IS21EF04GP-BCLI-TR

4GB, 153 BALL FBGA, 3.3V, BOOT P
Part Description

4GB, 153 BALL FBGA, 3.3V, BOOT P

Quantity 482 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package153-VFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (pSLC)
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization4G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNN/AHTS CodeN/A

Overview of IS21EF04GP-BCLI-TR - 4GB Pseudo-SLC NAND Flash eMMC Module

The IS21EF04GP-BCLI-TR is a 4-gigabyte embedded MultiMediaCard (eMMC) memory module featuring pseudo-SLC NAND flash technology from ISSI. Organized as 4G x 8-bit with an eMMC 5.1 interface, this module delivers reliable storage performance for embedded systems requiring robust data retention and extended temperature operation. Operating from -40°C to 85°C, this industrial-grade flash memory provides a compact, high-density storage solution for applications where endurance and environmental tolerance are essential.

Key Features

  • 4GB Pseudo-SLC NAND Flash - 32 Gbit capacity organized as 4G x 8-bit architecture delivers higher endurance and reliability compared to traditional MLC or TLC NAND, making it suitable for write-intensive embedded applications.
  • eMMC 5.1 Interface - Compliant with the eMMC 5.1 standard, supporting clock frequencies up to 200 MHz for fast data transfer rates while maintaining backward compatibility with legacy eMMC versions.
  • Wide Voltage Range - 2.7V to 3.6V supply voltage provides flexibility for integration into various power supply architectures and enables low-power operation modes.
  • Extended Temperature Range - Operates reliably from -40°C to 85°C ambient temperature, ensuring consistent performance across demanding industrial and automotive-adjacent environments.
  • Compact 153-VFBGA Package - Space-efficient 11.5mm x 13mm very fine-pitch ball grid array package minimizes PCB footprint for space-constrained embedded designs.

Typical Applications

  • Industrial Automation - Provides reliable storage for PLC firmware, HMI operating systems, and data logging in factory automation equipment where the extended temperature range and pseudo-SLC endurance ensure long-term operation in harsh environments.
  • Medical Instrumentation - Serves as embedded storage for diagnostic equipment and patient monitoring systems where data integrity and reliable boot performance are critical for device operation and regulatory compliance.
  • IoT Gateways and Edge Devices - Supports firmware storage and local data caching in edge computing platforms where pseudo-SLC technology provides superior write endurance for frequent data updates and system logging.
  • Point-of-Sale and Payment Terminals - Delivers secure, reliable storage for transaction data and operating system files in payment processing equipment operating across varied environmental conditions.
  • Smart Metering - Provides dependable storage for utility meter firmware and measurement data where extended temperature tolerance and long-term reliability reduce maintenance requirements in field-deployed devices.

Unique Advantages

  • Enhanced Endurance with Pseudo-SLC Technology: Delivers superior write cycle lifetime compared to MLC or TLC NAND, reducing wear-out concerns in write-intensive applications and extending product lifespan.
  • Simplified Design Integration: eMMC interface eliminates the need for external NAND controller design, reducing development complexity, BOM count, and time-to-market for embedded storage solutions.
  • Industrial Temperature Qualification: The -40°C to 85°C operating range enables deployment in demanding environments without requiring additional thermal management or derating.
  • Reliable Boot Performance: Pseudo-SLC technology ensures consistent boot times and reliable system initialization even after extended operation or power cycling.
  • Compact Footprint for Space-Constrained Designs: The 11.5mm x 13mm VFBGA package provides high storage density while minimizing board space, enabling smaller product form factors.
  • Active Lifecycle Status: Current production availability supports long-term product roadmaps and reduces supply chain risks for multi-year deployment cycles.

Why Choose the IS21EF04GP-BCLI-TR?

The IS21EF04GP-BCLI-TR is an ideal storage solution for industrial and embedded systems requiring dependable, high-endurance flash memory with extended temperature operation. Its pseudo-SLC NAND technology provides significantly improved write endurance compared to consumer-grade flash memories, making it well-suited for applications with frequent data updates, boot cycles, or logging requirements. The eMMC 5.1 interface simplifies integration while the industrial temperature range and compact package support deployment in space-constrained, environmentally challenging applications.

For design engineers developing products with multi-year field deployment expectations, this module delivers the reliability and endurance characteristics needed to minimize field failures and warranty costs while maintaining a cost-effective storage solution.

Get a Quote Today

Contact our sales team to discuss your embedded storage requirements and receive pricing for the IS21EF04GP-BCLI-TR. Our technical support staff can assist with integration guidance, endurance calculations, and application-specific recommendations to ensure optimal performance in your design.

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