IS45S16160J-7CTLA2-TR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 498 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeAutomotive
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS45S16160J-7CTLA2-TR - 256Mbit Synchronous DRAM

The IS45S16160J-7CTLA2-TR is a 256-megabit synchronous DRAM (SDRAM) designed for high-performance embedded applications requiring reliable parallel memory access. Organized as 16M x 16, this device operates at clock frequencies up to 143 MHz with a 5.4 ns access time, providing efficient data throughput for systems demanding responsive memory performance. Its extended temperature range of -40°C to 105°C makes it suitable for industrial and automotive environments where standard commercial-grade memory may not be reliable.

This SDRAM combines proven volatile memory technology with a 3V to 3.6V supply voltage, simplifying power management in mixed-voltage designs. The 54-pin TSOP II package offers a compact footprint for space-constrained applications while maintaining robust connectivity for parallel interfacing.

Key Features

  • Memory Architecture - 256Mbit capacity organized as 16M x 16, providing flexible data width for word-oriented processing and reducing external multiplexing requirements.
  • Performance - Operates at clock frequencies up to 143 MHz with 5.4 ns access time, enabling rapid data retrieval for time-sensitive embedded applications.
  • Power Supply - 3V to 3.6V operating voltage aligns with standard 3.3V logic systems, simplifying voltage regulation and reducing component count.
  • Temperature Range - Extended -40°C to 105°C operating range ensures reliable performance in industrial control systems, automotive subsystems, and outdoor equipment exposed to temperature extremes.
  • Package - 54-pin TSOP II package in 10.16mm width provides a standardized form factor for automated assembly and efficient PCB layout.
  • Interface - Parallel memory interface allows direct connection to microcontrollers and processors without serial conversion overhead.

Typical Applications

  • Industrial Control Systems - This SDRAM provides working memory for programmable logic controllers (PLCs) and human-machine interfaces (HMIs) where the extended temperature range ensures consistent operation in factory floor environments with minimal climate control.
  • Automotive Infotainment - Serves as buffer memory for display controllers and audio processing units in vehicle dashboards, where the -40°C to 105°C rating accommodates cabin temperature extremes during cold starts and summer heat.
  • Medical Instrumentation - Functions as data acquisition memory in portable diagnostic devices and patient monitoring equipment, where the 256Mbit capacity supports real-time waveform capture and analysis buffers.
  • Networking Equipment - Acts as packet buffer memory in managed switches and routers deployed in outdoor enclosures or industrial settings, where temperature tolerance reduces field failures.
  • Test and Measurement - Provides high-speed sample storage for oscilloscopes and logic analyzers, where the 143 MHz clock support enables capture of fast digital signals without bottlenecking acquisition rates.

Unique Advantages

  • Proven SDRAM Technology: Mature synchronous DRAM architecture offers predictable timing characteristics and broad ecosystem support, reducing design risk compared to newer memory technologies.
  • Extended Temperature Qualification: -40°C to 105°C operation eliminates the need for thermal management in many industrial applications, reducing BOM cost and enclosure complexity.
  • Single Supply Operation: 3V to 3.6V range allows direct connection to 3.3V system rails without level shifters, simplifying power distribution and improving noise margins.
  • Parallel Interface Efficiency: Direct parallel access eliminates protocol overhead and latency associated with serial memory, improving determinism for real-time control loops.
  • Standard Package Footprint: TSOP II form factor enables second-sourcing and design reuse across product families, reducing inventory complexity and qualifying alternative suppliers.
  • Active Lifecycle Status: Current production availability supports long-term design-in commitments and reduces obsolescence risk for products with multi-year production cycles.

Why Choose the IS45S16160J-7CTLA2-TR?

The IS45S16160J-7CTLA2-TR is positioned for embedded system designers who need reliable, temperature-tolerant memory for industrial and automotive applications. Its combination of 256Mbit capacity, extended temperature range, and parallel interface makes it particularly suitable for control systems, instrumentation, and vehicular electronics where environmental stress and real-time response are critical design constraints. The TSOP II package and standard voltage operation facilitate integration into existing designs with minimal circuit modifications.

For applications requiring predictable memory performance across harsh operating conditions, this SDRAM delivers proven technology with active manufacturing support. The device is ideal for designs prioritizing reliability and temperature tolerance over the highest density or lowest power consumption available in consumer-grade memory products.

Contact Us for Pricing and Availability

Request a quote for the IS45S16160J-7CTLA2-TR or contact our sales team to discuss your memory requirements, volume pricing, and lead times. Our technical support staff can assist with design integration, timing analysis, and PCB layout recommendations to ensure optimal performance in your application.

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