MT29F512G08AUCBBH8-6IT:B

IC FLASH 512GBIT PAR 152LBGA
Part Description

IC FLASH 512GBIT PAR 152LBGA

Quantity 1,714 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package152-LBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock Frequency166 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging152-LBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization64G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceN/AREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F512G08AUCBBH8-6IT:B – 512 Gbit Parallel NAND Flash, 152-LBGA

The MT29F512G08AUCBBH8-6IT:B is a 512 Gbit non-volatile FLASH NAND (SLC) memory device in a 152-LBGA (14×18) package, manufactured by Micron Technology Inc. It provides a parallel memory interface with a 64G × 8 organization.

With a specified clock frequency of 166 MHz, an operating temperature range of −40°C to 85°C (TA), and a supply voltage range of 2.7 V to 3.6 V, the device is intended for systems requiring high-density parallel NAND flash storage in a compact BGA footprint.

Key Features

  • Memory Technology  FLASH - NAND (SLC) technology as specified in the product data.
  • Capacity & Organization  512 Gbit total capacity with a 64G × 8 memory organization.
  • Interface & Performance  Parallel memory interface with a listed clock frequency of 166 MHz.
  • Power  Operating supply voltage range of 2.7 V to 3.6 V.
  • Package  152-LBGA package (14×18) / Supplier device package 152-LBGA (14x18) for compact board-level integration.
  • Operating Conditions  Specified ambient operating temperature range of −40°C to 85°C (TA).

Unique Advantages

  • High-density storage: 512 Gbit capacity supports large data storage requirements without multiple devices.
  • Parallel interface with defined clock rate: Parallel connectivity and a 166 MHz clock frequency enable straightforward integration into systems expecting parallel flash.
  • SLC NAND technology: Device is specified as FLASH - NAND (SLC) according to the product data.
  • Wide voltage compatibility: 2.7 V to 3.6 V supply range aligns with common 3 V system power domains.
  • Robust ambient range: −40°C to 85°C operating temperature range supports deployment across a wide set of ambient conditions.
  • Compact BGA package: 152-LBGA (14×18) package provides a small footprint for space-constrained board designs.

Why Choose MT29F512G08AUCBBH8-6IT:B?

The MT29F512G08AUCBBH8-6IT:B combines large 512 Gbit capacity, SLC NAND technology, and a parallel interface in a compact 152-LBGA package. Its specified 166 MHz clock frequency, 2.7 V–3.6 V supply range, and −40°C to 85°C operating range make it appropriate for designs that require high-density non-volatile parallel flash memory within these electrical and thermal parameters.

This device is suited for designers and procurement teams seeking a Micron-manufactured parallel NAND flash component with clearly stated capacity, package, interface, and operating requirements for system-level planning and integration.

Request a quote or submit an inquiry to discuss pricing, lead times, and availability for the MT29F512G08AUCBBH8-6IT:B.

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