MT48LC16M8A2P-7E:G TR

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 891 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page14 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 8
Moisture Sensitivity Level2 (1 Year)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC16M8A2P-7E:G TR – IC DRAM 128MBIT PAR 54TSOP II

The MT48LC16M8A2P-7E:G TR is a 128 Mbit synchronous DRAM (SDR SDRAM) organized as 16M × 8 with four internal banks and a parallel memory interface. It is designed for systems requiring PC100/PC133-compliant SDRAM performance and predictable synchronous operation.

Key benefits include synchronous, pipelined operation with programmable burst lengths, standard refresh and self-refresh modes, and a compact 54-pin TSOP II package suitable for space-conscious commercial designs operating at 0°C to 70°C.

Key Features

  • Core / Architecture Fully synchronous SDR SDRAM with pipelined internal operation; all signals registered on the positive edge of the system clock.
  • Memory Organization 128 Mbit density organized as 16M × 8 with 4 internal banks, providing standard DRAM addressing and banked access.
  • Performance Clock frequency up to 133 MHz (PC133-compliant) with specified access time of 5.4 ns and speed-grade timing targeting 2-2-2 or 3-3-3 CAS latencies depending on configuration. Write cycle time (word/page) specified at 14 ns.
  • Data Transfer and Burst Programmable burst lengths of 1, 2, 4, 8 or full page; column address can be changed every clock cycle for pipelined transfers.
  • Refresh and Power Modes Auto refresh and auto precharge supported; standard and low-power self-refresh modes available (low-power mode not available on AT devices). 64 ms/4096-cycle refresh supported for commercial devices.
  • Electrical Single-supply operation at 3.0 V to 3.6 V (3.3 V ±0.3 V). LVTTL-compatible inputs and outputs.
  • Package and Temperature 54-pin TSOP II (0.400", 10.16 mm width) plastic package; commercial operating temperature range 0°C to +70°C.
  • Interface Parallel memory interface suitable for legacy and standard synchronous DRAM system designs.

Typical Applications

  • PC and legacy system memory Use in designs requiring PC100/PC133-compliant SDRAM modules or compatible synchronous DRAM devices.
  • Embedded systems Parallel SDRAM for embedded controllers and boards that require deterministic, synchronous memory access and programmable burst transfers.
  • Consumer and commercial electronics Memory for devices that operate within the 0°C to 70°C commercial temperature range and need a compact 54-pin TSOP II footprint.

Unique Advantages

  • Predictable synchronous timing: Fully synchronous operation with registered inputs and pipelined access simplifies timing and system integration.
  • Flexible burst transfers: Programmable burst lengths (1, 2, 4, 8, full page) allow designers to tune throughput and latency for application needs.
  • Banked architecture for hidden latency: Internal banks enable row access/precharge hiding to improve effective throughput for interleaved accesses.
  • Standard supply and signal levels: Operates from 3.0 V to 3.6 V with LVTTL-compatible I/O, matching common legacy SDRAM system requirements.
  • Compact package footprint: 54-pin TSOP II (400 mil) package supports space-constrained board designs while maintaining standard pinout.

Why Choose MT48LC16M8A2P-7E:G TR?

The MT48LC16M8A2P-7E:G TR offers a commercially rated, PC100/PC133-compliant SDRAM solution with a 16M × 8 organization and four internal banks for efficient, pipelined memory access. Its support for programmable burst lengths, auto-refresh mechanisms and LVTTL-compatible I/O make it suitable for designs that require synchronous, predictable memory behavior in a compact TSOP II package.

This device is well suited to engineers and purchasing professionals specifying commercial-temperature SDRAM for embedded platforms, legacy system upgrades, and consumer or commercial electronics where a standard 3.3 V SDRAM solution is required.

Request a quote or submit a quotation request for MT48LC16M8A2P-7E:G TR through your preferred purchasing channel to confirm availability and lead times.

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