MT29F32G08CBCCBH1-12Z:C

IC FLASH 32GBIT PARALLEL 100VBGA
Part Description

IC FLASH 32GBIT PARALLEL 100VBGA

Quantity 789 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-VBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size32 GbitAccess TimeN/AGradeCommercial
Clock Frequency83 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging100-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F32G08CBCCBH1-12Z:C – IC FLASH 32GBIT PARALLEL 100VBGA

The MT29F32G08CBCCBH1-12Z:C is a 32 Gbit non-volatile FLASH - NAND memory device organized as 4G × 8 with a parallel memory interface. It is specified for operation on a 2.7 V to 3.6 V supply and supports an 83 MHz clock frequency.

This device is intended for systems that require high-density parallel NAND storage in a compact 100-VBGA (12×18) package, and for designs that operate within an ambient temperature range of 0°C to 70°C (TA).

Key Features

  • Memory Type & Technology Non-volatile FLASH – NAND memory for persistent data and code storage.
  • Capacity & Organization 32 Gbit capacity organized as 4G × 8 to provide high density in a single-device solution.
  • Interface & Performance Parallel memory interface with a specified clock frequency of 83 MHz for synchronous operation.
  • Voltage Supply Operates from 2.7 V to 3.6 V, matching common 3.3 V system rails.
  • Package 100-VBGA package, footprint 12×18 mm, for compact board-level integration.
  • Operating Temperature Rated for ambient operation from 0°C to 70°C (TA).

Typical Applications

  • Embedded systems Use as non-volatile program or data storage in embedded control and processing modules.
  • Consumer electronics Integration where compact, high-density NAND flash is required for firmware or media storage.
  • Storage modules Suitable for board-level storage implementations that need parallel NAND memory in a small package.

Unique Advantages

  • High-density storage: 32 Gbit capacity and 4G × 8 organization deliver significant on-board non-volatile memory in a single device.
  • Parallel interface simplicity: Parallel memory interface supports straightforward system integration where parallel bus architectures are used.
  • System voltage flexibility: 2.7 V to 3.6 V supply range aligns with standard 3.3 V designs, easing power-supply planning.
  • Compact package: 100-VBGA (12×18) package provides a small footprint for space-constrained board layouts.
  • Defined operating range: Specified ambient temperature range of 0°C to 70°C enables selection for commercial-temperature applications.
  • Established NAND technology: FLASH - NAND implementation provides non-volatile storage suitable for program and data retention.

Why Choose MT29F32G08CBCCBH1-12Z:C?

The MT29F32G08CBCCBH1-12Z:C combines a high 32 Gbit NAND FLASH capacity with a parallel interface and a compact 100-VBGA (12×18) package, offering a practical solution for designs needing substantial non-volatile storage in a small footprint. Its 2.7 V–3.6 V supply range and 83 MHz clock specification make it appropriate for systems designed around common 3.3 V rails and parallel memory architectures.

This device is suited to engineers and procurement teams developing commercial-temperature embedded systems, consumer electronics, and board-level storage modules where a defined operating temperature range and clear electrical specifications are required. Its specification-driven profile supports predictable integration and long-term design planning.

Request a quote or contact sales to discuss availability, pricing, and technical details for MT29F32G08CBCCBH1-12Z:C.

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