IS46R16160F-6TLA2

IC DRAM 256MBIT PAR 66TSOP II
Part Description

IC DRAM 256MBIT PAR 66TSOP II

Quantity 451 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size256 MbitAccess Time700 psGradeAutomotive
Clock Frequency166 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS46R16160F-6TLA2 - 256Mbit DDR SDRAM for Extended Temperature Applications

The IS46R16160F-6TLA2 is a 256Mbit DDR SDRAM memory device organized as 16M x 16, delivering high-performance volatile memory in a compact 66-pin TSOP II package. With a 166MHz clock frequency and 7ns access time, this ISSI memory solution provides reliable data storage and retrieval for embedded systems requiring extended temperature operation from -40°C to 105°C.

Key Features

  • Memory Architecture - 256Mbit capacity configured as 16M x 16 organization with parallel interface for straightforward integration into existing memory bus designs.
  • DDR SDRAM Technology - Double Data Rate synchronous DRAM operates at 166MHz clock frequency, transferring data on both rising and falling clock edges for efficient bandwidth utilization.
  • Fast Access Time - 7ns access time with 15ns write cycle time enables responsive memory operations in time-sensitive applications.
  • Extended Temperature Range - Operates across -40°C to 105°C ambient temperature range, suitable for industrial and automotive environments with challenging thermal conditions.
  • Low Voltage Operation - 2.3V to 2.7V supply voltage reduces power consumption while maintaining performance.
  • Compact Package - 66-pin TSOP II form factor (10.16mm width) provides space-efficient PCB footprint for designs with area constraints.

Typical Applications

  • Industrial Control Systems - This DDR SDRAM provides reliable memory for PLCs, HMIs, and industrial computers where extended temperature tolerance ensures stable operation in factory floor environments and outdoor installations.
  • Automotive Electronics - The wide temperature range supports automotive applications such as infotainment systems, instrument clusters, and navigation units that must function reliably in both extreme cold and high-heat cabin conditions.
  • Networking Equipment - The 166MHz operation and parallel interface make this memory suitable for routers, switches, and access points requiring buffer memory for packet processing in temperature-variable deployment environments.
  • Medical Instrumentation - Extended temperature capability supports diagnostic equipment and patient monitoring systems that may operate in varying environmental conditions while requiring consistent memory performance.
  • Military and Aerospace Systems - The robust temperature specification addresses requirements for defense electronics, avionics, and ground support equipment operating in harsh environmental conditions.

Unique Advantages

  • Proven DDR Technology: Utilizes mature SDRAM architecture with broad ecosystem support, reducing development risk and enabling faster time-to-market.
  • Temperature-Hardened Design: Extended -40°C to 105°C operating range eliminates the need for additional thermal management in many applications, simplifying system design.
  • Efficient Power Profile: Low voltage operation minimizes power consumption and heat generation, contributing to overall system reliability and energy efficiency.
  • Standard Parallel Interface: Parallel memory bus provides straightforward integration with existing controller architectures without protocol translation overhead.
  • Space-Optimized Packaging: TSOP II form factor delivers high pin count in a compact footprint, maximizing board real estate for other components.
  • Active Lifecycle Status: Ongoing production availability supports long product lifecycles typical of industrial and automotive designs.

Why Choose IS46R16160F-6TLA2?

The IS46R16160F-6TLA2 addresses the specific needs of embedded system designers requiring dependable memory performance across extreme temperature ranges. ISSI's expertise in memory solutions ensures reliable operation in industrial, automotive, and other demanding environments where component failure is not an option. The combination of proven DDR technology, extended temperature capability, and active production status makes this device particularly well-suited for long-lifecycle designs with stringent environmental requirements.

For applications requiring 256Mbit memory density with parallel interface and enhanced temperature tolerance, the IS46R16160F-6TLA2 provides a balanced solution that simplifies system architecture while meeting performance and reliability targets.

Get Started with IS46R16160F-6TLA2

To discuss how the IS46R16160F-6TLA2 can meet your specific memory requirements, request a detailed quote or contact our technical sales team for application support and volume pricing.

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