F59L2G81XA-25BIG2B

The F59L2G81XA-25BIG2B is a 2 Gbit single-level cell (SLC) NAND Flash memory device organized as 256M × 8. It implements a parallel, highly multiplexed 8-bit I/O interface and supports ONFI 1.0 protocol for interoperable NAND Flash operation.

Designed for industrial-grade embedded storage, the device delivers fast asynchronous I/O performance with JEDEC qualification and an operating temperature range of −40°C to +85°C, making it suitable for robust firmware, code storage, and data-logging applications requiring long retention and high endurance.

Key Features

• Memory & Architecture — 2.147 Gbit capacity organized as 256M × 8 with SLC NAND technology; device array includes 2 planes × 1,024 blocks per plane and 2,048 blocks total.
• Page & Block Organization — 2,176-byte page size (2,048 + 128 spare); block size of 64 pages (128K + 8K bytes) for predictable program/erase management.
• Performance — Asynchronous I/O performance with listed access time of 20 ns and array 1/RC/3/RC timing at 25 ns; typical read page time 25 µs and typical program page time 200 µs.
• Erase & Endurance — Typical block erase time 2 ms and endurance rated to 100,000 program/erase cycles, supporting long-term write-intensive use.
• Data Retention & Reliability — Uncycled data retention specified at 10 years and JESD47G-compliant data retention guidance; supports internal status reporting and ready/busy hardware signaling.
• Interface & Command Set — Parallel 8-bit I/O with ONFI 1.0-compliant command protocol; supports advanced commands including cached program/read modes, OTP mode, two-plane commands (with ECC off), read unique ID, and block locking.
• Power & Signal — Supply voltage range 2.7 V to 3.6 V with standard NAND control signals (CE#, CLE, ALE, WE#, RE#, R/B#, WP#).
• Package & Mounting — Surface-mount 63-ball BGA (BGA-63) package for compact board integration.
• Industrial Grade & Qualification — Industrial operating temperature −40°C to +85°C and JEDEC qualification.
• Protection & Device Control — Permanent block locking (blocks 47:0), device-level write protect (WP#), and RESET (FFh) required after power-on for known startup state.

Typical Applications

• Industrial Embedded Storage — Reliable non-volatile SLC storage for controllers and embedded systems operating across −40°C to +85°C.
• Firmware and Boot Code — Durable program/erase endurance and OTP/block-lock features make the device suitable for firmware, boot images, and protected code storage.
• Data Logging and Event Storage — High endurance and 10-year uncycled retention support long-term logging or configuration storage in industrial devices.

Unique Advantages

• Single-Level Cell Reliability: SLC NAND technology provides enhanced endurance and retention compared to multi-level alternatives, supporting intensive write cycles.
• Fast Asynchronous I/O: 20 ns access time and 1/RC/3/RC 25 ns timing enable low-latency transfers for performance-sensitive read/write operations.
• Robust Endurance and Retention: 100,000 program/erase cycles and 10-year uncycled data retention for long service life in fielded products.
• Industrial Temperature Range: Rated for −40°C to +85°C to meet the thermal demands of harsh operating environments.
• ONFI 1.0 Compatibility: Standardized ONFI protocol support eases integration with controllers and tooling that support the ONFI specification.
• Compact Surface-Mount Package: BGA-63 package minimizes PCB footprint while supporting standard surface-mount assembly processes.

Why Choose F59L2G81XA-25BIG2B?

The F59L2G81XA-25BIG2B combines SLC NAND endurance and retention with fast asynchronous I/O and an ONFI-compliant parallel interface, packaged in a compact 63-ball BGA for industrial systems. JEDEC qualification, extensive command support, and hardware write-protect and status signals provide predictable behavior and integration options for embedded designers.

This device is well suited for designers and procurement teams specifying robust non-volatile memory for industrial controllers, firmware storage, and data-logging equipment where endurance, retention, and temperature resilience are primary requirements.

Request a quote or submit a procurement inquiry for F59L2G81XA-25BIG2B to check pricing and availability and to receive technical ordering information.