IS45S32800L-6TLA1-TR
| Part Description |
AUTOMOTIVE (-40 TO +85C), 256M, |
|---|---|
| Quantity | 557 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Automotive | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | LVTTL | Memory Organization | 8M x 32 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | N/A | REACH Compliance | REACH Unknown | ||
| Qualification | AEC-Q100 | ECCN | N/A | HTS Code | N/A |
Overview of IS45S32800L-6TLA1-TR – AUTOMOTIVE (-40 TO +85C), 256M
The IS45S32800L-6TLA1-TR is a 256 Mbit volatile SDRAM organized as 8M × 32 in DRAM format. It provides high-speed memory access with a 166 MHz clock frequency and a 5.4 ns access time, using an LVTTL memory interface and a 3.0–3.6 V supply range.
Designed for automotive-grade applications, the device carries AEC-Q100 qualification and supports an operating temperature range of −40°C to +85°C. The part is offered in an 86-TSOP II (86-TFSOP, 10.16 mm width) surface-mount package suitable for board-level integration.
Key Features
- Memory Architecture 8M × 32 organization delivering 256 Mbit of volatile SDRAM storage in DRAM format.
- Performance 166 MHz clock frequency with 5.4 ns access time to support high-speed memory operations.
- Interface LVTTL memory interface for standard digital signal levels.
- Voltage Operates from 3.0 V to 3.6 V to match common 3V automotive domains.
- Temperature & Qualification AEC‑Q100 qualification and an operating temperature range of −40°C to +85°C for automotive-grade use.
- Package 86-TSOP II / 86-TFSOP surface-mount package (0.400", 10.16 mm width) for compact PCB layouts.
Typical Applications
- Automotive systems Memory element for electronic control units and other in-vehicle modules that require AEC‑Q100 qualification and extended temperature operation.
- High-speed buffer memory Temporary data storage where 256 Mbit SDRAM capacity with 166 MHz clocking and 5.4 ns access is required.
- Embedded memory subsystems Integration into designs that use a 3.0–3.6 V LVTTL interface and TSOP II footprint for surface-mount assemblies.
Unique Advantages
- AEC‑Q100 Qualification: Meets automotive qualification requirements for applications that specify certified components.
- Extended Temperature Range: −40°C to +85°C operation supports deployment across typical automotive thermal environments.
- Compact TSOP II Package: 86-TSOP II footprint (10.16 mm width) enables space-efficient PCB implementation.
- Fast Access and Clocking: 5.4 ns access time and 166 MHz clock frequency provide responsive memory performance.
- Standard LVTTL Interface: Simplifies signal-level integration with common digital systems.
- Wide Supply Window: 3.0–3.6 V supply range aligns with standard 3V automotive power domains.
Why Choose IS45S32800L-6TLA1-TR?
The IS45S32800L-6TLA1-TR positions itself as a qualified automotive SDRAM solution that combines 256 Mbit density, fast access performance, and a standard LVTTL interface. Its AEC‑Q100 qualification and −40°C to +85°C operating range make it suitable for designs that require verified automotive-grade components.
This device is appropriate for engineers specifying board-level SDRAM in space-constrained designs that need a TSOP II package and a 3.0–3.6 V supply domain. The combination of capacity, speed, qualification, and package supports reliable integration into automotive memory subsystems.
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