F59L2G81KA-25TIAG2N

2Gb NAND Flash Auto.
Part Description

SLC NAND Flash, 2Gbit (256M x 8), Automotive

Quantity 428 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageTSOPI-48Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size2 GbitAccess Time20 nsGradeAutomotive
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C – 105°CWrite Cycle Time Word Page400 µsPackaging48-TSOPI
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization256M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationAEC-Q100ECCNEAR99HTS Code8542.32.00.71

Overview of F59L2G81KA-25TIAG2N – SLC NAND Flash, 2Gbit (256M x 8), Automotive

The F59L2G81KA-25TIAG2N is a 2.147 Gbit single-level cell (SLC) NAND flash device organized as 256M × 8. It provides parallel x8 command/address/data multiplexing and is designed for robust non-volatile storage in embedded and automotive applications.

With a 3.3 V supply range (2.7 V to 3.6 V), AEC-Q100 qualification, and a wide operating temperature range, this device targets applications that require durable, high-reliability flash memory with built-in program/erase management and fast cache operations.

Key Features

  • Memory Core 2.147 Gbit SLC NAND organized as 256M × 8 with one-bit-per-cell architecture and two 2176-byte static registers for page transfers.
  • Page & Block Architecture Page size: (2K + 128) bytes; Block size: 64 pages = (128K + 8K) bytes; Number of blocks per die (LUN): 2048.
  • Performance 25 ns speed grade (part suffix “-25”); cache read and cache program operations plus copy-back and two-plane operation for improved throughput.
  • Program / Erase Timing Typical page program time: 400 µs (700 µs max); typical block erase time: 3 ms (10 ms max).
  • Endurance & Retention Endurance rated to 50K program/erase cycles; uncycled data retention specified as 10 years at 55°C.
  • Reliability & Data Integrity ECC requirement 8-bit per 512 bytes; hardware data protection and program/erase lockout during power transitions reduce risk during critical operations.
  • Power & Interface VCC range 2.7 V to 3.6 V; parallel DQ port for command/address/data multiplexing and standard NAND control signaling (CLE/ALE/WE#/RE#/CE#/R/B#).
  • Package & Temperature 48-pin TSOPI package (12 mm × 20 mm body, 0.5 mm pitch) and an operating temperature range of −40°C to 105°C.
  • Automotive Qualification & Compliance AEC-Q100 qualification and RoHS compliance for automotive and regulated-environment use.

Typical Applications

  • Automotive infotainment and data logging — Non-volatile storage for firmware, media files and event data where AEC-Q100 qualification and wide temperature operation are required.
  • Solid-state file storage — High-density SLC storage for systems that require reliable page/block management and long data retention.
  • Imaging and voice recording devices — Page-based programming and cache read/program features support storage of image files and audio data with predictable program/erase timing.
  • Boot and system download — Built-in automatic Page 0 read at power-up and boot-from-NAND support for embedded systems requiring reliable startup.

Unique Advantages

  • SLC Endurance — 50K program/erase cycles provide durability for frequent write/update scenarios compared with multi-level cell alternatives.
  • Long-Term Data Retention — Specified 10-year uncycled retention at 55°C supports archival and long-life storage requirements.
  • Automotive-Ready — AEC-Q100 qualification and −40°C to 105°C operation make the device suitable for automotive-grade embedded designs.
  • Integrated Data Protection — Hardware protections and program/erase lockout during power transitions reduce risk of data corruption during power events.
  • Flexible Performance Modes — Cache program/read, copy-back and two-plane operations enable designers to tune throughput and latency for specific workloads.
  • Compact, Surface-Mount Package — TSOPI-48 package provides a compact footprint for space-constrained PCBs while maintaining a parallel x8 interface.

Why Choose F59L2G81KA-25TIAG2N?

The F59L2G81KA-25TIAG2N combines SLC NAND endurance and retention with automotive-grade qualification and a robust set of NAND features (cache operations, copy-back, two-plane operation, and hardware protection). It is tailored for embedded designs that need dependable, long-lived non-volatile storage across a wide temperature range and in safety-conscious automotive environments.

This device is well suited to designers building infotainment, telematics, imaging, data-logging, and boot-storage systems that require predictable program/erase performance, ECC-managed reliability, and a compact TSOPI surface-mount package.

Request a quote or submit an inquiry to get pricing, availability, and lead-time information for F59L2G81KA-25TIAG2N.

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