IS42S16800D-75EBL-TR

IC DRAM 128MBIT PAR 54MINIBGA
Part Description

IC DRAM 128MBIT PAR 54MINIBGA

Quantity 233 Available (as of May 4, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-MiniBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time6.5 nsGradeCommercial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-VFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S16800D-75EBL-TR - 128Mbit SDRAM in Compact MiniBGA Package

The IS42S16800D-75EBL-TR is a 128-megabit synchronous DRAM (SDRAM) that combines a high-performance memory architecture with a space-saving 54-pin MiniBGA package. Organized as 8M x 16, this SDRAM operates at clock frequencies up to 133 MHz with a 6.5 ns access time, making it suitable for embedded systems, consumer electronics, and industrial applications requiring reliable parallel memory with moderate density and speed.

Designed for designs where board space is at a premium, the 54-MiniBGA (8x13 mm) footprint allows engineers to maximize functionality within compact form factors while maintaining compatibility with standard 3V to 3.6V power rails.

Key Features

  • Memory Architecture - 128 Mbit capacity organized as 8M x 16, providing flexible word-width access for 16-bit bus designs. The SDRAM technology delivers synchronous operation with pipelined data flow for efficient burst transfers.
  • Performance Specifications - 133 MHz clock frequency support with 6.5 ns access time enables responsive data retrieval in real-time applications. Parallel interface provides direct memory mapping for processor and controller integration.
  • Power and Voltage - 3V to 3.6V supply voltage range ensures compatibility with common embedded system power architectures. Volatile memory technology allows for fast read/write cycles with low latency.
  • Operating Environment - 0°C to 70°C (TA) operating temperature range covers commercial and standard industrial environments, maintaining data integrity across typical application conditions.
  • Package Format - 54-VFBGA (54-MiniBGA, 8x13 mm) provides a compact surface-mount solution that reduces PCB footprint by up to 40% compared to traditional TSOP packages while maintaining reliable solder joint integrity.

Typical Applications

  • Embedded Computing Systems - This SDRAM serves as main memory or buffer storage in microcontroller-based designs where the 8M x 16 organization aligns with 16-bit processor architectures, enabling efficient memory mapping without external glue logic.
  • Consumer Electronics - The compact MiniBGA package makes this memory ideal for set-top boxes, digital cameras, and portable media devices where board space constraints require dense component placement while the 133 MHz operation supports standard video processing and UI rendering tasks.
  • Industrial Control Equipment - In HMI panels, data loggers, and instrumentation systems, the 0°C to 70°C temperature range provides reliable operation in controlled industrial environments, while the parallel interface simplifies integration with legacy control processors.
  • Network and Communication Devices - This SDRAM functions as packet buffer memory or lookup table storage in routers, switches, and communication modules operating at moderate data rates, where the synchronous architecture enables deterministic memory access patterns.

Unique Advantages

  • Reduced PCB Real Estate: The 54-MiniBGA package (8x13 mm) delivers significant space savings versus TSOP alternatives, allowing designers to shrink board dimensions or allocate freed space to additional functionality.
  • Simplified BOM Management: Standard 3V to 3.6V operation eliminates the need for dedicated voltage regulators in systems already using 3.3V rails, reducing component count and simplifying power distribution design.
  • Proven SDRAM Architecture: Synchronous DRAM technology provides predictable timing characteristics and straightforward controller integration, reducing firmware complexity compared to newer memory technologies with more complex timing requirements.
  • Cost-Effective Memory Solution: The 128 Mbit density hits a sweet spot for moderate-complexity embedded applications, avoiding over-provisioning while providing sufficient capacity for firmware, buffering, and data processing tasks.
  • Direct Processor Interface: Parallel memory interface allows connection directly to processor memory buses without protocol conversion, reducing latency and simplifying system architecture in 16-bit microcontroller and DSP applications.

Why Choose the IS42S16800D-75EBL-TR?

The IS42S16800D-75EBL-TR represents a practical choice for embedded system designers who need reliable, moderate-density memory in a compact form factor. The 8M x 16 organization aligns naturally with 16-bit processor architectures, while the 133 MHz clock support and 6.5 ns access time provide adequate performance for real-time control, data buffering, and user interface applications. The space-saving MiniBGA package addresses the ongoing pressure to reduce product dimensions without sacrificing functionality.

This component is particularly well-suited for cost-sensitive designs in consumer electronics, industrial controls, and communication equipment where proven SDRAM technology, straightforward integration, and compact packaging converge to accelerate development cycles and reduce total system cost.

Get a Quote

To learn more about the IS42S16800D-75EBL-TR or request pricing and availability for your project, contact our technical sales team. We can provide detailed specifications, reference designs, and volume pricing to support your engineering and procurement requirements.

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