IS46R16320D-5BLA1
| Part Description |
IC DRAM 512MBIT PAR 60TFBGA |
|---|---|
| Quantity | 829 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 60-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.5V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS46R16320D-5BLA1 – IC DRAM 512MBIT PAR 60TFBGA
The IS46R16320D-5BLA1 is a 512‑Mbit DDR SDRAM organized as 32M × 16 with a parallel memory interface in a 60‑TFBGA (8×13) package. It uses a double‑data‑rate pipeline architecture with four internal banks to enable continuous read/write burst accesses and programmable timing options.
Designed for systems that require a 512‑Mbit DDR memory solution, this device delivers SSTL_2 compatible I/O, differential clocking, and a 2.5–2.7 V supply range with an operating temperature of −40°C to +85°C.
Key Features
- Memory Core 512 Mbit DDR SDRAM, internally organized as four banks (32M × 16) to support concurrent operations and pipelined read/write bursts.
- Double‑Data‑Rate Architecture Two data transfers per clock cycle with DLL alignment; DQS is edge‑aligned for READs and centre‑aligned for WRITEs, enabling reliable data capture on both edges.
- Performance Clock frequency up to 200 MHz (Fck Max, CL = 3), access time of 700 ps, and write cycle time (word page) of 15 ns for burst‑oriented transfers.
- Programmable Timing & Burst Supports burst lengths of 2, 4 and 8, sequential and interleave burst types, and programmable CAS latencies of 2, 2.5 and 3.
- Interface & I/O Parallel memory interface with SSTL_2 compatible I/O, differential clock inputs (CK and /CK), and bidirectional data strobe (DQS) for synchronized data transfer.
- Refresh & Power Modes Auto Refresh and Self Refresh modes plus Auto Precharge and Data Mask (DM) support to mask write data on both DQS edges.
- Supply Options VDD and VDDQ supply options per device speed grade (2.5 V ±0.2 V and 2.6 V ±0.1 V); typical device supply range listed as 2.5 V to 2.7 V.
- Package & Temperature 60‑TFBGA (8×13) ball count and industrial operating temperature range of −40°C to +85°C (TA).
Typical Applications
- Board‑level system memory Use as a 512‑Mbit DDR memory device where a 32M × 16 organization and parallel DDR interface are required.
- High‑speed burst buffering Suited for designs that leverage burst reads/writes and programmable CAS latency to match system timing.
- Memory subsystems with SSTL_2 I/O Integrates into platforms requiring SSTL_2 compatible signaling and differential clock inputs for synchronized data capture.
Unique Advantages
- DDR pipeline architecture: Enables continuous read/write bursts and efficient throughput through internal bank interleaving.
- Synchronized data capture: Bidirectional DQS and DLL alignment with differential clock inputs ensure data timing integrity on both edges.
- Flexible timing options: Programmable CAS latencies and selectable burst lengths allow designers to tune performance to system requirements.
- Wide operating range: 2.5 V–2.7 V supply support and −40°C to +85°C operating temperature provide suitability for industrial temperature applications.
- Compact package: 60‑TFBGA (8×13) footprint provides high density for space‑constrained board designs.
Why Choose IS46R16320D-5BLA1?
The IS46R16320D-5BLA1 is positioned as a compact, configurable 512‑Mbit DDR SDRAM solution for designs that require pipelined burst performance, SSTL_2 compatible I/O, and differential clocking. Its programmable burst and latency options, combined with four internal banks and DLL‑aligned data paths, offer design flexibility for a range of memory subsystem requirements.
This device is well suited to engineers and procurement teams seeking a verified 32M × 16 DDR memory component with industrial temperature support, a 60‑TFBGA package, and supply options aligned to standard DDR signaling levels.
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