MT29F512G08CECBBJ4-37:B

IC FLASH 512GBIT PAR 132VBGA
Part Description

IC FLASH 512GBIT PAR 132VBGA

Quantity 380 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND (MLC)
Memory Size512 GbitAccess TimeN/AGradeCommercial
Clock Frequency267 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging132-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization64G x 8
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceUnknownREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F512G08CECBBJ4-37:B – IC FLASH 512GBIT PAR 132VBGA

The MT29F512G08CECBBJ4-37:B is a 512 Gbit non-volatile NAND flash memory device from Micron Technology Inc. It uses NAND MLC technology and is organized as 64G × 8, delivered in a 132-VBGA (12×18) package.

This parallel-interface flash device operates with a supply voltage range of 2.7 V to 3.6 V and a clock frequency of 267 MHz, and is specified for an ambient operating temperature range of 0°C to 70°C.

Key Features

  • Memory Type & Technology  NAND flash (MLC) non-volatile memory providing 512 Gbit raw storage capacity.
  • Organization  64G × 8 organization for straightforward byte-wide data access and addressing.
  • Interface & Performance  Parallel memory interface with a specified clock frequency of 267 MHz.
  • Supply Voltage  Operates from 2.7 V to 3.6 V, supporting common 3.3 V system rails.
  • Package  132-VBGA package (12×18 mm) for compact board-level integration.
  • Operating Temperature  Specified ambient range of 0°C to 70°C for standard commercial environments.
  • Manufacturer  Micron Technology Inc. device designation MT29F512G08CECBBJ4-37:B.

Unique Advantages

  • High-density storage: 512 Gbit capacity supports large data storage requirements without external bank switching.
  • Byte-wide organization: 64G × 8 organization simplifies system interfacing where parallel byte access is required.
  • Standard voltage compatibility: 2.7 V to 3.6 V supply range aligns with common 3.3 V system architectures.
  • Compact VBGA package: 132-VBGA (12×18) reduces PCB footprint while providing a robust BGA mounting option.
  • Defined operating range: Specified 0°C to 70°C ambient rating for deployment in commercial temperature environments.

Why Choose IC FLASH 512GBIT PAR 132VBGA?

The MT29F512G08CECBBJ4-37:B offers a high-density NAND MLC solution in a compact 132-VBGA package with a parallel interface and a 267 MHz clock specification. Its electrical and mechanical attributes—512 Gbit capacity, 64G × 8 organization, 2.7 V–3.6 V supply, and defined commercial temperature range—make it suitable for designs that require large, byte-oriented non-volatile storage from a single device.

Produced by Micron Technology Inc., this device is aimed at system designs that prioritize high capacity and board-level density while maintaining standard voltage compatibility and a parallel memory interface for integration into existing architectures.

Request a quote or contact sales to check availability, pricing, and lead times for the MT29F512G08CECBBJ4-37:B.

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