IS46R16320D-5BLA1

IC DRAM 512MBIT PAR 60TFBGA
Part Description

IC DRAM 512MBIT PAR 60TFBGA

Quantity 829 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging60-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS46R16320D-5BLA1 – IC DRAM 512MBIT PAR 60TFBGA

The IS46R16320D-5BLA1 is a 512‑Mbit DDR SDRAM organized as 32M × 16 with a parallel memory interface in a 60‑TFBGA (8×13) package. It uses a double‑data‑rate pipeline architecture with four internal banks to enable continuous read/write burst accesses and programmable timing options.

Designed for systems that require a 512‑Mbit DDR memory solution, this device delivers SSTL_2 compatible I/O, differential clocking, and a 2.5–2.7 V supply range with an operating temperature of −40°C to +85°C.

Key Features

  • Memory Core  512 Mbit DDR SDRAM, internally organized as four banks (32M × 16) to support concurrent operations and pipelined read/write bursts.
  • Double‑Data‑Rate Architecture  Two data transfers per clock cycle with DLL alignment; DQS is edge‑aligned for READs and centre‑aligned for WRITEs, enabling reliable data capture on both edges.
  • Performance  Clock frequency up to 200 MHz (Fck Max, CL = 3), access time of 700 ps, and write cycle time (word page) of 15 ns for burst‑oriented transfers.
  • Programmable Timing & Burst  Supports burst lengths of 2, 4 and 8, sequential and interleave burst types, and programmable CAS latencies of 2, 2.5 and 3.
  • Interface & I/O  Parallel memory interface with SSTL_2 compatible I/O, differential clock inputs (CK and /CK), and bidirectional data strobe (DQS) for synchronized data transfer.
  • Refresh & Power Modes  Auto Refresh and Self Refresh modes plus Auto Precharge and Data Mask (DM) support to mask write data on both DQS edges.
  • Supply Options  VDD and VDDQ supply options per device speed grade (2.5 V ±0.2 V and 2.6 V ±0.1 V); typical device supply range listed as 2.5 V to 2.7 V.
  • Package & Temperature  60‑TFBGA (8×13) ball count and industrial operating temperature range of −40°C to +85°C (TA).

Typical Applications

  • Board‑level system memory  Use as a 512‑Mbit DDR memory device where a 32M × 16 organization and parallel DDR interface are required.
  • High‑speed burst buffering  Suited for designs that leverage burst reads/writes and programmable CAS latency to match system timing.
  • Memory subsystems with SSTL_2 I/O  Integrates into platforms requiring SSTL_2 compatible signaling and differential clock inputs for synchronized data capture.

Unique Advantages

  • DDR pipeline architecture: Enables continuous read/write bursts and efficient throughput through internal bank interleaving.
  • Synchronized data capture: Bidirectional DQS and DLL alignment with differential clock inputs ensure data timing integrity on both edges.
  • Flexible timing options: Programmable CAS latencies and selectable burst lengths allow designers to tune performance to system requirements.
  • Wide operating range: 2.5 V–2.7 V supply support and −40°C to +85°C operating temperature provide suitability for industrial temperature applications.
  • Compact package: 60‑TFBGA (8×13) footprint provides high density for space‑constrained board designs.

Why Choose IS46R16320D-5BLA1?

The IS46R16320D-5BLA1 is positioned as a compact, configurable 512‑Mbit DDR SDRAM solution for designs that require pipelined burst performance, SSTL_2 compatible I/O, and differential clocking. Its programmable burst and latency options, combined with four internal banks and DLL‑aligned data paths, offer design flexibility for a range of memory subsystem requirements.

This device is well suited to engineers and procurement teams seeking a verified 32M × 16 DDR memory component with industrial temperature support, a 60‑TFBGA package, and supply options aligned to standard DDR signaling levels.

To request a quote or submit a sourcing inquiry for IS46R16320D-5BLA1, please reach out with your required quantity and delivery timeframe so we can provide pricing and availability details.

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