IS42S32200L-6TL
| Part Description |
IC DRAM 64MBIT PAR 86TSOP II |
|---|---|
| Quantity | 259 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 2M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S32200L-6TL - 64Mbit Parallel SDRAM
The IS42S32200L-6TL is a 64Mbit synchronous dynamic random access memory organized as 2M x 32 bits. This parallel SDRAM operates at 166MHz clock frequency and provides fast 5.4ns access times, making it suitable for embedded systems and applications requiring moderate-density volatile memory. The device operates from a single 3V to 3.6V power supply and is housed in an 86-TSOP II package.
Key Features
- Memory Architecture - 64Mbit density organized as 2M x 32 bits provides flexible addressing for 32-bit data bus applications.
- High-Speed Operation - 166MHz clock frequency with 5.4ns access time supports data-intensive operations in real-time embedded systems.
- Power Supply - Single 3V to 3.6V supply voltage simplifies power design and is compatible with standard 3.3V logic systems.
- Parallel Interface - Direct parallel memory interface enables straightforward integration with microprocessors and controllers without requiring serial protocol overhead.
- Package - 86-pin TSOP II package with 10.16mm width offers a balance between pin count and board space efficiency.
- Temperature Range - Commercial temperature range of 0°C to 70°C suits standard indoor and controlled-environment applications.
Typical Applications
- Embedded Computing Systems - This SDRAM serves as main memory or buffer storage in embedded processors where the 32-bit wide data path matches common embedded architectures and the 64Mbit capacity handles moderate memory requirements.
- Networking Equipment - The fast access time and parallel interface make this device suitable for packet buffering in routers and switches operating within climate-controlled network facilities.
- Digital Set-Top Boxes - Provides working memory for video processing and user interface functions where the commercial temperature range aligns with consumer electronics deployment environments.
- Office Automation Equipment - Functions as data buffer memory in printers, copiers, and document scanners where the memory organization supports efficient data handling in standard office conditions.
Unique Advantages
- 32-bit Data Width: Native 32-bit organization eliminates the need for multiple memory devices or complex bank switching in 32-bit processor designs.
- Standard SDRAM Timing: Follows conventional SDRAM protocols, allowing designers to leverage existing controller IP and reduce development time.
- Moderate Density Option: 64Mbit capacity fills the gap between smaller SRAMs and larger SDRAM devices for applications with specific memory requirements.
- Single Voltage Rail: Operation from a single 3.3V supply reduces power distribution complexity and lowers overall system BOM compared to dual-voltage memory solutions.
Why Choose IS42S32200L-6TL?
The IS42S32200L-6TL addresses embedded system designs requiring predictable SDRAM performance with a 32-bit wide data path. Its 166MHz operating frequency and 5.4ns access time provide adequate speed for many control, networking, and consumer applications without the power consumption or cost of high-performance DDR alternatives. The commercial temperature range makes it appropriate for products deployed in temperature-controlled environments.
This device is particularly well-suited for cost-sensitive designs where the 2M x 32 memory organization aligns with processor architecture and where the commercial temperature specification matches the operating environment.
Availability and Ordering
Please note that this component has an Obsolete lifecycle status. Contact our sales team to discuss availability, alternatives, or last-time-buy opportunities for existing designs. Our technical support staff can assist with migration planning to current-generation memory products if needed.