MT29F32G08CFACAWP:C

The MT29F32G08CFACAWP:C is a 32 Gbit non-volatile FLASH NAND memory device supplied in a 48‑TSOP I package. It implements a parallel memory interface and a 4G x 8 memory organization, offering high-density storage in a compact board footprint.

This component is intended for systems that require parallel FLASH memory with defined supply and temperature ranges, enabling straightforward integration into embedded designs that accept a 48‑TSOP I package and a 2.7 V–3.6 V supply rail.

Key Features

• Memory Type & Technology Non-volatile FLASH memory using NAND architecture, providing persistent data storage.
• Density & Organization 32 Gbit capacity organized as 4G x 8 to support large firmware, code or data storage within a single device.
• Interface Parallel memory interface for direct byte-wide connectivity to compatible system buses.
• Voltage Supply Operates from 2.7 V to 3.6 V, compatible with common 3.3 V system power rails.
• Package 48‑TSOP I (48-TFSOP, 0.724", 18.40mm width) surface-mount package for compact PCB implementation.
• Operating Temperature Specified for 0°C to 70°C (TA), suitable for commercial temperature range applications.

Typical Applications

• Embedded Systems Provides non-volatile code and data storage using a parallel interface and 32 Gbit capacity for on-board firmware and resources.
• Consumer Electronics Compact 48‑TSOP I package and standard supply range allow integration into consumer devices requiring NAND FLASH storage.
• Industrial Equipment Commercial temperature support and a parallel interface make it suitable for industrial designs that employ non-volatile memory in standard thermal environments.

Unique Advantages

• High-density storage: 32 Gbit capacity in a single device reduces the need for multiple chips when large non-volatile memory is required.
• Byte-wide parallel interface: Simplifies integration with systems designed for parallel FLASH, enabling direct bus connectivity.
• Flexible supply voltage: 2.7 V–3.6 V operation supports common 3.3 V power domains and variations within that range.
• Compact standard package: 48‑TSOP I footprint (0.724", 18.40 mm width) eases PCB layout and supports dense board designs.
• Commercial temperature rating: Rated 0°C to 70°C (TA) for use in standard commercial-temperature applications.

Why Choose IC FLASH 32GBIT PAR 48TSOP I?

The MT29F32G08CFACAWP:C positions itself as a high-density parallel NAND FLASH solution for designs that require 32 Gbit of persistent storage in a 48‑TSOP I package. Its parallel interface, clear voltage window, and commercial temperature specification make it suitable for engineers specifying non-volatile memory for embedded, consumer, or industrial systems operating within the stated ambient range.

For design teams and procurement professionals seeking a straightforward parallel FLASH device with defined mechanical and electrical characteristics, this part provides a combination of capacity, interface compatibility, and a compact package to match common board-level requirements.

Request a quote or submit a procurement inquiry for MT29F32G08CFACAWP:C to obtain pricing, availability, and lead-time information.