MT29F512G08AUEBBH8-12:B

IC FLASH 512GBIT PAR 152LBGA
Part Description

IC FLASH 512GBIT PAR 152LBGA

Quantity 293 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package152-LBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size512 GbitAccess TimeN/AGradeCommercial
Clock Frequency83 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging152-LBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F512G08AUEBBH8-12:B – IC FLASH 512GBIT PAR 152LBGA

The MT29F512G08AUEBBH8-12:B is a 512 Gbit non-volatile NAND flash memory organized as 64G × 8 and implemented in SLC technology. It provides parallel memory access and is supplied in a 152‑LBGA (14 × 18 mm) package for board-level integration.

Key electrical and environmental parameters include an operating voltage range of 2.7 V to 3.6 V, a clock frequency of 83 MHz, and an ambient operating temperature range of 0°C to 70°C (TA).

Key Features

  • Memory Type and Capacity 512 Gbit NAND flash, organized as 64G × 8, implemented in SLC flash technology for non-volatile storage.
  • Interface Parallel memory interface for conventional parallel access patterns.
  • Clock Supports operation with a clock frequency of 83 MHz.
  • Voltage Supply Operates from 2.7 V to 3.6 V, enabling use with standard 3.3 V systems.
  • Package 152‑lead LBGA package (152‑LBGA, 14 × 18 mm) for compact board mounting.
  • Operating Temperature Specified ambient operating temperature range: 0°C to 70°C (TA).

Unique Advantages

  • High-density non-volatile storage: 512 Gbit capacity in a single device reduces the need for multiple memory components.
  • SLC flash technology: SLC implementation provides the specific NAND flash characteristics associated with that technology.
  • Parallel interface at 83 MHz: Parallel connectivity with a defined clock frequency supports predictable timing integration into existing parallel memory designs.
  • Flexible supply voltage: 2.7 V to 3.6 V supply range supports systems designed around common 3.3 V rails.
  • Compact LBGA package: 152‑LBGA (14 × 18 mm) minimizes board area while providing robust device mounting.

Why Choose IC FLASH 512GBIT PAR 152LBGA?

The MT29F512G08AUEBBH8-12:B positions itself as a high-density, SLC NAND flash device for designs that require parallel non-volatile memory with defined electrical and thermal limits. Its combination of 512 Gbit capacity, 83 MHz clock support, and 2.7 V–3.6 V supply range makes it suitable for systems that need substantial onboard storage within a 152‑LBGA footprint.

This device is appropriate for engineering teams and procurement focused on integrating a single-chip, high-capacity flash memory with explicit package, voltage, and operating temperature specifications for predictable system-level behavior.

For pricing, lead time, or to request a quote for MT29F512G08AUEBBH8-12:B, submit your request or contact sales to obtain availability and ordering information.

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