MT29F32G08CFACBWP-12:C
| Part Description |
IC FLASH 32GBIT PAR 48TSOP I |
|---|---|
| Quantity | 1,553 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 48-TSOP I | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 83 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 48-TFSOP (0.724", 18.40mm Width) | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 4G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F32G08CFACBWP-12:C – IC FLASH 32GBIT PAR 48TSOP I
The MT29F32G08CFACBWP-12:C is a 32 Gbit non-volatile NAND FLASH memory device organized as 4G × 8 with a parallel memory interface. It delivers system-compatible operation with an 83 MHz clock rate, a 2.7 V to 3.6 V supply window, and a surface-mount 48-TSOP I package.
Specified for an ambient operating range of 0°C to 70°C, this parallel FLASH device is intended for designs requiring on-board, high-density non-volatile memory in a compact TSOP footprint.
Key Features
- Memory — Non-volatile NAND FLASH technology with 32 Gbit capacity organized as 4G × 8, suitable for large on-board data storage.
- Interface & Performance — 8-bit parallel memory interface supporting a clock frequency of 83 MHz for parallel data access.
- Power — Operates from a 2.7 V to 3.6 V supply range, matching common system voltage rails.
- Package & Mounting — 48-TSOP I (48-TFSOP) surface-mount package (0.724", 18.40 mm width) for board-level integration.
- Operating Temperature — Ambient temperature range specified from 0°C to 70°C.
- Environmental Status — RoHS status not specified in the product data.
Unique Advantages
- High-density storage: 32 Gbit capacity consolidates large data and code storage into a single device, reducing component count.
- Parallel interface compatibility: 8-bit parallel organization and 83 MHz clock provide straightforward integration with parallel memory systems.
- Flexible power requirements: 2.7 V–3.6 V supply range supports common system rails for simplified power design.
- Compact SMD package: 48-TSOP I package offers a standardized surface-mount form factor for board-level assembly.
- Clear thermal specification: 0°C to 70°C ambient rating provides defined operating limits for thermal planning.
Why Choose MT29F32G08CFACBWP-12:C?
The MT29F32G08CFACBWP-12:C positions itself as a high-density, parallel NAND FLASH option that combines a 32 Gbit memory organization with a standard 48-TSOP I package and a common 2.7 V–3.6 V supply window. Its 8-bit parallel interface and 83 MHz clock specification make it suitable for designs that require straightforward parallel FLASH integration and clear electrical and thermal parameters.
This device is well suited to engineering teams and procurement professionals seeking a single-device solution for on-board non-volatile storage where package size, supply compatibility, and defined operating temperature are key selection criteria.
Request a quote or submit an inquiry for MT29F32G08CFACBWP-12:C to receive pricing and availability information.
