IS45S16160J-7TLA2
| Part Description |
IC DRAM 256MBIT PAR 54TSOP II |
|---|---|
| Quantity | 1,131 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Automotive | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of IS45S16160J-7TLA2 - 256Mbit SDRAM for Industrial Applications
The IS45S16160J-7TLA2 from ISSI is a 256Mbit synchronous dynamic random access memory (SDRAM) chip designed for systems requiring fast, reliable volatile memory. Organized as 16M x 16, this SDRAM operates at clock frequencies up to 143MHz with a 5.4ns access time. Its extended temperature range of -40°C to 105°C makes it suitable for industrial and automotive-adjacent applications where standard commercial-grade memory cannot reliably operate.
Key Features
- Memory Architecture - 256Mbit capacity organized as 16M x 16, providing flexible addressing for embedded systems and processor-based designs.
- Performance - Operates at up to 143MHz clock frequency with 5.4ns access time, supporting high-throughput data operations for real-time applications.
- Power Supply - 3V to 3.6V operating voltage aligns with modern low-power microcontrollers and processors, simplifying power rail design.
- Extended Temperature Range - Rated for -40°C to 105°C ambient temperature operation, ensuring reliable performance in harsh industrial environments.
- Package - Available in a 54-pin TSOP II (10.16mm width) package, a proven form factor for space-constrained PCB layouts.
- Interface - Parallel interface provides straightforward integration with legacy processors and controllers without requiring specialized high-speed serial protocols.
Typical Applications
- Industrial Control Systems - This SDRAM provides working memory for programmable logic controllers (PLCs) and distributed control systems where the extended temperature tolerance ensures reliable operation in factory floor and outdoor installations.
- Embedded Computing Platforms - Serves as main system memory for single-board computers and embedded modules in applications such as kiosks, medical devices, and test equipment where volatile memory with proven reliability is essential.
- Automotive Infotainment and Telematics - The wide temperature range makes this SDRAM suitable for in-cabin systems and telematics modules that must function reliably across seasonal temperature extremes and direct sunlight exposure.
- Communications Infrastructure - Provides buffering and processing memory for routers, switches, and base station equipment deployed in outdoor cabinets or non-climate-controlled environments.
- Legacy System Upgrades - Offers a drop-in memory solution for extending the life of established designs that require parallel interface SDRAM with enhanced temperature specifications.
Unique Advantages
- Reduced Component Count: The 16M x 16 organization matches common data bus widths, minimizing the need for multiple memory chips or complex interleaving.
- Simplified Thermal Management: Extended temperature rating eliminates the need for active cooling or thermal protection circuits in many industrial designs, reducing BOM cost and mechanical complexity.
- Design Continuity: Maintains compatibility with existing parallel memory controller designs, allowing engineers to upgrade capacity or temperature specifications without redesigning the memory subsystem.
- Long-Term Availability: Active lifecycle status from ISSI provides confidence for designs with multi-year production horizons and field serviceability requirements.
- Proven Technology: SDRAM architecture offers predictable timing characteristics and well-understood design practices, reducing validation time compared to newer memory technologies.
- Cost-Effective Scaling: Volatile DRAM architecture delivers high density at lower cost per bit than non-volatile alternatives when persistent storage is not required.
Why Choose IS45S16160J-7TLA2?
The IS45S16160J-7TLA2 is positioned for engineers who need reliable, temperature-hardened memory in industrial and embedded applications. Its combination of extended operating range, proven SDRAM architecture, and parallel interface makes it ideal for designs prioritizing robustness and long-term supportability over cutting-edge performance. This component is particularly well-suited for system upgrades, replacement designs, and new products targeting harsh environments where commercial-grade memory would be inadequate.
For applications requiring proven volatile memory with industrial temperature tolerance and straightforward integration, the IS45S16160J-7TLA2 delivers the reliability and specifications needed for long production runs and field deployments.
Get a Quote
Contact our sales team to request pricing and availability for the IS45S16160J-7TLA2. Our technical support staff can assist with integration questions, reference designs, and volume pricing for your project requirements.
