F59L2G81KA-25TIAG2N
| Part Description |
SLC NAND Flash, 2Gbit (256M x 8), Automotive |
|---|---|
| Quantity | 428 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | TSOPI-48 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 2 Gbit | Access Time | 20 ns | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C – 105°C | Write Cycle Time Word Page | 400 µs | Packaging | 48-TSOPI | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 256M x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | AEC-Q100 | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59L2G81KA-25TIAG2N – SLC NAND Flash, 2Gbit (256M x 8), Automotive
The F59L2G81KA-25TIAG2N is a 2.147 Gbit single-level cell (SLC) NAND flash device organized as 256M × 8. It provides parallel x8 command/address/data multiplexing and is designed for robust non-volatile storage in embedded and automotive applications.
With a 3.3 V supply range (2.7 V to 3.6 V), AEC-Q100 qualification, and a wide operating temperature range, this device targets applications that require durable, high-reliability flash memory with built-in program/erase management and fast cache operations.
Key Features
- Memory Core 2.147 Gbit SLC NAND organized as 256M × 8 with one-bit-per-cell architecture and two 2176-byte static registers for page transfers.
- Page & Block Architecture Page size: (2K + 128) bytes; Block size: 64 pages = (128K + 8K) bytes; Number of blocks per die (LUN): 2048.
- Performance 25 ns speed grade (part suffix “-25”); cache read and cache program operations plus copy-back and two-plane operation for improved throughput.
- Program / Erase Timing Typical page program time: 400 µs (700 µs max); typical block erase time: 3 ms (10 ms max).
- Endurance & Retention Endurance rated to 50K program/erase cycles; uncycled data retention specified as 10 years at 55°C.
- Reliability & Data Integrity ECC requirement 8-bit per 512 bytes; hardware data protection and program/erase lockout during power transitions reduce risk during critical operations.
- Power & Interface VCC range 2.7 V to 3.6 V; parallel DQ port for command/address/data multiplexing and standard NAND control signaling (CLE/ALE/WE#/RE#/CE#/R/B#).
- Package & Temperature 48-pin TSOPI package (12 mm × 20 mm body, 0.5 mm pitch) and an operating temperature range of −40°C to 105°C.
- Automotive Qualification & Compliance AEC-Q100 qualification and RoHS compliance for automotive and regulated-environment use.
Typical Applications
- Automotive infotainment and data logging — Non-volatile storage for firmware, media files and event data where AEC-Q100 qualification and wide temperature operation are required.
- Solid-state file storage — High-density SLC storage for systems that require reliable page/block management and long data retention.
- Imaging and voice recording devices — Page-based programming and cache read/program features support storage of image files and audio data with predictable program/erase timing.
- Boot and system download — Built-in automatic Page 0 read at power-up and boot-from-NAND support for embedded systems requiring reliable startup.
Unique Advantages
- SLC Endurance — 50K program/erase cycles provide durability for frequent write/update scenarios compared with multi-level cell alternatives.
- Long-Term Data Retention — Specified 10-year uncycled retention at 55°C supports archival and long-life storage requirements.
- Automotive-Ready — AEC-Q100 qualification and −40°C to 105°C operation make the device suitable for automotive-grade embedded designs.
- Integrated Data Protection — Hardware protections and program/erase lockout during power transitions reduce risk of data corruption during power events.
- Flexible Performance Modes — Cache program/read, copy-back and two-plane operations enable designers to tune throughput and latency for specific workloads.
- Compact, Surface-Mount Package — TSOPI-48 package provides a compact footprint for space-constrained PCBs while maintaining a parallel x8 interface.
Why Choose F59L2G81KA-25TIAG2N?
The F59L2G81KA-25TIAG2N combines SLC NAND endurance and retention with automotive-grade qualification and a robust set of NAND features (cache operations, copy-back, two-plane operation, and hardware protection). It is tailored for embedded designs that need dependable, long-lived non-volatile storage across a wide temperature range and in safety-conscious automotive environments.
This device is well suited to designers building infotainment, telematics, imaging, data-logging, and boot-storage systems that require predictable program/erase performance, ECC-managed reliability, and a compact TSOPI surface-mount package.
Request a quote or submit an inquiry to get pricing, availability, and lead-time information for F59L2G81KA-25TIAG2N.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
Certifications and Memberships: N/A