MT29F512G08AUCBBH8-6:B TR
| Part Description |
IC FLASH 512GBIT PAR 152LBGA |
|---|---|
| Quantity | 956 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 152-LBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 152-LBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | N/A |
Overview of MT29F512G08AUCBBH8-6:B TR – 512Gbit Parallel NAND Flash, 152-LBGA
The MT29F512G08AUCBBH8-6:B TR is a 512 Gbit non-volatile FLASH NAND memory organized as 64G × 8 using SLC technology. It provides parallel memory interface connectivity and supports a 166 MHz clock frequency for timing-driven system integration.
Designed for applications requiring dense, parallel-access NAND storage, this device combines large capacity, a 152-LBGA (14×18) package, and a 2.7 V to 3.6 V supply window to fit a range of board-level storage implementations.
Key Features
- Memory Architecture 512 Gbit capacity organized as 64G × 8; FLASH NAND (SLC) technology.
- Interface Parallel memory interface suitable for parallel-access storage designs.
- Clock Supports a 166 MHz clock frequency for timing-driven operation.
- Power Operating supply voltage range from 2.7 V to 3.6 V.
- Package 152-LBGA package, supplier device package specified as 152-LBGA (14×18) for compact board integration.
- Operating Temperature Specified ambient operating range 0°C to 70°C (TA).
Typical Applications
- Embedded Storage — Parallel SLC NAND flash for systems requiring large non-volatile memory arrays.
- Firmware and Code Storage — High-capacity FLASH storage for firmware images and code footprint needs.
- Board-Level Memory Expansion — Single-package solution for adding significant NAND storage on PCBs with parallel interface requirements.
Unique Advantages
- Large On-Die Capacity: 512 Gbit of SLC NAND provides substantial storage in a single device, reducing the need for multiple components.
- Parallel Interface: Parallel memory access supports timing-centric system designs and straightforward integration with parallel memory controllers.
- Defined Clock Rate: 166 MHz clock support enables predictable timing behavior for system integration.
- Flexible Supply Range: 2.7 V to 3.6 V operating supply allows use across designs with common voltage rails.
- Compact Package: 152-LBGA (14×18) package provides a dense footprint for high-capacity memory in space-constrained boards.
- Commercial Temperature Range: 0°C to 70°C specified ambient allows deployment in standard commercial environments.
Why Choose IC FLASH 512GBIT PAR 152LBGA?
The MT29F512G08AUCBBH8-6:B TR positions itself as a high-capacity, parallel-access SLC NAND flash option combining 512 Gbit organization, a 166 MHz clock timing characteristic, and a compact 152-LBGA package. It is suited for designs that require significant non-volatile storage with parallel interface integration and predictable supply and temperature envelopes.
This device is appropriate for engineering teams and procurement seeking a single-package NAND solution that matches board-level constraints for capacity, voltage (2.7 V–3.6 V), and commercial temperature operation.
If you would like pricing, availability, or to request a quote for MT29F512G08AUCBBH8-6:B TR, please submit an inquiry to our sales team for assistance.
