MT29F32G08CBCCBH1-12Z:C
| Part Description |
IC FLASH 32GBIT PARALLEL 100VBGA |
|---|---|
| Quantity | 789 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VBGA (12x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 83 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-VBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 4G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F32G08CBCCBH1-12Z:C – IC FLASH 32GBIT PARALLEL 100VBGA
The MT29F32G08CBCCBH1-12Z:C is a 32 Gbit non-volatile FLASH - NAND memory device organized as 4G × 8 with a parallel memory interface. It is specified for operation on a 2.7 V to 3.6 V supply and supports an 83 MHz clock frequency.
This device is intended for systems that require high-density parallel NAND storage in a compact 100-VBGA (12×18) package, and for designs that operate within an ambient temperature range of 0°C to 70°C (TA).
Key Features
- Memory Type & Technology Non-volatile FLASH – NAND memory for persistent data and code storage.
- Capacity & Organization 32 Gbit capacity organized as 4G × 8 to provide high density in a single-device solution.
- Interface & Performance Parallel memory interface with a specified clock frequency of 83 MHz for synchronous operation.
- Voltage Supply Operates from 2.7 V to 3.6 V, matching common 3.3 V system rails.
- Package 100-VBGA package, footprint 12×18 mm, for compact board-level integration.
- Operating Temperature Rated for ambient operation from 0°C to 70°C (TA).
Typical Applications
- Embedded systems Use as non-volatile program or data storage in embedded control and processing modules.
- Consumer electronics Integration where compact, high-density NAND flash is required for firmware or media storage.
- Storage modules Suitable for board-level storage implementations that need parallel NAND memory in a small package.
Unique Advantages
- High-density storage: 32 Gbit capacity and 4G × 8 organization deliver significant on-board non-volatile memory in a single device.
- Parallel interface simplicity: Parallel memory interface supports straightforward system integration where parallel bus architectures are used.
- System voltage flexibility: 2.7 V to 3.6 V supply range aligns with standard 3.3 V designs, easing power-supply planning.
- Compact package: 100-VBGA (12×18) package provides a small footprint for space-constrained board layouts.
- Defined operating range: Specified ambient temperature range of 0°C to 70°C enables selection for commercial-temperature applications.
- Established NAND technology: FLASH - NAND implementation provides non-volatile storage suitable for program and data retention.
Why Choose MT29F32G08CBCCBH1-12Z:C?
The MT29F32G08CBCCBH1-12Z:C combines a high 32 Gbit NAND FLASH capacity with a parallel interface and a compact 100-VBGA (12×18) package, offering a practical solution for designs needing substantial non-volatile storage in a small footprint. Its 2.7 V–3.6 V supply range and 83 MHz clock specification make it appropriate for systems designed around common 3.3 V rails and parallel memory architectures.
This device is suited to engineers and procurement teams developing commercial-temperature embedded systems, consumer electronics, and board-level storage modules where a defined operating temperature range and clear electrical specifications are required. Its specification-driven profile supports predictable integration and long-term design planning.
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