IS42S16160D-6BL-TR

IC DRAM 256MBIT PAR 54TFBGA
Part Description

IC DRAM 256MBIT PAR 54TFBGA

Quantity 1,463 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TW-BGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS42S16160D-6BL-TR – IC DRAM 256MBIT PAR 54TFBGA

The IS42S16160D-6BL-TR is a 256‑Mbit synchronous DRAM (SDRAM) device organized as 16M × 16 with a parallel memory interface. It implements a pipelined, fully synchronous architecture with all signals referenced to the rising edge of the clock.

Designed for commercial-temperature systems (0°C to 70°C), the device offers a 166 MHz clock option, LVTTL signalling and a single 3.3 V ±0.3 V supply window (listed as 3.0 V to 3.6 V), making it suitable for board-level SDRAM memory applications that require programmable burst control and selectable CAS latency.

Key Features

  • Memory Core — 256 Mbit SDRAM organized as 16M × 16 and implemented with internal bank architecture to help hide row access and precharge latency.
  • Performance — Supports a clock frequency up to 166 MHz with an access time from clock of 5.4 ns (CAS latency = 3).
  • Interface and Timing — Parallel memory interface with LVTTL signalling. Programmable burst length (1, 2, 4, 8, full page), programmable burst sequence (Sequential/Interleave) and selectable CAS latency (2 or 3 clocks).
  • Power — Single power supply operation listed at 3.0 V to 3.6 V (typical 3.3 V ±0.3 V).
  • Refresh and Self‑Maintenance — Supports Auto Refresh (CBR) and Self Refresh; commercial refresh rate is 8K refresh cycles every 64 ms.
  • Burst and Access Modes — Burst read/write and burst read/single write operations with random column address capability every clock cycle; burst termination via burst stop or precharge command.
  • Package and Temperature — 54‑TFBGA (54‑TW‑BGA, 8 × 13 footprint) package; operating temperature 0°C to 70°C (TA).

Typical Applications

  • Commercial embedded systems — Board-level SDRAM for commercial-temperature embedded designs requiring synchronous parallel memory.
  • Memory expansion on PCBs — PCB-level memory buffers and expansion where a 16M × 16 SDRAM organization is required.
  • Systems requiring programmable burst control — Applications that benefit from selectable burst length and burst sequence for optimized data transfer patterns.

Unique Advantages

  • Deterministic synchronous timing — Fully synchronous design with all signals referenced to the rising clock edge enables predictable timing at the stated clock frequencies.
  • Selectable performance points — Programmable CAS latency (2 or 3) and multiple burst length options let designers tune latency and throughput.
  • Single‑supply operation — Operates across a 3.0 V to 3.6 V range for straightforward power rail integration.
  • Built‑in refresh management — Auto Refresh and Self Refresh modes with commercial-grade 8K/64 ms refresh support reduce external refresh handling.
  • Compact BGA footprint — 54‑TFBGA package (54‑TW‑BGA, 8×13) minimizes PCB area for board-level memory implementations.
  • Fast access timing — Access time from clock as low as 5.4 ns (CAS = 3) for low-latency read operations at the specified clock rate.

Why Choose IS42S16160D-6BL-TR?

The IS42S16160D-6BL-TR provides a straightforward, commercial-temperature SDRAM option with a 16M × 16 organization, programmable timing and burst flexibility, and a compact 54‑TFBGA package. Its synchronous, pipelined architecture and support for 166 MHz operation deliver the timing control and throughput characteristics needed for many board-level memory functions.

Choose this device for designs that require a 256‑Mbit parallel SDRAM with selectable CAS latency and burst modes, single‑supply 3.3 V operation, and standard commercial temperature range. The device’s refresh and self‑refresh capabilities simplify system-level refresh management and integration.

Request a quote or submit an RFQ to obtain pricing and availability information for the IS42S16160D-6BL-TR.

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