F59L2G81KA-25TG2N

The F59L2G81KA-25TG2N is a 2.147 Gbit single-level cell (SLC) NAND flash memory organized as 256M x 8 with a parallel x8 interface. It operates from 2.7 V to 3.6 V and is provided in a 48-pin TSOPI surface-mount package for compact board-level integration.

Designed for high-density non-volatile storage, the device targets applications that require robust program/erase endurance, on-board page and block management, and support for boot and automatic memory download functions. The device combines fast read/write primitives and hardware protections to support embedded storage tasks in commercial temperature environments.

Key Features

• Memory Architecture  Organized as 256M × 8 (2.147 Gbit) with a page size of (2K + 128) bytes and block size of 64 pages (128K + 8K bytes).
• SLC NAND Technology  Single-level cell architecture with ECC requirement of 8-bit per 512 bytes and endurance rated for 50K program/erase cycles.
• Performance  Access time listed as 20 ns with datasheet read-cycle detail of 25 ns and random read specified at 25 µs (max). Typical page program time is 400 µs (typ.) with a 700 µs maximum.
• Command and Data Handling  Command/address/data are multiplexed on the DQ port; features include cache program/read, copy-back, two-plane operation, and automatic program/erase execution.
• Power Supply  Operates from Vcc = 3.3 V with an allowable range of 2.7 V to 3.6 V for flexible system power designs.
• Package and Mounting  Available in a 48-pin TSOPI (TSOPI-48) surface-mount package (12 mm × 20 mm body, 0.5 mm pin pitch) suitable for dense PCB layouts.
• Reliability and Retention  Uncycled data retention specified at 10 years (real time use at 55 °C) and program/erase protections including lockout during power transitions.
• Commercial Temperature Grade  Operating temperature range is 0 °C to 70 °C for commercial applications.

Typical Applications

• Solid-State File Storage  High-density non-volatile storage for embedded file systems and removable media implementations that require SLC endurance and retention.
• Voice Recording Systems  Reliable page and block operations with automatic program/erase support for voice data capture and playback storage.
• Still Camera Image Memory  Large page and block organization suited to image file storage for still cameras and similar imaging devices.
• Boot and System Download  Supports boot-from-NAND and automatic memory download features for system boot code and firmware storage.

Unique Advantages

• High Endurance  50K program/erase cycles provide durability for repeated update and log-intensive applications.
• Large, Well-Defined Block/Page Structure  (2K + 128)-byte pages and 64-page blocks simplify partitioning and wear-leveling strategies in firmware.
• Fast Typical Program Times  Page program typical time of 400 µs helps reduce write latency for bulk data transfers and streaming writes.
• Robust Data Retention  Uncycled data retention of 10 years at 55 °C supports long-term archival use within the specified commercial temperature range.
• Flexible Power Range  2.7 V–3.6 V supply range enables use across common 3.3 V system rails and variations.
• Compact, Surface-Mount Package  TSOPI-48 package delivers a small footprint for board space–constrained designs without sacrificing I/O accessibility.

Why Choose F59L2G81KA-25TG2N?

The F59L2G81KA-25TG2N positions itself as a high-density SLC NAND Flash option for commercial embedded storage needs that demand strong endurance, predictable retention, and practical program/erase performance. Its parallel x8 interface and compact TSOPI-48 package make it suitable for firmware, image, and data-logging roles where board space and reliable non-volatile storage are priorities.

With explicit support for boot-from-NAND and automatic memory download, plus on-die protections and ECC guidance, this device is well suited to system designers seeking a stable, well-specified SLC NAND option for medium- to high-duty storage applications in the commercial temperature range.

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