IS42S16160B-7TL-TR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 681 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS42S16160B-7TL-TR – IC DRAM 256MBIT PAR 54TSOP II

The IS42S16160B-7TL-TR is a 256 Mbit synchronous DRAM (SDRAM) organized as 16M × 16 with a parallel memory interface and quad-bank architecture. It uses a pipelined, fully synchronous design with all signals referenced to the rising edge of the clock for predictable, high-speed burst transfers.

Targeted for designs requiring medium-density, fast, volatile memory, this device delivers 143 MHz clock operation (CL=3) with programmable burst length and sequence, making it suitable for systems that need deterministic, high-throughput DRAM behavior within a 0°C to 70°C operating range.

Key Features

  • Memory Type & Organization — 256 Mbit SDRAM, organized as 16M × 16 with four internal banks (4M × 16 × 4 banks) for bank interleaving and hidden precharge.
  • Clock & Timing — Rated for 143 MHz operation at CAS Latency = 3 (-7 speed grade) with an access time from clock of 5.4 ns (CL=3).
  • Programmable Burst & CAS — Supports programmable burst lengths (1, 2, 4, 8, full page) and programmable burst sequence (Sequential/Interleave); CAS latency programmable between 2 and 3 clocks.
  • Refresh & Power Modes — Auto Refresh and Self Refresh supported; 8K refresh cycles every 64 ms per datasheet specification to maintain data integrity in self-refresh.
  • Interface & Logic Levels — LVTTL-compatible I/O with a parallel memory interface for conventional SDRAM system integration.
  • Power Supply — Specified supply range 3.0 V to 3.6 V; datasheet references 3.3 V VDD and 3.3 V VDDQ operation.
  • Package — Available in 54-pin TSOP II (0.400", 10.16 mm width) package suitable for surface-mount designs.
  • Operating Temperature — Commercial grade operating range of 0°C to 70°C; datasheet also notes availability in industrial temperature variants.

Typical Applications

  • System Memory for Embedded Platforms — 256 Mbit density and 143 MHz synchronous operation provide deterministic burst transfers for embedded controllers and processors that require parallel SDRAM.
  • Frame Buffering & Data Buffering — Quad-bank architecture and programmable burst lengths support burst-oriented read/write sequences for buffering tasks that need high throughput.
  • General-Purpose DRAM Expansion — Parallel interface and LVTTL signaling allow integration into legacy and modern boards requiring a standard SDRAM memory block.

Unique Advantages

  • Deterministic Synchronous Operation: Fully synchronous design with clock-referenced I/O ensures predictable timing for burst access patterns.
  • Configurable Performance: Programmable CAS latency (2 or 3 clocks) and multiple burst lengths let designers tune latency and throughput to system needs.
  • Bank Interleaving: Four internal banks and internal precharge hide row access/precharge cycles, improving effective throughput for random accesses.
  • Standard Power Supply: Operates within a common 3.0–3.6 V supply window (datasheet references 3.3 V), simplifying power-rail integration in existing systems.
  • Compact Surface-Mount Packaging: 54-pin TSOP II package (0.400", 10.16 mm width) supports high-density PCB layouts while providing a conventional footprint for SDRAM.

Why Choose IS42S16160B-7TL-TR?

The IS42S16160B-7TL-TR combines a 256 Mbit SDRAM density with a fully synchronous, quad-bank architecture and programmable timing to deliver flexible, predictable memory behavior for embedded and system-level applications. Its 143 MHz (-7) performance point with a 5.4 ns access time (CL=3) is suited to designs that require controlled latency and burst transfer capability.

This part is appropriate for designers seeking a standard parallel SDRAM solution in a 54-pin TSOP II package, offering configurable burst modes, LVTTL compatibility, and standard 3.0–3.6 V power requirements. The device’s refresh and self-refresh support, along with bank interleaving, provide practical benefits for buffering and memory expansion in compact board designs.

If you would like pricing, availability, or technical packaging details for IS42S16160B-7TL-TR, request a quote or contact sales for additional information and ordering support.

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