MT48LC16M16A2TG-75 IT:D TR

IC DRAM 256MBIT PAR 54TSOP II
Part Description

IC DRAM 256MBIT PAR 54TSOP II

Quantity 1,165 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceN/AREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of MT48LC16M16A2TG-75 IT:D TR – IC DRAM 256MBIT PAR 54TSOP II

The MT48LC16M16A2TG-75 IT:D TR is a 256Mbit synchronous DRAM (SDRAM) device organized as 16M × 16 with a parallel memory interface. It implements fully synchronous, pipelined SDRAM architecture with internal banks and programmable burst operation to support high-throughput system memory requirements.

Targeted for systems requiring parallel SDRAM memory at 133 MHz, the device offers PC100/PC133 compliance, a single 3.3 V supply range, and an operating temperature range of −40°C to +85°C for use in temperature-sensitive designs.

Key Features

  • Core / Architecture  Fully synchronous SDRAM with internal pipelined operation; all signals are registered on the positive edge of the system clock.
  • Memory Organization  256 Mbit capacity organized as 16M × 16 with internal banks to hide row access and precharge latency.
  • Performance & Timing  133 MHz clock frequency (speed grade -75), access time 5.4 ns, and CAS timing target of 3-3-3 at the -75 grade as specified in the datasheet.
  • Burst & Refresh  Programmable burst lengths (1, 2, 4, 8, or full page), auto precharge, auto refresh and 64 ms/8192-cycle refresh support (commercial and industrial refresh modes documented).
  • Interface & I/O  Parallel memory interface with LVTTL-compatible inputs and outputs for system-level signal compatibility.
  • Power  Single-supply operation at 3.3 V (3.0 V to 3.6 V specified).
  • Package  54‑pin TSOP II (0.400", 10.16 mm width) surface-mount package (54-TSOP II).
  • Operating Temperature  Specified operating range −40°C to +85°C (TA).

Typical Applications

  • Parallel SDRAM subsystems: Memory expansion in systems that require 16M × 16 parallel SDRAM devices and standard SDRAM timing/operation.
  • Embedded and industrial electronics: Reliable SDRAM operation across a −40°C to +85°C temperature range for temperature-sensitive embedded designs.
  • Legacy SDRAM designs: Replacement or integration into designs using PC100/PC133-compliant SDRAM memory modules and parallel interfaces.

Unique Advantages

  • PC100/PC133 compliance: Enables integration into systems designed for PC100 and PC133 SDRAM timing and signaling.
  • Pipelined, banked architecture: Internal banks and pipelined operation reduce effective access latency and support column address changes every clock cycle.
  • Flexible burst operation: Programmable burst lengths (including full‑page) allow designers to optimize transfers for throughput or latency.
  • Industrial temperature range: Specified operation from −40°C to +85°C supports deployment in temperature-challenging environments.
  • Standard 54‑TSOP II package: Compact surface-mount package (0.400" / 10.16 mm width) for dense board layouts and established assembly processes.
  • Single 3.3 V supply: Simplifies power rail requirements with a documented 3.0 V to 3.6 V operating range.

Why Choose MT48LC16M16A2TG-75 IT:D TR?

The MT48LC16M16A2TG-75 IT:D TR combines a 256 Mbit SDRAM organization with fully synchronous, pipelined operation and programmable burst modes to address systems that need predictable, parallel SDRAM performance at 133 MHz. Its documented timing options, auto refresh and precharge capabilities, and LVTTL-compatible I/O make it suitable for designs that require standard SDRAM behavior and integration.

This device is appropriate for designers and procurement teams specifying parallel SDRAM components for embedded, industrial, and legacy SDRAM systems where a 54‑pin TSOP II footprint, single 3.3 V supply, and −40°C to +85°C operation are required.

Request a quote or submit an inquiry for MT48LC16M16A2TG-75 IT:D TR to obtain pricing and availability for your design and production needs.

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