IS42S32200L-6BLI

IC DRAM 64MBIT PARALLEL 90TFBGA
Part Description

IC DRAM 64MBIT PARALLEL 90TFBGA

Quantity 346 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package90-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging90-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization2M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S32200L-6BLI – IC DRAM 64MBIT PARALLEL 90TFBGA

The IS42S32200L-6BLI is a 64 Mbit volatile SDRAM device organized as 2M × 32 with a parallel memory interface. It implements synchronous DRAM (SDRAM) technology and is specified with a 166 MHz clock frequency and a 5.4 ns access time.

Designed for compact board-level integration, the device is offered in a 90‑TFBGA (8×13) package, operates from a 3.0 V to 3.6 V supply, and supports an ambient temperature range of −40°C to 85°C.

Key Features

  • Memory Architecture 64 Mbit capacity organized as 2M × 32, providing a 32‑bit data width for each access.
  • SDRAM Technology Synchronous DRAM format with a parallel memory interface for conventional SDRAM bus integration.
  • Performance Specified for a 166 MHz clock frequency with an access time of 5.4 ns.
  • Power Operates from a 3.0 V to 3.6 V supply range.
  • Package 90‑TFBGA package case (8×13) for space-efficient surface mounting.
  • Temperature Range Operating ambient temperature specified from −40°C to 85°C (TA).
  • Memory Format Volatile DRAM memory format suitable for temporary data storage in embedded systems.

Unique Advantages

  • Compact 90‑TFBGA footprint: Enables space-efficient board designs while providing a full 32‑bit data path.
  • Wide 32‑bit organization (2M × 32): Supports wider parallel transfers to match 32‑bit memory buses.
  • High-speed operation: 166 MHz clock and 5.4 ns access time deliver measured synchronous performance for time-sensitive memory accesses.
  • Extended operating range: −40°C to 85°C ambient rating supports deployment across a broad set of environmental conditions.
  • Standard 3.0–3.6 V supply: Aligns with common 3V power rails to simplify power design.
  • Parallel interface: Straightforward integration into parallel SDRAM memory systems.

Why Choose IS42S32200L-6BLI?

The IS42S32200L-6BLI provides a compact, synchronous DRAM solution offering a 64 Mbit capacity with a 32‑bit data organization and 166 MHz operation. Its combination of measured access performance, standard 3.0–3.6 V operation, and a 90‑TFBGA package makes it suitable for designs that require a moderate-capacity parallel SDRAM in a small footprint.

This device is appropriate for designers seeking a verified SDRAM building block with defined electrical and thermal limits, enabling predictable integration into systems that use parallel SDRAM memory architectures.

Request a quote or contact sales to discuss availability, pricing, and lead times for the IS42S32200L-6BLI.

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