MT29F512G08AUEBBH8-12:B TR
| Part Description |
IC FLASH 512GBIT PAR 152LBGA |
|---|---|
| Quantity | 137 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 152-LBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 83 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 152-LBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F512G08AUEBBH8-12:B TR – IC FLASH 512GBIT PAR 152LBGA
The MT29F512G08AUEBBH8-12:B TR is a 512 Gbit non-volatile NAND flash memory device implemented as SLC flash with a parallel memory interface. It is organized as 64G × 8 and operates from a 2.7 V to 3.6 V supply with a specified clock frequency of 83 MHz.
This device is suited for systems requiring high-density parallel flash storage in a compact 152-LBGA (14×18) package and is specified for an ambient operating range of 0°C to 70°C.
Key Features
- Memory Core 512 Gbit non-volatile NAND flash implemented as SLC (Flash - NAND (SLC)), organized as 64G × 8 for byte-wide access.
- Interface Parallel memory interface for direct parallel data transfer between host and device.
- Performance Rated clock frequency of 83 MHz to match system timing requirements where specified.
- Power Supply Wide supply range from 2.7 V to 3.6 V to accommodate common 3.3 V system rails.
- Package & Mounting 152-LBGA package in a 14×18 mm footprint, designed for surface-mount board assembly.
- Operating Temperature Specified ambient operating range of 0°C to 70°C (TA).
Typical Applications
- Embedded Storage For systems that require 512 Gbit of parallel SLC NAND flash in a compact LBGA package.
- Firmware and Image Storage Suitable where non-volatile storage is needed for firmware, boot code, or system images within the device's voltage and temperature ranges.
- Data Logging Use in designs that need sustained non-volatile data retention with a parallel interface and the specified supply voltage.
Unique Advantages
- High Density in Compact Package: 512 Gbit capacity in a 152-LBGA (14×18) footprint reduces board area for high-capacity designs.
- SLC NAND Reliability: SLC technology as specified can support use cases that require single-level cell behavior.
- Wide Supply Compatibility: 2.7 V to 3.6 V operating range allows integration into 3.3 V and related power domains.
- Parallel Interface Simplicity: Parallel memory interface enables straightforward integration into systems designed around parallel flash architectures.
- Clear Environmental Specification: Defined operating range of 0°C to 70°C provides deterministic bounds for deployment and thermal design.
Why Choose IC FLASH 512GBIT PAR 152LBGA?
The IC FLASH 512GBIT PAR 152LBGA is positioned for designs that require a high-density, parallel SLC NAND flash device with a compact LBGA footprint. Its 64G × 8 organization, 83 MHz clock rating, and 2.7 V–3.6 V supply compatibility make it suitable for systems that need substantial non-volatile storage with predictable electrical and thermal envelopes.
This device is appropriate for engineers and procurement teams specifying parallel flash memory for embedded storage, firmware retention, or data logging applications where the provided package, voltage range, and operating temperature align with system requirements.
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