F59L2G81XA-25BCG2B

2Gb NAND Flash
Part Description

SLC NAND Flash, 2Gbit, 3.3V, x8, 25ns, 67-ball BGA

Quantity 617 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageBGA-67Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size2 GbitAccess Time20 nsGradeCommercial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C – 70°CWrite Cycle Time Word Page200 µsPackaging67-BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization256M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of F59L2G81XA-25BCG2B – SLC NAND Flash, 2Gbit, 3.3V, x8, 25ns, 67-ball BGA

The F59L2G81XA-25BCG2B is a 2 Gbit (256M x 8) single-level cell (SLC) NAND flash memory device optimized for commercial embedded storage. It implements a parallel, highly multiplexed 8-bit asynchronous interface and is ONFI 1.0-compliant for standardized NAND Flash communication.

This device delivers a balance of performance and endurance for commercial applications, offering fast access characteristics, program/erase performance, and a compact 67-ball BGA surface-mount package for space-constrained designs.

Key Features

  • Memory Architecture 2.147 Gbit device organized as 256M × 8 with a page size of 2,176 bytes (2,048 + 128 spare) and a block size of 64 pages (128K + 8K bytes).
  • Performance Asynchronous I/O performance includes 1/RC/3/RC timing at 25 ns and a specified access time of 20 ns; read-page time is 25 μs and typical program-page time is 200 μs.
  • Endurance & Retention Designed for durability with 100,000 program/erase cycles (endurance) and an uncycled data retention of 10 years, per the datasheet quality and reliability statements.
  • Interface & Command Set Parallel 8-bit I/O with standard control signals (CE#, CLE, ALE, WE#, RE#, R/B#) and support for the ONFI NAND Flash Protocol, including advanced command set features like page-cache modes and two-plane commands.
  • Device Management Features Includes permanent block locking (blocks 47:0), one-time programmable (OTP) mode, read unique ID, block lock, internal data move within a plane, operation status byte, and hardware Ready/Busy# signaling; RESET (FFh) is required after power-on.
  • Power & Package Single-supply operation from 2.7 V to 3.6 V and a compact 67-ball BGA (surface-mount) package for PCB space efficiency.
  • Operating Conditions Commercial-grade operating temperature range of 0 °C to +70 °C and RoHS-compliant construction.

Typical Applications

  • Commercial Embedded Systems Non-volatile program and data storage in commercial electronics where SLC endurance and retention are required.
  • Storage & Boot Memory Code storage and boot media for systems that benefit from a parallel 8-bit NAND interface and compact BGA packaging.
  • Firmware and Data Logging Reliable program/erase cycling and OTP capabilities make the device suitable for firmware storage and controlled data logging in commercial environments.

Unique Advantages

  • SLC Endurance: 100,000 program/erase cycles provide robust lifecycle characteristics for frequent-write commercial applications.
  • Long-Term Data Retention: Uncycled data retention specified at 10 years supports long-life product designs and archival needs.
  • ONFI Compatibility: ONFI 1.0 compliance standardizes the interface and eases integration with ONFI-capable controllers.
  • Advanced Device Controls: Features such as OTP mode, programmable drive strength, permanent block locking, and operation status byte enable flexible device management and secure data handling.
  • Compact, PCB-Friendly Package: 67-ball BGA surface-mount package minimizes board area while providing a consistent pinout for density upgrades without board redesign.
  • Wide Supply Range: 2.7 V to 3.6 V operation accommodates common commercial power rails for straightforward system integration.

Why Choose F59L2G81XA-25BCG2B?

The F59L2G81XA-25BCG2B positions itself as a reliable SLC NAND Flash option for commercial embedded applications where endurance, retention, and standardized interfacing matter. Its combination of documented program/read/erase timings, ONFI 1.0 compliance, and device-management features supports robust firmware and data storage implementations.

Designers building commercial products that require field-proven endurance, predictable retention, and a compact BGA footprint will find this device suitable for scaling to higher densities while preserving board-level compatibility.

Request a quote or submit an inquiry to receive pricing and availability for the F59L2G81XA-25BCG2B.

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