IS43DR86400E-25DBLI
| Part Description |
IC DRAM 512MBIT PAR 60TWBGA |
|---|---|
| Quantity | 573 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 60-TWBGA (8x10.5) | Memory Format | DRAM | Technology | SDRAM - DDR2 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 400 ps | Grade | Industrial | ||
| Clock Frequency | 400 MHz | Voltage | 1.7V ~ 1.9V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS43DR86400E-25DBLI - 512Mbit DDR2 SDRAM
The IS43DR86400E-25DBLI is a high-performance 512Mbit DDR2 SDRAM memory IC from ISSI, Integrated Silicon Solution Inc. Built on proven DDR2 synchronous DRAM technology, this device is organized as 64M x 8 and operates at a clock frequency of 400MHz. Designed for applications requiring fast, reliable parallel memory access, this DRAM offers extended temperature performance from -40°C to 85°C, making it well-suited for industrial and embedded systems that demand consistent operation across varied environmental conditions.
Key Features
- Memory Configuration - 512Mbit capacity organized as 64M x 8, providing flexible memory architecture for embedded applications requiring byte-wide data paths.
- DDR2 Technology - Operates at 400MHz clock frequency with 0.4ns access time, delivering the performance benefits of double data rate architecture for bandwidth-intensive applications.
- Power Supply - 1.7V to 1.9V operating voltage range supports low-power design requirements while maintaining performance.
- Extended Temperature Range - Rated for -40°C to 85°C ambient temperature operation, ensuring reliable performance in industrial environments.
- Compact Package - 60-TWBGA (8x10.5mm) package delivers high memory density in a space-efficient form factor suitable for size-constrained designs.
- Parallel Interface - Direct parallel memory interface simplifies integration with microcontrollers, FPGAs, and processors requiring traditional memory architectures.
Typical Applications
- Industrial Control Systems - This DDR2 SDRAM provides working memory for PLCs and industrial controllers where the extended temperature range ensures reliable operation in factory floor environments and the parallel interface integrates seamlessly with industrial processor architectures.
- Embedded Computing - Serves as main memory in embedded systems and SBCs where the 512Mbit capacity supports moderate application code and data requirements while the compact TWBGA package minimizes board space.
- Networking Equipment - Functions as buffer memory in routers, switches, and network appliances where DDR2 bandwidth handles packet processing workloads and industrial temperature tolerance supports equipment room deployments.
- Test and Measurement Instruments - Provides data acquisition buffering in oscilloscopes, analyzers, and measurement devices where reliable memory operation across temperature extremes is critical for field use.
- Medical Devices - Supports memory requirements in medical equipment and diagnostic instruments where proven DDR2 technology offers long-term availability and the wide temperature range accommodates varied installation environments.
Unique Advantages
- Extended Temperature Operation: The -40°C to 85°C rating eliminates the need for additional thermal management in many industrial applications, reducing system complexity and BOM cost.
- Proven DDR2 Architecture: Leveraging mature DDR2 technology provides excellent long-term supply availability and reduces qualification risk compared to newer memory types.
- Right-Sized Capacity: 512Mbit density fits many embedded and industrial applications without over-specifying, optimizing cost per design while avoiding the need for external memory expansion.
- Parallel Interface Compatibility: Direct parallel connection simplifies PCB layout and reduces design time compared to serial memory interfaces, particularly in processor-centric architectures.
- Compact TWBGA Footprint: The 8x10.5mm package size enables high-density layouts in space-constrained industrial and embedded products.
- Industrial-Grade Reliability: Operating characteristics and temperature range align with industrial system requirements, improving product reliability in demanding environments.
Why Choose IS43DR86400E-25DBLI?
For industrial and embedded system designers requiring reliable, proven memory technology with extended temperature capabilities, the IS43DR86400E-25DBLI offers an optimal balance of performance, capacity, and environmental tolerance. The 512Mbit DDR2 architecture delivers sufficient bandwidth for control systems, networking applications, and instrumentation without the complexity and cost of higher-density solutions. Its parallel interface and compact TWBGA package simplify integration into existing designs while supporting space-efficient layouts.
This memory IC is particularly well-suited for products with multi-year lifecycles where proven technology, industrial temperature operation, and long-term availability are essential. Whether upgrading legacy designs or developing new industrial systems, the IS43DR86400E-25DBLI provides dependable memory performance backed by ISSI's commitment to the industrial and embedded markets.
Get a Quote
Contact our sales team to discuss your project requirements and receive pricing for the IS43DR86400E-25DBLI. Our technical support staff can assist with integration questions and provide additional documentation to accelerate your design cycle.
