IS21EF04GP-BCLI

4GB, 153 BALL FBGA, 3.3V, BOOT P
Part Description

4GB, 153 BALL FBGA, 3.3V, BOOT P

Quantity 470 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package153-VFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (pSLC)
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization4G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNN/AHTS CodeN/A

Overview of IS21EF04GP-BCLI - 4GB eMMC 5.1 Flash Memory

The IS21EF04GP-BCLI is a 4GB embedded MultiMediaCard (eMMC) memory device utilizing pseudo-Single-Level Cell (pSLC) NAND flash technology. Designed for embedded applications requiring reliable, high-performance non-volatile storage, this device combines 4GB capacity with eMMC 5.1 interface capabilities and an extended temperature range. Ideal for industrial automation, IoT devices, and embedded computing systems where boot performance and data retention are critical.

Key Features

  • Memory Architecture - 4GB (32Gb) capacity organized as 4G x 8-bit, providing ample storage for firmware, boot code, and application data in embedded systems.
  • pSLC NAND Technology - Pseudo-Single-Level Cell flash offers enhanced endurance and reliability compared to traditional MLC or TLC NAND, extending operational lifetime in write-intensive applications.
  • eMMC 5.1 Interface - Industry-standard embedded MultiMediaCard interface with 200MHz clock frequency supports high-speed data transfers while simplifying system integration with built-in controller functionality.
  • Wide Operating Voltage - 2.7V to 3.6V supply range accommodates various system architectures and power designs, providing flexibility in embedded applications.
  • Extended Temperature Range - -40°C to 85°C operating temperature qualification ensures reliable performance in harsh industrial environments and automotive-adjacent applications.
  • Compact Package - 153-ball VFBGA package measuring 11.5mm x 13mm minimizes board space while providing robust connectivity for high-reliability applications.

Typical Applications

  • Industrial Automation - This eMMC device serves as primary boot storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial gateways where reliable startup and extended temperature operation are essential for factory floor equipment.
  • Internet of Things (IoT) Gateways - The 4GB capacity and pSLC endurance make this device well-suited for IoT edge computing devices that require persistent storage for firmware, configuration data, and local buffering of sensor data before cloud transmission.
  • Medical Devices - Embedded medical equipment benefits from the reliable non-volatile storage for device firmware and patient data logging, with the extended temperature range supporting varied deployment environments.
  • Network Infrastructure - Routers, switches, and network appliances utilize this eMMC for boot firmware and configuration storage, where the pSLC technology provides consistent write performance and longer operational life.
  • Automotive Infotainment Systems - While not AEC-qualified, the extended temperature tolerance makes this device suitable for automotive-adjacent applications requiring persistent storage for user data, maps, and media content.

Unique Advantages

  • Enhanced Endurance with pSLC: Pseudo-Single-Level Cell technology delivers significantly higher write/erase cycle endurance compared to MLC or TLC alternatives, reducing replacement costs and improving system reliability over extended deployments.
  • Simplified Design Integration: The eMMC 5.1 interface includes an integrated controller managing wear leveling, bad block management, and error correction, eliminating the need for external NAND controller circuits and reducing development complexity.
  • Industrial-Grade Reliability: Extended temperature qualification combined with pSLC flash technology ensures consistent performance in challenging thermal environments where consumer-grade components may fail.
  • Fast Boot Performance: The 200MHz interface clock frequency and optimized boot partition features enable rapid system startup, critical for applications requiring quick recovery from power cycling or system resets.
  • Compact Form Factor: The 153-VFBGA package provides a small footprint for space-constrained embedded designs while maintaining the connectivity and thermal performance needed for reliable operation.
  • Broad Voltage Compatibility: The 2.7V to 3.6V operating range supports both 3.3V legacy systems and newer low-voltage architectures, extending design flexibility and enabling cost-effective board designs.

Why Choose IS21EF04GP-BCLI?

The IS21EF04GP-BCLI addresses the growing need for reliable, high-endurance embedded storage in industrial and IoT applications. Unlike consumer-grade eMMC devices, the pSLC technology ensures longer operational lifetime and more predictable performance in write-intensive scenarios, making it particularly valuable for systems deployed in remote locations or critical infrastructure where field service is costly. The combination of industrial temperature qualification, integrated controller functionality, and compact packaging makes this device an ideal choice for embedded system designers prioritizing reliability and longevity.

For applications requiring persistent boot storage with extended endurance characteristics, the IS21EF04GP-BCLI delivers an optimized balance of capacity, performance, and reliability suitable for next-generation industrial and IoT platforms.

Get a Quote

Contact our sales team to discuss your specific application requirements and receive detailed pricing information for the IS21EF04GP-BCLI. Our technical support staff can help evaluate whether this device meets your endurance, temperature, and performance specifications for your embedded design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up