IS45S16400J-7CTLA2
| Part Description |
IC DRAM 64MBIT PAR 54TSOP II |
|---|---|
| Quantity | 63 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Automotive | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS45S16400J-7CTLA2 – 64Mbit SDRAM, Parallel, 54-TSOP II
The IS45S16400J-7CTLA2 is a 64 Mbit volatile SDRAM device organized as 4M × 16 with a parallel memory interface. It delivers predictable random-access memory performance with a specified clock frequency of 143 MHz and an access time of 5.4 ns.
Designed for systems that require a compact 54-TSOP II package and wide operating conditions, this SDRAM is suited to embedded and industrial applications needing a stable 3.0–3.6 V supply and an operating temperature range from −40°C to 105°C.
Key Features
- Memory Type & Organization 64 Mbit SDRAM organized as 4M × 16, providing parallel-access memory in a standard DRAM format.
- Performance Clock frequency rated at 143 MHz with an access time of 5.4 ns for rapid read/write cycles within its specified timing.
- Voltage & Power Operates from 3.0 V to 3.6 V supply voltage, supporting 3 V-class system designs.
- Package Available in a 54-pin TSOP II (0.400", 10.16 mm width) package for space-efficient board-level integration.
- Interface Parallel memory interface suitable for designs that map external DRAM into system memory buses.
- Environmental Range Rated for an operating ambient temperature range of −40°C to 105°C (TA), supporting extended-temperature deployments.
Typical Applications
- Embedded Systems Provides external DRAM capacity for microcontroller- and FPGA-based designs requiring parallel memory expansion.
- Consumer Electronics Acts as system memory in devices that use parallel SDRAM architectures and operate on a 3 V supply rail.
- Industrial Control Supports industrial equipment that benefits from the wide −40°C to 105°C operating temperature range.
- Networking and Communication Modules Suitable for modules needing parallel SDRAM storage with 143 MHz clocking and fast access times for buffering tasks.
Unique Advantages
- Parallel Interface Compatibility Straightforward integration into parallel memory buses used in legacy and custom memory-mapped designs.
- Compact TSOP II Package 54-pin TSOP (0.400", 10.16 mm) reduces PCB footprint while maintaining accessible pinout for board routing.
- Wide Operating Temperature −40°C to 105°C rating enables deployment in thermally demanding and industrial environments.
- 3 V Supply Range 3.0–3.6 V operation aligns with common 3 V system power rails for easy power-domain integration.
- Deterministic Performance Specs Documented clock frequency (143 MHz) and access time (5.4 ns) allow predictable memory timing in system design.
- Industry-Standard DRAM Format Uses established SDRAM architecture and organization (4M × 16) for compatibility with standard memory controller approaches.
Why Choose IC DRAM 64MBIT PAR 54TSOP II?
The IS45S16400J-7CTLA2 positions itself as a practical SDRAM option for designs that require a 64 Mbit parallel memory device in a compact 54-TSOP II package. Its combination of documented timing (143 MHz clock, 5.4 ns access time), 3.0–3.6 V operation, and a wide −40°C to 105°C temperature range supports reliable integration into embedded, consumer, and industrial systems.
This device is suited for engineers and procurement teams seeking a vendor-backed SDRAM building block with clear electrical and mechanical specifications, enabling predictable memory performance and straightforward board-level integration.
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