IS42S16800D-75EBLI
| Part Description |
IC DRAM 128MBIT PAR 54MINIBGA |
|---|---|
| Quantity | 1,406 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-MiniBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 6.5 ns | Grade | Industrial | ||
| Clock Frequency | 133 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S16800D-75EBLI – IC DRAM 128MBIT PAR 54MINIBGA
The IS42S16800D-75EBLI is a 128 Mbit synchronous DRAM (SDRAM) device organized as 8M × 16 with a parallel LVTTL interface. It uses a pipeline, fully synchronous architecture with internal quad-bank organization to support high-speed, burst-oriented memory transfers.
Designed for systems that require parallel SDRAM memory with programmable burst and timing behavior, this device offers selectable CAS latency, programmable burst length and sequence, and industrial temperature availability for applications operating from -40°C to 85°C.
Key Features
- Core / Architecture Fully synchronous SDRAM with pipeline architecture and internal quad-bank structure to hide row access and precharge timing.
- Memory Organization & Capacity 128 Mbit capacity organized as 8M × 16 (2M ×16 ×4 banks) providing a parallel DRAM memory format.
- Performance & Timing Specified for a 133 MHz clock frequency with access time as low as 6.5 ns; programmable CAS latency options (2 or 3 clocks) allow timing optimization.
- Burst & Transfer Control Programmable burst lengths (1, 2, 4, 8, full page) and burst sequences (Sequential/Interleave); supports burst read/write and burst read/single write operations, with burst termination via burst stop or precharge.
- Refresh & Power Management Auto Refresh and Self Refresh modes with 4096 refresh cycles every 64 ms; includes power-down and self-refresh features for power-saving operation.
- Interface & Signaling LVTTL-compatible interface with all signals referenced to the positive clock edge for synchronous operation.
- Power Supply Operates from a 3.0 V to 3.6 V supply (VDD/VDDQ 3.3 V specified in device documentation).
- Package & Temperature Supplied in a 54-ball MiniBGA (8 × 13) package; industrial temperature range from -40°C to 85°C and lead-free availability noted in the device specification.
Typical Applications
- Industrial Systems Memory for industrial equipment that requires synchronous parallel DRAM operation across an extended temperature range.
- Embedded Parallel Memory Local memory expansion for embedded designs requiring 128 Mbit parallel SDRAM with programmable burst behavior and selectable CAS latency.
- High-Speed Burst Buffering Buffering and burst transfer scenarios that benefit from programmable burst lengths, burst termination, and interleaved bank access.
Unique Advantages
- Synchronous, pipelined architecture: Enables high-speed, predictable data transfers with all signals referenced to the clock’s rising edge.
- Quad-bank organization: Internal bank structure hides row access/precharge timing to improve effective throughput during interleaved accesses.
- Flexible timing and burst control: Programmable CAS latency, burst length and burst sequence let designers tune performance for specific system timing requirements.
- Robust refresh and power modes: Auto Refresh and Self Refresh (4096 cycles/64 ms) plus power-down modes reduce housekeeping overhead and support power-sensitive designs.
- Industrial temperature and compact package: -40°C to 85°C rating combined with a 54-ball MiniBGA (8×13) package supports space-constrained, harsh-environment applications.
Why Choose IS42S16800D-75EBLI?
The IS42S16800D-75EBLI delivers a 128 Mbit parallel SDRAM option with synchronous, pipelined operation and a flexible feature set—programmable CAS latency, burst control, and robust refresh modes—that helps engineers balance throughput and timing requirements. Its quad-bank internal architecture and LVTTL interface provide deterministic behavior for burst-oriented memory designs.
This device is well suited to designs that require a compact, industrial-temperature SDRAM solution operating at a 3.0–3.6 V supply range and supporting 133 MHz clocking with low access times. It offers configuration flexibility and package density for space-constrained systems that demand reliable synchronous DRAM performance.
For pricing, availability, or to request a quote for the IS42S16800D-75EBLI, submit a request with your quantity and delivery requirements and a product specialist will respond with a formal quote.