IS42S32200L-6BLI
| Part Description |
IC DRAM 64MBIT PARALLEL 90TFBGA |
|---|---|
| Quantity | 346 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 90-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 90-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 2M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S32200L-6BLI – IC DRAM 64MBIT PARALLEL 90TFBGA
The IS42S32200L-6BLI is a 64 Mbit volatile SDRAM device organized as 2M × 32 with a parallel memory interface. It implements synchronous DRAM (SDRAM) technology and is specified with a 166 MHz clock frequency and a 5.4 ns access time.
Designed for compact board-level integration, the device is offered in a 90‑TFBGA (8×13) package, operates from a 3.0 V to 3.6 V supply, and supports an ambient temperature range of −40°C to 85°C.
Key Features
- Memory Architecture 64 Mbit capacity organized as 2M × 32, providing a 32‑bit data width for each access.
- SDRAM Technology Synchronous DRAM format with a parallel memory interface for conventional SDRAM bus integration.
- Performance Specified for a 166 MHz clock frequency with an access time of 5.4 ns.
- Power Operates from a 3.0 V to 3.6 V supply range.
- Package 90‑TFBGA package case (8×13) for space-efficient surface mounting.
- Temperature Range Operating ambient temperature specified from −40°C to 85°C (TA).
- Memory Format Volatile DRAM memory format suitable for temporary data storage in embedded systems.
Unique Advantages
- Compact 90‑TFBGA footprint: Enables space-efficient board designs while providing a full 32‑bit data path.
- Wide 32‑bit organization (2M × 32): Supports wider parallel transfers to match 32‑bit memory buses.
- High-speed operation: 166 MHz clock and 5.4 ns access time deliver measured synchronous performance for time-sensitive memory accesses.
- Extended operating range: −40°C to 85°C ambient rating supports deployment across a broad set of environmental conditions.
- Standard 3.0–3.6 V supply: Aligns with common 3V power rails to simplify power design.
- Parallel interface: Straightforward integration into parallel SDRAM memory systems.
Why Choose IS42S32200L-6BLI?
The IS42S32200L-6BLI provides a compact, synchronous DRAM solution offering a 64 Mbit capacity with a 32‑bit data organization and 166 MHz operation. Its combination of measured access performance, standard 3.0–3.6 V operation, and a 90‑TFBGA package makes it suitable for designs that require a moderate-capacity parallel SDRAM in a small footprint.
This device is appropriate for designers seeking a verified SDRAM building block with defined electrical and thermal limits, enabling predictable integration into systems that use parallel SDRAM memory architectures.
Request a quote or contact sales to discuss availability, pricing, and lead times for the IS42S32200L-6BLI.