IS43DR16320E-3DBLI-TR

The IS43DR16320E-3DBLI-TR is a 512 Mbit DDR2 SDRAM device organized as 32M × 16 with a parallel memory interface. It supports DDR2 operation at a 333 MHz clock frequency and is supplied in a compact 84-ball BGA package.

Designed for systems requiring volatile, parallel-access DRAM, this device provides defined timing and power characteristics—including a 1.7 V to 1.9 V supply range and an operating temperature range of −40°C to 85°C—suitable for a range of embedded applications that require mid-density DDR2 memory.

Key Features

• Memory Type & Technology DDR2 SDRAM volatile memory providing standard DDR2 architecture for parallel system interfaces.
• Capacity & Organization 512 Mbit total capacity organized as 32M × 16 to support 16-bit wide data transfers.
• Performance Supports a 333 MHz clock frequency and specifies an access time of 450 ps for device timing characterization.
• Timing Write cycle time (word/page) specified at 15 ns, providing explicit timing parameters for system integration.
• Power Operates from a 1.7 V to 1.9 V supply range, matching low-voltage DDR2 system requirements.
• Package Available in an 84-ball TWBGA package with package dimensions noted as 8 × 12.5 (84-TWBGA); package case information also listed as 84-TFBGA.
• Temperature Range Rated for an ambient operating temperature range of −40°C to 85°C (TA).
• Interface Parallel memory interface suitable for designs requiring conventional DDR2 parallel connectivity.

Unique Advantages

• Mid-density memory option: 512 Mbit capacity offers a balance of storage and board space for systems needing moderate DRAM capacity.
• Defined DDR2 timing: 333 MHz clock frequency and 450 ps access time provide concrete performance parameters for system timing design.
• Low-voltage operation: 1.7 V–1.9 V supply compatibility supports integration with low-voltage DDR2 power domains.
• Compact BGA footprint: 84-ball TWBGA package (8 × 12.5) reduces PCB area compared with larger packages while providing a solderable BGA form factor.
• Industrial temperature support: −40°C to 85°C operating range enables use in environments requiring extended ambient temperature tolerance.
• Parallel 16-bit organization: 32M × 16 organization simplifies data-path design for systems using 16-bit memory buses.

Why Choose IS43DR16320E-3DBLI-TR?

The IS43DR16320E-3DBLI-TR positions itself as a compact, mid-density DDR2 SDRAM solution that delivers explicit electrical and timing specifications—such as a 333 MHz clock frequency, 15 ns write cycle time, and 1.7 V–1.9 V supply range—helpful for predictable system integration. Its 84-ball BGA package and 32M × 16 organization make it suitable for embedded designs requiring a 16-bit parallel DDR2 memory with a modest capacity footprint.

This device is appropriate for designers and procurement teams targeting applications that require defined DDR2 performance characteristics, low-voltage operation, and an extended ambient temperature range. The provided specifications support straightforward evaluation of timing, power, and thermal requirements during system design and qualification.

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