MT48LC16M8A2P-75:G
| Part Description |
IC DRAM 128MBIT PAR 54TSOP II |
|---|---|
| Quantity | 136 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 133 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 8 | ||
| Moisture Sensitivity Level | 2 (1 Year) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC16M8A2P-75:G – IC DRAM 128MBIT PAR 54TSOP II
The MT48LC16M8A2P-75:G is a 128 Mbit SDR SDRAM organized as 16M × 8 with a parallel memory interface in a 54-pin TSOP II package. It implements fully synchronous, pipelined SDRAM architecture with internal banks and programmable burst lengths for systems that require standard PC100/PC133-compatible SDRAM operation.
Typical use cases include systems requiring a compact, socketable parallel DRAM solution running at 133 MHz clock rates, where 3.3 V supply operation and commercial temperature range (0°C to 70°C) are appropriate.
Key Features
- Core & Architecture Fully synchronous SDR SDRAM with internal, pipelined operation and multiple internal banks to support efficient row access and precharge management.
- Memory Capacity & Organization 128 Mbit capacity organized as 16M × 8 with 4 internal banks.
- Performance & Timing PC100- and PC133-compliant speed grade (-75) with a clock frequency of 133 MHz and specified access characteristics; programmable burst lengths (1, 2, 4, 8, or full page).
- Refresh & Self-Refresh Supports auto refresh and standard self-refresh modes (low-power self-refresh option noted in datasheet where available); 4K refresh cycle support per device configuration.
- Interfaces & I/O Parallel memory interface with LVTTL-compatible inputs and outputs; all signals registered on the positive edge of the system clock.
- Power & Voltage Single-supply operation at 3.3 V (3.0 V to 3.6 V range).
- Package & Temperature Available in 54-pin TSOP II (0.400", 10.16 mm width) package; commercial operating temperature range 0°C to +70°C.
Typical Applications
- PC100/PC133 memory systems — Use as synchronous parallel DRAM for systems designed around PC100/PC133 timing and interfaces.
- Embedded systems — Provides a 128 Mbit SDRAM option for embedded designs that require a parallel memory interface and 3.3 V supply.
- Legacy hardware maintenance — Suitable for board-level replacement or repair where 54-pin TSOP II footprint and 16M × 8 organization are required.
- Board-level modules — Fits compact TSOP II designs needing standard SDRAM features such as programmable burst lengths and internal banks.
Unique Advantages
- PC100/PC133 compliance: Ensures compatibility with systems designed to those timing classes using the -75 speed grade at 133 MHz.
- Fully synchronous, pipelined operation: Column addresses can be changed each clock cycle, enabling predictable, clocked interface behavior.
- Internal bank architecture: Multiple internal banks help hide row access and precharge timing, improving effective throughput for burst transfers.
- Flexible burst operation: Programmable burst lengths (1, 2, 4, 8, full page) accommodate different access patterns and system requirements.
- Compact board integration: 54-pin TSOP II package (400 mil, 10.16 mm width) offers a standardized footprint for board-level assembly.
- Standardized voltage: Single 3.3 V supply (3.0 V to 3.6 V) simplifies power rail design for compatible systems.
Why Choose MT48LC16M8A2P-75:G?
The MT48LC16M8A2P-75:G positions itself as a straightforward, documented 128 Mbit SDR SDRAM solution for designs that require a parallel SDRAM interface at PC133-class timings. Its synchronous, pipelined architecture with internal banks and programmable burst lengths delivers predictable timing behavior in systems designed for 3.3 V operation.
This device is suited to engineers and procurement professionals seeking a compact TSOP II packaged SDRAM for commercial-temperature applications where standard SDRAM features—auto refresh, self-refresh modes, and LVTTL I/O—are required. Design-in is supported by Micron's product datasheet and published timing/option tables for the MT48LCxMxA2 family.
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