MT29F64G08ABEBBH6-12:B

IC FLASH 64GBIT PARALLEL 152VBGA
Part Description

IC FLASH 64GBIT PARALLEL 152VBGA

Quantity 579 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package152-VBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeCommercial
Clock Frequency83 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging152-VBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F64G08ABEBBH6-12:B – IC FLASH 64GBIT PARALLEL 152VBGA

The MT29F64G08ABEBBH6-12:B is a 64 Gbit non-volatile NAND flash memory device organized as 8G × 8 with a parallel memory interface. Packaged in a 152-VBGA (14 × 18) footprint, it operates from a 2.7 V to 3.6 V supply and supports a clock frequency up to 83 MHz.

This device is intended for systems that require parallel NAND flash storage in a compact BGA package and where operation within a 0°C to 70°C ambient temperature range is suitable.

Key Features

  • Memory Core 64 Gbit NAND flash organized as 8G × 8, providing non-volatile storage for system data and code.
  • Technology FLASH - NAND technology for persistent data retention without power.
  • Interface Parallel memory interface for integration into systems designed for parallel NAND connectivity.
  • Performance Supports a clock frequency of up to 83 MHz, defined for timing and system integration considerations.
  • Power Voltage supply range of 2.7 V to 3.6 V to accommodate common 3.0 V system rails.
  • Package 152-VBGA (14 × 18) supplier device package for compact board-level mounting and assembly.
  • Temperature Range Rated for operation from 0°C to 70°C (TA), suitable for commercial-temperature applications.

Typical Applications

  • Embedded storage systems — Provides parallel NAND flash capacity for systems that require non-volatile program and data storage.
  • Firmware and code storage — Used to store boot code and firmware in designs that integrate a parallel flash interface.
  • Compact board-level designs — 152-VBGA packaging enables dense integration where board space is constrained.

Unique Advantages

  • Large non-volatile capacity: 64 Gbit organization (8G × 8) delivers substantial on-board storage for code and data without external media.
  • Parallel interface compatibility: Parallel memory interface supports integration into systems designed around parallel NAND connectivity.
  • Defined clock support: Rated to operate at up to 83 MHz, enabling designers to plan timing and data throughput parameters.
  • Flexible supply range: 2.7 V to 3.6 V supply voltage accommodates common 3.0 V system rails.
  • Space-efficient packaging: 152-VBGA (14 × 18) package minimizes PCB footprint for compact assemblies.
  • Commercial temperature rating: Specified 0°C to 70°C operating range for standard commercial environments.

Why Choose MT29F64G08ABEBBH6-12:B?

The MT29F64G08ABEBBH6-12:B combines a 64 Gbit NAND flash organization with a parallel interface and a compact 152-VBGA footprint to meet the needs of designs that require on-board, non-volatile storage in a space-efficient package. Its defined clock specification (83 MHz) and 2.7 V–3.6 V supply range make it straightforward to integrate into systems that use parallel NAND flash memory and standard 3.0 V rails.

This device is suited to customers and designs targeting commercial-temperature applications that need persistent storage, compact packaging, and a parallel memory interface. It provides predictable electrical and mechanical parameters for planning board-level integration and system timing.

Request a quote or contact sales to discuss availability, pricing, and ordering for the MT29F64G08ABEBBH6-12:B.

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