IS45S32800L-6TLA1-TR

AUTOMOTIVE (-40 TO +85C), 256M,
Part Description

AUTOMOTIVE (-40 TO +85C), 256M,

Quantity 557 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package86-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeAutomotive
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging86-TFSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceLVTTLMemory Organization8M x 32
Moisture Sensitivity LevelN/ARoHS ComplianceN/AREACH ComplianceREACH Unknown
QualificationAEC-Q100ECCNN/AHTS CodeN/A

Overview of IS45S32800L-6TLA1-TR – AUTOMOTIVE (-40 TO +85C), 256M

The IS45S32800L-6TLA1-TR is a 256 Mbit volatile SDRAM organized as 8M × 32 in DRAM format. It provides high-speed memory access with a 166 MHz clock frequency and a 5.4 ns access time, using an LVTTL memory interface and a 3.0–3.6 V supply range.

Designed for automotive-grade applications, the device carries AEC-Q100 qualification and supports an operating temperature range of −40°C to +85°C. The part is offered in an 86-TSOP II (86-TFSOP, 10.16 mm width) surface-mount package suitable for board-level integration.

Key Features

  • Memory Architecture 8M × 32 organization delivering 256 Mbit of volatile SDRAM storage in DRAM format.
  • Performance 166 MHz clock frequency with 5.4 ns access time to support high-speed memory operations.
  • Interface LVTTL memory interface for standard digital signal levels.
  • Voltage Operates from 3.0 V to 3.6 V to match common 3V automotive domains.
  • Temperature & Qualification AEC‑Q100 qualification and an operating temperature range of −40°C to +85°C for automotive-grade use.
  • Package 86-TSOP II / 86-TFSOP surface-mount package (0.400", 10.16 mm width) for compact PCB layouts.

Typical Applications

  • Automotive systems Memory element for electronic control units and other in-vehicle modules that require AEC‑Q100 qualification and extended temperature operation.
  • High-speed buffer memory Temporary data storage where 256 Mbit SDRAM capacity with 166 MHz clocking and 5.4 ns access is required.
  • Embedded memory subsystems Integration into designs that use a 3.0–3.6 V LVTTL interface and TSOP II footprint for surface-mount assemblies.

Unique Advantages

  • AEC‑Q100 Qualification: Meets automotive qualification requirements for applications that specify certified components.
  • Extended Temperature Range: −40°C to +85°C operation supports deployment across typical automotive thermal environments.
  • Compact TSOP II Package: 86-TSOP II footprint (10.16 mm width) enables space-efficient PCB implementation.
  • Fast Access and Clocking: 5.4 ns access time and 166 MHz clock frequency provide responsive memory performance.
  • Standard LVTTL Interface: Simplifies signal-level integration with common digital systems.
  • Wide Supply Window: 3.0–3.6 V supply range aligns with standard 3V automotive power domains.

Why Choose IS45S32800L-6TLA1-TR?

The IS45S32800L-6TLA1-TR positions itself as a qualified automotive SDRAM solution that combines 256 Mbit density, fast access performance, and a standard LVTTL interface. Its AEC‑Q100 qualification and −40°C to +85°C operating range make it suitable for designs that require verified automotive-grade components.

This device is appropriate for engineers specifying board-level SDRAM in space-constrained designs that need a TSOP II package and a 3.0–3.6 V supply domain. The combination of capacity, speed, qualification, and package supports reliable integration into automotive memory subsystems.

Request a quote or submit a parts inquiry for IS45S32800L-6TLA1-TR to receive pricing and availability information for your design requirements.

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