IS42S16800D-75EBL

IC DRAM 128MBIT PAR 54MINIBGA
Part Description

IC DRAM 128MBIT PAR 54MINIBGA

Quantity 412 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-MiniBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time6.5 nsGradeCommercial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S16800D-75EBL – IC DRAM 128Mbit Parallel 54 MiniBGA

The IS42S16800D-75EBL is a 128 Mbit synchronous DRAM (SDRAM) device organized as 8M × 16 with a quad-bank architecture. It is designed for 3.3V memory systems and provides a fully synchronous, LVTTL-referenced interface for parallel memory implementations.

This device targets systems that require high-speed, burst-oriented memory access with internal bank interleaving, programmable burst behavior and on-chip refresh management.

Key Features

  • Memory Core 128 Mbit SDRAM organized as 8M × 16 with a quad-bank internal configuration for concurrent bank operation and efficient row precharge handling.
  • Performance Supports clock frequencies of 166, 143 and 133 MHz (device grade options). Typical access time from clock is 6.5 ns for the -75E grade and programmable CAS latency of 2 or 3 clocks.
  • Burst and Addressing Programmable burst lengths (1, 2, 4, 8, full page) and selectable burst sequence (Sequential or Interleave) with random column address capability every clock cycle.
  • Refresh and Power Modes Auto Refresh (CBR) and Self Refresh with programmable refresh periods; 4096 refresh cycles every 64 ms are supported to maintain data integrity.
  • Interface and Logic Levels LVTTL-compatible inputs/outputs and a parallel memory interface for standard system integration.
  • Power Nominal 3.3V VDD/VDDQ operation with an operating supply range of 3.0 V to 3.6 V.
  • Package and Temperature 54-ball MiniBGA (8 × 13) package in a compact 54-VFBGA form factor; operating temperature range 0°C to 70°C (TA). Lead-free availability noted in the device datasheet.

Typical Applications

  • Parallel SDRAM systems — Deploy as a 128 Mbit synchronous DRAM component where a parallel LVTTL SDRAM interface is required.
  • Memory expansion modules — Provide organized 8M × 16 memory for designs requiring quad-bank SDRAM capacity in a compact BGA footprint.
  • High-speed buffering — Use where burst read/write capability and 133 MHz-class clocking with 6.5 ns access are needed for fast data paths.

Unique Advantages

  • Synchronous quad-bank architecture: Internal bank structure and bank interleaving hide row access/precharge times to improve effective throughput.
  • Flexible burst control: Programmable burst lengths and sequences enable tailoring of transfer behavior to system access patterns.
  • Multiple timing grades: Available clock-frequency grades (166, 143, 133 MHz) and selectable CAS latencies (2 or 3) provide design flexibility for timing and performance trade-offs.
  • On-chip refresh management: Auto Refresh and Self Refresh modes with 4096 refresh cycles/64 ms reduce external refresh control complexity.
  • Compact BGA package: 54-ball MiniBGA (8×13) reduces PCB area while providing robust soldered connections for dense system designs.
  • LVTTL compatibility: Logic-level compatibility simplifies interfacing with standard 3.3V system logic.

Why Choose IS42S16800D-75EBL?

The IS42S16800D-75EBL combines a 128 Mbit SDRAM core with synchronous, LVTTL-referenced operation and a quad-bank architecture to deliver predictable, burst-oriented memory performance. Its supported timing grades and programmable burst/CAS settings make it adaptable to designs that require specific clocking and latency profiles.

This device is well suited for designs that require a compact BGA package, standard 3.3V operation, on-chip refresh features and flexible burst behavior—offering a focused memory solution for engineers optimizing board area and memory timing.

Request a quote or submit a sales inquiry to obtain pricing, availability and lead-time information for the IS42S16800D-75EBL.

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