact TSOPI-48 package simplify BOM and enable straightforward integration into board-level storage solutions.

This device is suited to designers and OEMs building industrial controllers, embedded systems and infrastructure equipment who need memory that balances endurance, thermal range and interface compatibility backed by JEDEC qualification and RoHS compliance.

Request a quote or submit an RFQ to check availability, lead times and pricing for the F59L2G81XA-25TIG2B. Our team can provide ordering details and assistance for your design requirements.