MT29F32G08CFACAWP:C TR

The MT29F32G08CFACAWP:C TR is a 32 Gbit non-volatile NAND flash memory organized as 4G × 8 using multi-level cell (MLC) technology. It provides a parallel memory interface in a 48‑pin TSOP I / TFSOP package and operates from a 2.7 V to 3.6 V supply.

This device is intended for designs that require high-density parallel NAND storage with a standard TSOP footprint and a commercial operating temperature range of 0°C to 70°C. Its core value is delivering high-density, parallel-access flash memory in a compact 48‑pin package for embedded systems and board-level integration.

Key Features

• Memory Type & Technology 32 Gbit NAND flash, implemented as 4G × 8 organization using MLC (multi-level cell) technology.
• Interface Parallel memory interface for direct board-level connection to parallel memory controllers.
• Supply Voltage Operates from 2.7 V to 3.6 V, enabling compatibility with common 3.3 V system rails.
• Package Available in a 48‑pin TSOP I / 48‑TFSOP (0.724", 18.40 mm width) package suitable for surface-mount assembly.
• Non-Volatile Storage NAND flash memory provides persistent data retention without external power.
• Operating Temperature Commercial ambient operating range of 0°C to 70°C (TA).

Typical Applications

• Embedded Storage — Use as on-board parallel NAND flash for embedded systems requiring 32 Gbit of non-volatile storage in a compact TSOP package.
• Consumer Electronics — Integration in consumer devices that accept parallel NAND memory with a 2.7–3.6 V supply and commercial temperature range.
• Industrial Control Systems — Board-level firmware and data storage where a parallel flash interface and TSOP form factor are required within 0°C to 70°C ambient conditions.

Unique Advantages

• High-density single-device storage: 32 Gbit capacity in a single 48‑pin TSOP footprint reduces board area and simplifies memory partitioning.
• Parallel interface simplicity: Direct parallel connection enables straightforward integration with existing parallel-memory controllers and legacy designs.
• Standard supply compatibility: 2.7 V–3.6 V operating range aligns with common 3.3 V system rails to ease power supply design.
• Compact surface-mount package: 48‑TFSOP / 48‑TSOP I package supports automated assembly and fits space-constrained PCBs.
• Commercial temperature suitability: Rated for 0°C to 70°C ambient environments for typical commercial applications.

Why Choose IC FLASH 32GBIT PAR 48TSOP I?

The MT29F32G08CFACAWP:C TR positions itself as a practical choice for designers needing high-density, parallel-access NAND flash in a compact TSOP package. Its 32 Gbit MLC organization, parallel interface, and 2.7 V–3.6 V supply compatibility make it suitable for embedded and board-level storage solutions where a commercial temperature range is acceptable.

This device is appropriate for projects that prioritize board-space efficiency and straightforward parallel integration. Its specification set supports designs requiring persistent storage capacity with a common surface-mount package and standard supply voltages.

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