IS43DR86400D-3DBL
| Part Description |
512M, 1.8V, DDR2, 64MX8, 333MHZ |
|---|---|
| Quantity | 1,737 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 60-TWBGA (8x10.5) | Memory Format | DRAM | Technology | SDRAM - DDR2 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 450 ps | Grade | Commercial (Extended) | ||
| Clock Frequency | 333 MHz | Voltage | 1.7V ~ 1.9V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 85°C (TC) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | SSTL_18 | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | N/A | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of IS43DR86400D-3DBL - 512Mb DDR2 SDRAM Memory IC
The IS43DR86400D-3DBL is a 512-megabit DDR2 SDRAM memory device organized as 64M x 8 bits, designed for applications requiring high-performance volatile memory in a compact footprint. Operating at 333MHz and 1.8V, this DRAM delivers fast access times and low power consumption for embedded systems, consumer electronics, and industrial equipment.
With a 0.45ns access time and SSTL_18 interface, this memory IC provides reliable data storage and retrieval for applications demanding responsive memory performance in the 0°C to 85°C operating range.
Key Features
- Memory Architecture - 512-megabit capacity organized as 64M x 8 bits, providing flexible memory configuration for embedded systems and consumer applications.
- DDR2 SDRAM Technology - Double data rate architecture enables 333MHz clock frequency operation with efficient data throughput for modern digital systems.
- Low Voltage Operation - 1.7V to 1.9V supply voltage range reduces power consumption and heat generation, extending battery life in portable devices.
- Fast Access Performance - 0.45ns access time and 15ns write cycle time deliver responsive memory performance for real-time applications.
- SSTL_18 Interface - Industry-standard Stub Series Terminated Logic interface ensures reliable signal integrity and compatibility with DDR2 controllers.
- Compact TFBGA Package - 60-ball TFBGA (8x10.5mm) package minimizes PCB footprint for space-constrained designs.
- Commercial Temperature Range - 0°C to 85°C case temperature operation supports deployment in typical commercial and industrial environments.
Typical Applications
- Consumer Electronics - The IS43DR86400D-3DBL serves as main system memory in set-top boxes, digital TVs, and home entertainment devices where its 512Mb capacity and low voltage operation balance performance with power efficiency.
- Industrial Control Systems - This DDR2 SDRAM provides reliable data buffering and program storage for PLCs, HMI panels, and automation controllers operating in the 0°C to 85°C temperature range typical of controlled industrial environments.
- Networking Equipment - The 333MHz clock frequency and fast access time make this memory suitable for routers, switches, and network processors that require responsive packet buffering and data handling.
- Embedded Computing - Single board computers and embedded processors leverage this memory IC for program execution and data caching in applications like point-of-sale systems, kiosks, and embedded controllers.
- Medical Instrumentation - Diagnostic equipment and patient monitoring systems utilize this SDRAM for data acquisition buffering and display processing where reliable volatile memory is required in temperature-controlled medical environments.
Unique Advantages
- Optimized Power-Performance Balance: DDR2 technology at 1.8V provides better performance than DDR while consuming less power than older SDRAM, reducing thermal management requirements and enabling fanless designs.
- Proven DDR2 Ecosystem: Broad controller compatibility and mature DDR2 infrastructure reduce design risk and accelerate time-to-market with established reference designs and validation tools.
- Space-Efficient Integration: The 60-ball TFBGA package in an 8x10.5mm footprint delivers 512Mb capacity with minimal PCB area, maximizing density for compact product designs.
- Standard Interface Compatibility: SSTL_18 interface eliminates the need for custom level shifting or interface circuits, simplifying board design and reducing component count.
- Flexible Memory Configuration: The x8 organization allows designers to implement various memory widths by paralleling multiple devices, accommodating 8-bit, 16-bit, 32-bit, or wider data buses as needed.
- Active Product Status: Current lifecycle status ensures long-term availability for production programs, reducing obsolescence risk and supporting multi-year product lifecycles.
Why Choose IS43DR86400D-3DBL?
The IS43DR86400D-3DBL represents a practical choice for designs requiring proven DDR2 memory technology in a compact form factor. Its 512Mb capacity and 333MHz operation address the needs of embedded applications that have moved beyond basic SDRAM but do not require the complexity or power budget of DDR3 or DDR4 implementations. The commercial temperature range and standard SSTL_18 interface make integration straightforward for applications in controlled environments.
For system designers balancing memory performance, power consumption, and physical size in consumer electronics, industrial controls, or embedded computing platforms, this DRAM provides a stable, well-supported solution backed by ISSI's experience in memory technologies.
Get Started
For pricing, lead times, and technical support on the IS43DR86400D-3DBL, contact our sales team. We can assist with sample requests, volume quotes, and integration guidance to help you evaluate this memory IC for your specific application requirements.