M24D6488PA (2A)
| Part Description |
Xccela PSRAM, 1.8V |
|---|---|
| Quantity | 582 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 24 ball BGA | Memory Format | SRAM | Technology | PSRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | N/A | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.5V | Memory Type | Volatile | ||
| Operating Temperature | -40°C – 85°C | Write Cycle Time Word Page | N/A | Packaging | 24 ball BGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 8M x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of M24D6488PA (2A) – Xccela PSRAM, 1.8V
The M24D6488PA (2A) from ESMT is a PSRAM device organized as 8M × 8 with a parallel memory interface and volatile SRAM architecture. It is specified with a 200 MHz clock frequency and a 2.5 V supply, designed and qualified for industrial use.
With JEDEC qualification, surface-mount 24-ball BGA packaging, RoHS compliance and an operating temperature range of −40 °C to 85 °C, this part targets industrial and embedded applications that require a compact, high-frequency parallel PSRAM solution.
Key Features
- Memory Type & Architecture Volatile SRAM implemented as PSRAM, organized 8M × 8 for byte-wide memory access.
- Performance 200 MHz clock frequency to support high-speed parallel memory transactions.
- Interface Parallel memory interface for direct, byte-wide connectivity to host controllers.
- Power Specified supply voltage: 2.5 V.
- Package & Mounting Surface-mount 24 ball BGA package for space-efficient PCB integration.
- Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 85 °C.
- Qualification & Compliance JEDEC qualification and RoHS compliant.
Typical Applications
- Industrial Control Suitable for industrial controllers and instrumentation that require reliable parallel volatile memory across −40 °C to 85 °C.
- Embedded Systems Local scratchpad or buffer memory for embedded processors using a parallel interface.
- Communications Equipment High-frequency parallel memory staging for data buffering in networking or telecom modules.
Unique Advantages
- High-speed Parallel Access: 200 MHz clock frequency supports fast parallel memory transfers for bandwidth-sensitive tasks.
- Industrial Temperature Range: Rated −40 °C to 85 °C to meet demanding environmental requirements in industrial deployments.
- Compact Surface-Mount Packaging: 24 ball BGA reduces PCB footprint while enabling robust surface-mount assembly.
- JEDEC Qualified: Qualification aligned with industry standards for predictable product behavior and supply chain consistency.
- Environmentally Compliant: RoHS compliance supports regulatory and corporate materials requirements.
Why Choose M24D6488PA (2A)?
The M24D6488PA (2A) combines a PSRAM architecture with a 200 MHz parallel interface and industrial-grade qualification to deliver a compact, high-frequency volatile memory option. Its 8M × 8 organization, 24 ball BGA surface-mount package, JEDEC qualification and extended temperature range make it suitable for embedded and industrial designs that require reliable parallel memory in a small form factor.
Manufactured by ESMT, this part is positioned for designs that prioritize predictable parallel memory performance, space-efficient integration, and long-term availability in industrial environments.
Request a quote or submit an inquiry to purchase the M24D6488PA (2A) and discuss volume availability and lead times with our sales team.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
Certifications and Memberships: N/A