MT29F64G08ABEBBH6-12:B TR

IC FLASH 64GBIT PARALLEL 152VBGA
Part Description

IC FLASH 64GBIT PARALLEL 152VBGA

Quantity 209 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package152-VBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock Frequency83 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging152-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08ABEBBH6-12:B TR – 64 Gbit Parallel NAND Flash, 152-VBGA

The MT29F64G08ABEBBH6-12:B TR is a non-volatile FLASH memory device based on NAND technology, organized as 8G × 8 for a total density of 64 Gbit. It provides a parallel memory interface with a specified clock frequency of 83 MHz and operates over a supply voltage range of 2.7 V to 3.6 V.

This device is delivered in a 152-VBGA (14 × 18) package and is specified for operation from 0°C to 70°C (TA), offering high-density, byte-wide storage in a compact BGA footprint for embedded designs requiring NAND flash memory.

Key Features

  • Memory Architecture 64 Gbit capacity with an 8G × 8 organization providing byte-wide memory access.
  • Technology & Format FLASH - NAND non-volatile memory format for persistent data storage.
  • Interface & Timing Parallel memory interface with a clock frequency specified at 83 MHz.
  • Power Voltage supply range from 2.7 V to 3.6 V to match a range of system rail options.
  • Package 152-VBGA package case (14 × 18) in a ball-grid array footprint.
  • Operating Temperature Specified ambient operating range of 0°C to 70°C (TA).

Unique Advantages

  • High-density storage: 64 Gbit capacity enables substantial non-volatile data retention in a single device.
  • Byte-wide organization: 8G × 8 arrangement supports parallel, byte-oriented memory access.
  • Defined timing: 83 MHz clock frequency provides a clear timing reference for system integration.
  • Flexible supply range: 2.7 V to 3.6 V operation accommodates a variety of power-rail designs.
  • Compact BGA footprint: 152-VBGA (14 × 18) package helps minimize PCB area for space-constrained layouts.
  • Commercial temperature range: 0°C to 70°C specification aligns with standard ambient operating environments.

Why Choose MT29F64G08ABEBBH6-12:B TR?

The MT29F64G08ABEBBH6-12:B TR positions itself as a straightforward, high-density parallel NAND flash option, combining a 64 Gbit capacity and 8G × 8 organization with an 83 MHz clock specification and a compact 152-VBGA package. Its 2.7 V to 3.6 V supply range and 0°C to 70°C operating window make it appropriate for designs that require verified electrical and thermal parameters.

This device is suited for designers who need a verified, byte-wide parallel NAND flash memory in a small BGA form factor and who require clear, verifiable specifications for integration, sourcing, and long-term design planning.

Request a quote or submit an enquiry for MT29F64G08ABEBBH6-12:B TR to obtain pricing, availability, and lead-time information.

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