MT48LC16M8A2P-75:G

IC DRAM 128MBIT PAR 54TSOP II
Part Description

IC DRAM 128MBIT PAR 54TSOP II

Quantity 136 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency133 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 8
Moisture Sensitivity Level2 (1 Year)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC16M8A2P-75:G – IC DRAM 128MBIT PAR 54TSOP II

The MT48LC16M8A2P-75:G is a 128 Mbit SDR SDRAM organized as 16M × 8 with a parallel memory interface in a 54-pin TSOP II package. It implements fully synchronous, pipelined SDRAM architecture with internal banks and programmable burst lengths for systems that require standard PC100/PC133-compatible SDRAM operation.

Typical use cases include systems requiring a compact, socketable parallel DRAM solution running at 133 MHz clock rates, where 3.3 V supply operation and commercial temperature range (0°C to 70°C) are appropriate.

Key Features

  • Core & Architecture Fully synchronous SDR SDRAM with internal, pipelined operation and multiple internal banks to support efficient row access and precharge management.
  • Memory Capacity & Organization 128 Mbit capacity organized as 16M × 8 with 4 internal banks.
  • Performance & Timing PC100- and PC133-compliant speed grade (-75) with a clock frequency of 133 MHz and specified access characteristics; programmable burst lengths (1, 2, 4, 8, or full page).
  • Refresh & Self-Refresh Supports auto refresh and standard self-refresh modes (low-power self-refresh option noted in datasheet where available); 4K refresh cycle support per device configuration.
  • Interfaces & I/O Parallel memory interface with LVTTL-compatible inputs and outputs; all signals registered on the positive edge of the system clock.
  • Power & Voltage Single-supply operation at 3.3 V (3.0 V to 3.6 V range).
  • Package & Temperature Available in 54-pin TSOP II (0.400", 10.16 mm width) package; commercial operating temperature range 0°C to +70°C.

Typical Applications

  • PC100/PC133 memory systems — Use as synchronous parallel DRAM for systems designed around PC100/PC133 timing and interfaces.
  • Embedded systems — Provides a 128 Mbit SDRAM option for embedded designs that require a parallel memory interface and 3.3 V supply.
  • Legacy hardware maintenance — Suitable for board-level replacement or repair where 54-pin TSOP II footprint and 16M × 8 organization are required.
  • Board-level modules — Fits compact TSOP II designs needing standard SDRAM features such as programmable burst lengths and internal banks.

Unique Advantages

  • PC100/PC133 compliance: Ensures compatibility with systems designed to those timing classes using the -75 speed grade at 133 MHz.
  • Fully synchronous, pipelined operation: Column addresses can be changed each clock cycle, enabling predictable, clocked interface behavior.
  • Internal bank architecture: Multiple internal banks help hide row access and precharge timing, improving effective throughput for burst transfers.
  • Flexible burst operation: Programmable burst lengths (1, 2, 4, 8, full page) accommodate different access patterns and system requirements.
  • Compact board integration: 54-pin TSOP II package (400 mil, 10.16 mm width) offers a standardized footprint for board-level assembly.
  • Standardized voltage: Single 3.3 V supply (3.0 V to 3.6 V) simplifies power rail design for compatible systems.

Why Choose MT48LC16M8A2P-75:G?

The MT48LC16M8A2P-75:G positions itself as a straightforward, documented 128 Mbit SDR SDRAM solution for designs that require a parallel SDRAM interface at PC133-class timings. Its synchronous, pipelined architecture with internal banks and programmable burst lengths delivers predictable timing behavior in systems designed for 3.3 V operation.

This device is suited to engineers and procurement professionals seeking a compact TSOP II packaged SDRAM for commercial-temperature applications where standard SDRAM features—auto refresh, self-refresh modes, and LVTTL I/O—are required. Design-in is supported by Micron's product datasheet and published timing/option tables for the MT48LCxMxA2 family.

Request a quote or submit an inquiry to obtain pricing and availability for the MT48LC16M8A2P-75:G.

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