IS43DR86400D-3DBL-TR

512M, 1.8V, DDR2, 64MX8, 333MHZ
Part Description

512M, 1.8V, DDR2, 64MX8, 333MHZ

Quantity 698 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package60-TWBGA (8x10.5)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size512 MbitAccess Time450 psGradeCommercial (Extended)
Clock Frequency333 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature0°C ~ 85°C (TC)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceSSTL_18Memory Organization64M x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCNN/AHTS CodeN/A

Overview of IS43DR86400D-3DBL-TR - 512Mb DDR2 SDRAM with 333MHz Operation

The IS43DR86400D-3DBL-TR is a 512-megabit DDR2 SDRAM device from ISSI, Integrated Silicon Solution Inc, designed with a 64M x 8 architecture optimized for low-voltage operation at 1.8V. Operating at 333MHz with a fast 4.5ns access time, this memory device delivers reliable performance for embedded systems, consumer electronics, and industrial applications that require efficient power consumption and moderate speed requirements.

Key Features

  • High-Density Memory Architecture - 512Mb capacity organized as 64M x 8 provides flexible memory configurations suitable for a wide range of embedded applications requiring moderate data storage.
  • DDR2 SDRAM Technology - Volatile memory technology with double data rate operation enables efficient data throughput at 333MHz clock frequency while maintaining compatibility with standard DDR2 controllers.
  • Low-Voltage Operation - 1.7V to 1.9V supply voltage reduces power consumption compared to earlier generation memory technologies, making it ideal for battery-powered and energy-conscious designs.
  • SSTL_18 Interface - Industry-standard Stub Series Terminated Logic interface at 1.8V ensures compatibility with common memory controllers and simplifies integration into existing designs.
  • Commercial Temperature Range - Operating temperature range of 0°C to 85°C (case temperature) supports deployment in standard commercial environments and many industrial applications.
  • Compact TFBGA Package - 60-ball Thin Fine-pitch Ball Grid Array (8x10.5mm footprint) offers space-efficient board layout for designs where PCB real estate is at a premium.

Typical Applications

  • Embedded Computing Systems - This DDR2 SDRAM serves as main memory in embedded processors and SoCs where the 333MHz speed and 512Mb density balance performance requirements with cost-effectiveness for applications like set-top boxes and network equipment.
  • Consumer Electronics - The low 1.8V operating voltage and compact TFBGA package make this memory suitable for portable devices and consumer products where power efficiency and small form factor are critical design considerations.
  • Industrial Control Systems - With a 0°C to 85°C operating range, this SDRAM provides reliable memory storage for industrial controllers and automation equipment operating in climate-controlled environments.
  • Networking Equipment - The 333MHz clock frequency and 4.5ns access time support buffering and packet processing requirements in routers, switches, and other network infrastructure operating at moderate data rates.
  • Display and Graphics Systems - The 64M x 8 organization and DDR2 interface enable frame buffer applications in display controllers and basic graphics systems requiring moderate resolution and refresh rates.

Unique Advantages

  • Proven DDR2 Technology: Benefits from mature DDR2 ecosystem with broad controller support, reducing development time and design risk compared to adopting newer memory technologies.
  • Simplified Power Design: 1.8V operation consolidates voltage rails in systems already using this common supply voltage, reducing BOM cost and board complexity.
  • Active Lifecycle Status: Currently active product ensures long-term availability for designs requiring stable supply chains and multi-year production runs.
  • Space-Efficient Footprint: 60-ball TFBGA in 8x10.5mm package minimizes board area usage compared to larger package options, enabling compact product designs.
  • Standard Interface Compatibility: SSTL_18 interface ensures drop-in compatibility with existing DDR2 memory controllers and reference designs, accelerating time to market.
  • Balanced Performance Profile: 333MHz operation at 4.5ns access time provides sufficient performance for cost-sensitive applications without overengineering for unnecessary speed grades.

Why Choose IS43DR86400D-3DBL-TR?

The IS43DR86400D-3DBL-TR represents a practical choice for designs requiring established DDR2 memory technology with moderate density and speed specifications. Its 512Mb capacity and 333MHz operation address the needs of embedded systems, consumer electronics, and industrial applications where proven technology, power efficiency, and cost-effectiveness take priority over maximum performance. The commercial temperature range and compact TFBGA package suit standard operating environments while maintaining a small footprint.

For engineers developing products with multi-year lifecycles, this active-status memory device from ISSI offers supply chain stability backed by a mature DDR2 ecosystem. The standard SSTL_18 interface and widely-supported 64M x 8 organization simplify integration with existing controller platforms and reference designs.

Request a Quote

Contact our sales team to discuss your memory requirements and receive pricing for the IS43DR86400D-3DBL-TR. Our technical support staff can assist with integration questions, design resources, and volume availability to support your project timeline.

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