IS42S16160B-7T-TR
| Part Description |
IC DRAM 256MBIT PAR 54TSOP II |
|---|---|
| Quantity | 1,257 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of IS42S16160B-7T-TR - 256Mbit Synchronous DRAM
The IS42S16160B-7T-TR is a 256-megabit synchronous DRAM organized as 16M x 16, designed for systems requiring reliable parallel memory with straightforward integration. Built on proven SDRAM technology, this component operates at clock frequencies up to 143 MHz with a 5.4 ns access time, making it suitable for embedded applications where predictable performance and cost-effective memory expansion are priorities.
This TSOP II packaged memory device offers designers a compact footprint with standard 3.3V operation, allowing for easy integration into existing designs while maintaining compatibility with conventional parallel memory interfaces.
Key Features
- Memory Architecture - 256Mbit capacity organized as 16M x 16 configuration provides flexible word-wide data access for embedded systems requiring straightforward parallel addressing.
- Clock Performance - Operates at clock frequencies up to 143 MHz with 5.4 ns access time, delivering consistent throughput for applications with moderate bandwidth requirements.
- Power Supply - Single 3.3V supply (3V to 3.6V range) simplifies power distribution and reduces system complexity compared to multi-rail memory solutions.
- Package - 54-pin TSOP II package (0.400", 10.16mm width) offers a space-efficient form factor suitable for dense PCB layouts in embedded designs.
- Operating Range - Commercial temperature range of 0°C to 70°C supports standard indoor and temperature-controlled environments.
Typical Applications
- Legacy System Support - This SDRAM provides a replacement or upgrade path for older embedded systems originally designed around parallel memory architectures, allowing manufacturers to extend product lifecycles without complete redesigns.
- Set-Top Boxes and Consumer Electronics - The moderate bandwidth and 3.3V operation make this memory suitable for video processing, UI buffering, and firmware storage in consumer devices operating in controlled temperature environments.
- Office Equipment - Printers, copiers, and multifunction devices benefit from the reliable parallel interface and sufficient capacity for document buffering, page rendering, and embedded controller operations.
- Legacy Industrial Controls - Systems requiring parallel memory interfaces in standard temperature environments can utilize this SDRAM for data logging, HMI buffering, and controller memory where newer DDR technologies are unnecessary.
Unique Advantages
- Simplified Design Integration: Standard parallel interface eliminates complex routing and impedance matching requirements associated with high-speed serial memory, reducing PCB design time and manufacturing costs.
- Single Voltage Operation: 3.3V-only power requirement reduces power supply complexity and component count compared to memories requiring multiple voltage rails.
- Proven Technology Platform: SDRAM architecture has decades of field history, offering predictable behavior and reducing design risk for projects requiring stable, well-understood memory solutions.
- Compact Footprint: TSOP II packaging provides good density for parallel memory while maintaining hand-solderable pitch for prototyping and small-volume production.
- Cost-Effective Capacity: 256Mbit organization delivers sufficient memory for many embedded applications at a price point typically lower than newer memory technologies.
Why Choose IS42S16160B-7T-TR?
This SDRAM component is positioned for designs where parallel memory interfaces align with system architecture requirements, particularly in legacy product support, cost-sensitive consumer electronics, and established industrial platforms. Engineers working on products with existing parallel memory buses will find the IS42S16160B-7T-TR offers a straightforward upgrade path without requiring interface redesign.
Note that this component carries an Obsolete lifecycle status. Designers should evaluate current availability and consider long-term supply planning or alternative memory solutions for new designs with extended production timelines. For existing products requiring this specific part number, this component may serve as a bridge solution while transitioning to current-generation memory technologies.
Request a Quote
Contact our technical sales team for pricing, availability information, and volume discounts on the IS42S16160B-7T-TR. Our engineers can assist with alternative memory solutions if this component does not meet your specific requirements or supply chain needs.