F59L2G81XA-25BCIG2B
| Part Description |
SLC NAND Flash, 2Gbit, (256Mx8), 3.3V, x8, 25ns, 67-ball BGA, Industrial |
|---|---|
| Quantity | 1,234 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | BGA-67 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 2 Gbit | Access Time | 20 ns | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C – 85°C | Write Cycle Time Word Page | 200 µs | Packaging | 67-BGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 256M x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59L2G81XA-25BCIG2B – SLC NAND Flash, 2Gbit, (256Mx8), 3.3V, x8, 25ns, 67-ball BGA, Industrial
The F59L2G81XA-25BCIG2B is a 2 Gbit single-level cell (SLC) NAND Flash memory device organized as 256M × 8. It provides an asynchronous parallel NAND interface with ONFI 1.0 compatibility and is offered in a 67-ball BGA package for surface-mount applications.
Designed for industrial applications, this device supports a 2.7 V–3.6 V supply range and an operating temperature range of −40 °C to 85 °C, delivering SLC endurance and retention characteristics suitable for embedded storage and industrial memory use cases requiring robust program/erase cycling and long-term data retention.
Key Features
- Memory Organization 2.147 Gbit capacity (256M × 8) with a device structure of 2,048 blocks and two planes of 1,024 blocks each.
- Page & Block Architecture Page size of 2,176 bytes (2,048 + 128 spare) and a block size of 64 pages (128K + 8K bytes spare) for typical NAND page/block management.
- SLC NAND Technology Single-level cell architecture providing high endurance and data retention characteristics compared with multi-level cell alternatives.
- Performance Asynchronous I/O timing (1/RC/3/RC) at 25 ns and page-level operations with typical read-page latency of 25 µs, typical program-page time of 200 µs, and typical erase-block time of 2 ms.
- Interface & Control 8-bit multiplexed I/O bus with standard NAND control signals (CE#, CLE, ALE, WE#, RE#), Ready/Busy# (R/B#), and hardware write-protect (WP#).
- Advanced Command & Management ONFI 1.0-compliant command set with support for program page cache mode, read page cache mode, internal data move within a plane, read unique ID, permanent block locking and one-time programmable (OTP) mode.
- Reliability & Endurance JESD47G-compliant data retention, rated endurance of 100,000 program/erase cycles, and uncycled data retention of 10 years.
- Power & Packaging Operates from 2.7 V to 3.6 V, available in a 67-ball BGA (BGA-67) surface-mount package optimized for compact board layouts; JEDEC-qualified and RoHS compliant.
- Industrial Temperature Grade Specified for operation across −40 °C to +85 °C for deployment in industrial environments.
Typical Applications
- Industrial Embedded Storage Non-volatile program and data storage in industrial controllers and embedded systems that require extended temperature operation and SLC endurance.
- Data Logging & Measurement Equipment Reliable long-term data retention and high P/E endurance make this device suitable for logging sensor data and measurements in demanding environments.
- Communications & Networking Modules Parallel NAND interface and page/block performance support firmware and data storage needs in networking modules and infrastructure equipment.
- Factory Automation & Instrumentation Industrial-grade temperature range and JEDEC qualification support deployment in factory automation, test, and instrumentation systems.
Unique Advantages
- SLC Endurance 100,000 program/erase cycles provide high write endurance for applications with frequent updates.
- ONFI-Compatible Asynchronous Interface Standardized parallel NAND interface simplifies integration with controllers supporting ONFI 1.0 protocols.
- Flexible Block & Page Management Large page (2,048 + 128 spare) and block architecture (64 pages) enable efficient storage management and ECC strategies.
- Industrial Reliability JEDEC qualification, JESD47G-compliant data retention, and −40 °C to +85 °C operating range align with industrial deployment requirements.
- Hardware Protection & Control Support for WP#, permanent block locking, OTP mode, and operation status reporting (status byte and R/B#) improves data integrity and secure storage control.
- Compact Surface-Mount Package BGA-67 package enables high-density board designs while maintaining a standard low-pin-count NAND footprint for future upgrades.
Why Choose F59L2G81XA-25BCIG2B?
The F59L2G81XA-25BCIG2B combines SLC NAND reliability with an ONFI-compatible asynchronous parallel interface, making it a practical choice for industrial embedded storage applications that demand endurance, data retention, and extended temperature operation. Its page/block architecture and support for advanced command modes provide the flexibility needed for robust firmware and data management strategies.
Engineers designing industrial systems will find this device well suited for compact, surface-mount implementations that require JEDEC-qualified components, programmable protection features, and proven SLC endurance characteristics for long-term field operation.
Request a quote or submit an inquiry to learn more about availability, lead times, and volume pricing for the F59L2G81XA-25BCIG2B.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
Certifications and Memberships: N/A