MT48LC16M4A2P-75:G

IC DRAM 64MBIT PAR 54TSOP II
Part Description

IC DRAM 64MBIT PAR 54TSOP II

Quantity 170 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 4
Moisture Sensitivity Level2 (1 Year)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC16M4A2P-75:G – IC DRAM 64MBIT PAR 54TSOP II

The MT48LC16M4A2P-75:G is a 64 Mbit synchronous DRAM (SDRAM) organized as 16M × 4 with four internal banks and a parallel memory interface. It operates at a 133 MHz clock frequency and is supplied from a single +3.3 V rail (3.0 V to 3.6 V).

Designed for systems requiring fully synchronous parallel DRAM, this device provides programmable burst lengths, auto-refresh/self-refresh modes and LVTTL-compatible I/Os to support synchronous memory subsystems compliant with PC66/PC100/PC133 timing.

Key Features

  • Core / Memory Architecture 16M × 4 organization with four internal banks (4 Meg × 4 × 4 banks) for banked row access and hidden row precharge.
  • Performance / Timing PC66-, PC100-, and PC133-compliant operation with a 133 MHz clock frequency; access time and cycle-time characteristics suitable for CL configurations described in the datasheet.
  • Data Transfer Modes Programmable burst lengths of 1, 2, 4, 8 or full-page plus Auto Precharge and Concurrent Auto Precharge to support varied access patterns.
  • Refresh and Retention Supports Auto Refresh and Self Refresh modes (standard and low power); 64 ms / 4,096-cycle refresh interval per datasheet.
  • Interface Fully synchronous operation with all signals registered on the positive clock edge and LVTTL-compatible inputs/outputs for straightforward parallel interfacing.
  • Power Single +3.3 V ±0.3 V supply (listed voltage range 3.0 V to 3.6 V) and self-refresh modes to manage power during idle intervals.
  • Package 54-pin TSOP II (0.400", 10.16 mm width) in a compact footprint for surface-mount memory implementations.
  • Operating Range Commercial temperature grade with operating temperature 0°C to +70°C (TA) as specified.

Typical Applications

  • PC Memory Subsystems — Designed to meet PC66/PC100/PC133 timing classes for use in PC-class synchronous DRAM memory subsystems.
  • Synchronous Parallel Memory Designs — For systems that require a parallel SDRAM interface with programmable burst operation and banked internal architecture.
  • Compact Surface-Mount Modules — Use in compact board-level memory implementations where a 54-pin TSOP II package is required.

Unique Advantages

  • PC133-Class Operation: Provides 133 MHz clock support for systems targeting PC133 timing compliance.
  • Flexible Burst Control: Programmable burst lengths (1, 2, 4, 8, full page) enable tuning of data transfer patterns to match system throughput needs.
  • Banked Architecture: Four internal banks allow overlapping row access and precharge to improve effective throughput for interleaved accesses.
  • Single +3.3 V Supply: Operates from a single 3.0 V–3.6 V supply simplifying power-rail requirements.
  • Compact TSOP II Package: 54-pin TSOP II (400 mil, 10.16 mm width) supports surface-mount designs with limited board space.
  • Built-in Refresh Management: Auto Refresh and Self Refresh modes reduce external refresh control complexity and support low-power retention intervals.

Why Choose IC DRAM 64MBIT PAR 54TSOP II?

The MT48LC16M4A2P-75:G offers a synchronous, parallel SDRAM solution with PC-class timing, a 16M × 4 organization and four internal banks to support bank-interleaved access patterns. Its single +3.3 V supply, LVTTL-compatible I/Os, and compact 54-pin TSOP II package make it suitable for board-level memory implementations that require standard SDRAM behavior and refresh management built into the device.

This device is appropriate for designs that need a straightforward parallel SDRAM component compliant with PC66/PC100/PC133 timing, and for engineers seeking a compact packaged DRAM with programmable burst lengths and standard refresh capabilities.

Request a quote or submit a procurement inquiry to obtain pricing, availability and lead-time information for the MT48LC16M4A2P-75:G.

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