MT48LC16M16A2FG-7E:D TR

The MT48LC16M16A2FG-7E:D TR is a 256 Mbit SDRAM device organized as 16M × 16 with internal bank architecture and a parallel memory interface. It implements fully synchronous, pipelined SDRAM architecture and is offered in a 54-ball VFBGA package.

Designed for systems requiring PC100/PC133-compliant SDRAM timing, this device emphasizes synchronous, pipelined operation, programmable burst lengths and standard refresh modes to support memory subsystems in compact board-level applications operating within a commercial temperature range.

Key Features

• Memory Core & Organization 256 Mbit SDRAM organized as 16M × 16, internally arranged as 4M × 16 × 4 banks to support multi-bank operation and hidden row access/precharge.
• Interface & Timing Parallel SDRAM interface with a 133 MHz clock frequency (–7E speed grade). Timing examples for the –7E grade include 2-2-2 RCD-RP-CL and CAS latency characteristics specified in the datasheet.
• Performance & Operation Fully synchronous, internal pipelined operation that allows column address changes every clock cycle, programmable burst lengths (1, 2, 4, 8, or full page), auto precharge and auto refresh.
• Power Single power supply operation at 3.3 V ±0.3 V (specified voltage range 3.0 V to 3.6 V).
• I/O LVTTL-compatible inputs and outputs for standard logic-level interfacing.
• Timing Metrics Access time listed at 5.4 ns and write cycle time (word page) of 14 ns for the specified device.
• Refresh Supports standard auto refresh and self-refresh modes with 8192-cycle refresh; commercial refresh interval specified as 64 ms for 8K cycles.
• Package & Temperature 54-ball VFBGA package (8 × 14 mm footprint) with an operating temperature range of 0°C to 70°C (TA), suitable for commercial-temperature applications.

Typical Applications

• PC100/PC133 memory subsystems — Use where PC100- and PC133-compliant SDRAM timing is required for legacy or compatible systems.
• Board-level parallel memory — Compact 54-ball VFBGA package enables integration of 256 Mbit parallel SDRAM on space-constrained PCBs.
• Commercial electronic equipment — Memory for systems operating within the 0°C to 70°C commercial temperature range that require standard SDRAM refresh and burst capabilities.
• Module and add-on designs — Suitable for memory expansion or substitute devices in modules that specify 16M × 16 organization and a 3.3 V supply.

Unique Advantages

• PC100/PC133 compliance: Provides timing compatibility with PC100 and PC133 system requirements as documented for the 256Mb product family.
• Synchronous, pipelined architecture: Fully synchronous operation with internal pipelining and multi-bank organization helps maintain steady throughput by allowing column address changes every clock cycle.
• Flexible burst control: Programmable burst lengths (1, 2, 4, 8, full page) let designers tailor transfers for sequential or random-access patterns.
• Compact VFBGA package: 54-ball VFBGA (8 × 14 mm) reduces PCB footprint for board-level memory integration.
• Standard 3.3 V supply: Operates from a single 3.0 V–3.6 V supply (3.3 V ±0.3 V), simplifying power rail requirements.
• Commercial temperature support: Rated for 0°C to 70°C operation and standard 64 ms/8192-cycle refresh for commercial applications.

Why Choose MT48LC16M16A2FG-7E:D TR?

The MT48LC16M16A2FG-7E:D TR is positioned for designs that need a compact, PC100/PC133-compatible 256 Mbit SDRAM with synchronous, pipelined operation and flexible burst and refresh features. Its 16M × 16 organization, multi-bank architecture and LVTTL I/O make it suitable for board-level memory implementations where standardized timing and a 3.3 V supply are required.

This device is a practical choice for commercial-temperature memory subsystems that require predictable SDRAM behavior—programmable burst lengths, auto-refresh/self-refresh support and an industry-standard VFBGA footprint help integrate 256 Mbit of parallel SDRAM into space-constrained designs while meeting common system timing expectations.

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