F59L2G81KA-25BIAG2N
| Part Description |
2 Gbit SLC NAND Flash, 256M x 8, 3.3V, 25 ns, 63-ball BGA, Automotive |
|---|---|
| Quantity | 1,297 Available (as of May 6, 2026) |
Specifications & Environmental
| Device Package | BGA-63 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 2 Gbit | Access Time | 20 ns | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C – 105°C | Write Cycle Time Word Page | 400 µs | Packaging | 63-BGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 256M x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | AEC-Q100 | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59L2G81KA-25BIAG2N – 2 Gbit SLC NAND Flash, 256M x 8, 3.3V, 25 ns, 63-ball BGA, Automotive
The F59L2G81KA-25BIAG2N is a 2 Gbit (256M × 8) single-level cell (SLC) NAND flash memory device optimized for high-reliability non-volatile storage. It implements a parallel, command/address/data-multiplexed DQ interface and is designed for embedded storage applications that require robust program/erase endurance and long data retention.
Targeted at automotive and other demanding environments, this device combines 3.3 V (2.7 V–3.6 V) operation, AEC‑Q100 qualification, and an extended operating temperature range of −40 °C to 105 °C to support in-vehicle and industrial designs.
Key Features
- Memory Architecture — 2.147 Gbit organized as 256M × 8 with 1 bit per cell SLC architecture; page size of 2K + 128 bytes and block size of 64 pages (128K + 8K bytes).
- Performance — Read cycle 25 ns with random read latency reported; page program typical 400 μs (700 μs max); block erase typical 3 ms (10 ms max), enabling deterministic program/erase timing for storage workflows.
- Endurance & Retention — Endurance rated at 50K program/erase cycles and uncycled data retention of 10 years at 55 °C as specified for reliability-sensitive applications.
- Data Integrity — ECC requirement of 8-bit per 512-byte provides guidance for host error correction to maintain data integrity across the device lifetime.
- Interface & Operations — Parallel DQ port with command/address/data multiplexing; supports cache program/read, copy-back, two-plane operations, EDO mode and automatic page‑0 read at power-up for boot support and high-throughput transfers.
- Power & Protection — Operates from 2.7 V to 3.6 V and includes hardware data protection features such as program/erase lockout during power transitions and automatic program/erase execution.
- Package & Temperature — Supplied in a 63-ball BGA (9 mm × 11 mm body, 0.8 mm ball pitch) surface-mount package and specified for −40 °C to 105 °C operation.
- Automotive Qualification — AEC‑Q100 qualified and offered in an automotive-grade variant appropriate for vehicle electronics use.
Typical Applications
- Solid‑State File Storage — High-density SLC storage for embedded file systems where endurance and retention are critical.
- Imaging and Voice Recording — Image file and voice data storage for cameras, recorders and infotainment modules that require predictable program/erase timing.
- Automotive Embedded Systems — Boot and application storage in automotive ECUs and infotainment systems, leveraging AEC‑Q100 qualification and extended temperature range.
- Industrial Data Logging — Non-volatile storage for industrial controllers and dataloggers that demand robust endurance and long-term data retention.
Unique Advantages
- High Endurance: 50K program/erase cycles specified to support heavy write workloads and extended product life.
- Long-Term Data Retention: 10 years of uncycled data retention at 55 °C provides confidence for archival and infrequently-updated storage.
- Automotive-Grade Qualification: AEC‑Q100 qualification and −40 °C to 105 °C operating range enable deployment in vehicle electronics and harsh environments.
- Deterministic Program/Erase Timing: Typical page program time of 400 μs and typical block erase time of 3 ms help designers budget worst-case latencies.
- Compact BGA Package: 63-ball BGA (9 mm × 11 mm) delivers high density in a compact surface-mount footprint for space-constrained PCBs.
- Flexible Operation Modes: Cache program/read, two-plane and copy-back operations increase throughput options for system-level performance tuning.
Why Choose F59L2G81KA-25BIAG2N?
The F59L2G81KA-25BIAG2N positions itself as a robust, automotive-grade SLC NAND flash device combining endurance, long-term retention and a compact BGA footprint. Its specified program/erase characteristics, ECC guidance and AEC‑Q100 qualification make it suitable for embedded storage roles in automotive, industrial and imaging applications where reliability and predictable behavior matter.
This device is suited for engineers designing systems that require a balance of high endurance, controlled latency and wide operating voltage and temperature ranges, delivering long-term value through durability and proven flash features documented in the device specification.
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