MT48LC16M4A2P-75:G
| Part Description |
IC DRAM 64MBIT PAR 54TSOP II |
|---|---|
| Quantity | 170 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 133 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 4 | ||
| Moisture Sensitivity Level | 2 (1 Year) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC16M4A2P-75:G – IC DRAM 64MBIT PAR 54TSOP II
The MT48LC16M4A2P-75:G is a 64 Mbit synchronous DRAM (SDRAM) organized as 16M × 4 with four internal banks and a parallel memory interface. It operates at a 133 MHz clock frequency and is supplied from a single +3.3 V rail (3.0 V to 3.6 V).
Designed for systems requiring fully synchronous parallel DRAM, this device provides programmable burst lengths, auto-refresh/self-refresh modes and LVTTL-compatible I/Os to support synchronous memory subsystems compliant with PC66/PC100/PC133 timing.
Key Features
- Core / Memory Architecture 16M × 4 organization with four internal banks (4 Meg × 4 × 4 banks) for banked row access and hidden row precharge.
- Performance / Timing PC66-, PC100-, and PC133-compliant operation with a 133 MHz clock frequency; access time and cycle-time characteristics suitable for CL configurations described in the datasheet.
- Data Transfer Modes Programmable burst lengths of 1, 2, 4, 8 or full-page plus Auto Precharge and Concurrent Auto Precharge to support varied access patterns.
- Refresh and Retention Supports Auto Refresh and Self Refresh modes (standard and low power); 64 ms / 4,096-cycle refresh interval per datasheet.
- Interface Fully synchronous operation with all signals registered on the positive clock edge and LVTTL-compatible inputs/outputs for straightforward parallel interfacing.
- Power Single +3.3 V ±0.3 V supply (listed voltage range 3.0 V to 3.6 V) and self-refresh modes to manage power during idle intervals.
- Package 54-pin TSOP II (0.400", 10.16 mm width) in a compact footprint for surface-mount memory implementations.
- Operating Range Commercial temperature grade with operating temperature 0°C to +70°C (TA) as specified.
Typical Applications
- PC Memory Subsystems — Designed to meet PC66/PC100/PC133 timing classes for use in PC-class synchronous DRAM memory subsystems.
- Synchronous Parallel Memory Designs — For systems that require a parallel SDRAM interface with programmable burst operation and banked internal architecture.
- Compact Surface-Mount Modules — Use in compact board-level memory implementations where a 54-pin TSOP II package is required.
Unique Advantages
- PC133-Class Operation: Provides 133 MHz clock support for systems targeting PC133 timing compliance.
- Flexible Burst Control: Programmable burst lengths (1, 2, 4, 8, full page) enable tuning of data transfer patterns to match system throughput needs.
- Banked Architecture: Four internal banks allow overlapping row access and precharge to improve effective throughput for interleaved accesses.
- Single +3.3 V Supply: Operates from a single 3.0 V–3.6 V supply simplifying power-rail requirements.
- Compact TSOP II Package: 54-pin TSOP II (400 mil, 10.16 mm width) supports surface-mount designs with limited board space.
- Built-in Refresh Management: Auto Refresh and Self Refresh modes reduce external refresh control complexity and support low-power retention intervals.
Why Choose IC DRAM 64MBIT PAR 54TSOP II?
The MT48LC16M4A2P-75:G offers a synchronous, parallel SDRAM solution with PC-class timing, a 16M × 4 organization and four internal banks to support bank-interleaved access patterns. Its single +3.3 V supply, LVTTL-compatible I/Os, and compact 54-pin TSOP II package make it suitable for board-level memory implementations that require standard SDRAM behavior and refresh management built into the device.
This device is appropriate for designs that need a straightforward parallel SDRAM component compliant with PC66/PC100/PC133 timing, and for engineers seeking a compact packaged DRAM with programmable burst lengths and standard refresh capabilities.
Request a quote or submit a procurement inquiry to obtain pricing, availability and lead-time information for the MT48LC16M4A2P-75:G.