F59L2G81XA-25BCG2B
| Part Description |
SLC NAND Flash, 2Gbit, 3.3V, x8, 25ns, 67-ball BGA |
|---|---|
| Quantity | 617 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | BGA-67 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 2 Gbit | Access Time | 20 ns | Grade | Commercial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C – 70°C | Write Cycle Time Word Page | 200 µs | Packaging | 67-BGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 256M x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59L2G81XA-25BCG2B – SLC NAND Flash, 2Gbit, 3.3V, x8, 25ns, 67-ball BGA
The F59L2G81XA-25BCG2B is a 2 Gbit (256M x 8) single-level cell (SLC) NAND flash memory device optimized for commercial embedded storage. It implements a parallel, highly multiplexed 8-bit asynchronous interface and is ONFI 1.0-compliant for standardized NAND Flash communication.
This device delivers a balance of performance and endurance for commercial applications, offering fast access characteristics, program/erase performance, and a compact 67-ball BGA surface-mount package for space-constrained designs.
Key Features
- Memory Architecture 2.147 Gbit device organized as 256M × 8 with a page size of 2,176 bytes (2,048 + 128 spare) and a block size of 64 pages (128K + 8K bytes).
- Performance Asynchronous I/O performance includes 1/RC/3/RC timing at 25 ns and a specified access time of 20 ns; read-page time is 25 μs and typical program-page time is 200 μs.
- Endurance & Retention Designed for durability with 100,000 program/erase cycles (endurance) and an uncycled data retention of 10 years, per the datasheet quality and reliability statements.
- Interface & Command Set Parallel 8-bit I/O with standard control signals (CE#, CLE, ALE, WE#, RE#, R/B#) and support for the ONFI NAND Flash Protocol, including advanced command set features like page-cache modes and two-plane commands.
- Device Management Features Includes permanent block locking (blocks 47:0), one-time programmable (OTP) mode, read unique ID, block lock, internal data move within a plane, operation status byte, and hardware Ready/Busy# signaling; RESET (FFh) is required after power-on.
- Power & Package Single-supply operation from 2.7 V to 3.6 V and a compact 67-ball BGA (surface-mount) package for PCB space efficiency.
- Operating Conditions Commercial-grade operating temperature range of 0 °C to +70 °C and RoHS-compliant construction.
Typical Applications
- Commercial Embedded Systems Non-volatile program and data storage in commercial electronics where SLC endurance and retention are required.
- Storage & Boot Memory Code storage and boot media for systems that benefit from a parallel 8-bit NAND interface and compact BGA packaging.
- Firmware and Data Logging Reliable program/erase cycling and OTP capabilities make the device suitable for firmware storage and controlled data logging in commercial environments.
Unique Advantages
- SLC Endurance: 100,000 program/erase cycles provide robust lifecycle characteristics for frequent-write commercial applications.
- Long-Term Data Retention: Uncycled data retention specified at 10 years supports long-life product designs and archival needs.
- ONFI Compatibility: ONFI 1.0 compliance standardizes the interface and eases integration with ONFI-capable controllers.
- Advanced Device Controls: Features such as OTP mode, programmable drive strength, permanent block locking, and operation status byte enable flexible device management and secure data handling.
- Compact, PCB-Friendly Package: 67-ball BGA surface-mount package minimizes board area while providing a consistent pinout for density upgrades without board redesign.
- Wide Supply Range: 2.7 V to 3.6 V operation accommodates common commercial power rails for straightforward system integration.
Why Choose F59L2G81XA-25BCG2B?
The F59L2G81XA-25BCG2B positions itself as a reliable SLC NAND Flash option for commercial embedded applications where endurance, retention, and standardized interfacing matter. Its combination of documented program/read/erase timings, ONFI 1.0 compliance, and device-management features supports robust firmware and data storage implementations.
Designers building commercial products that require field-proven endurance, predictable retention, and a compact BGA footprint will find this device suitable for scaling to higher densities while preserving board-level compatibility.
Request a quote or submit an inquiry to receive pricing and availability for the F59L2G81XA-25BCG2B.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
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