MT48LC32M16A2P-75 IT:C

The MT48LC32M16A2P-75 IT:C is a 512 Mbit synchronous DRAM device organized as 32M × 16 with a parallel memory interface in a 54-pin TSOP II (400 mil) package. It implements SDR SDRAM architecture with fully synchronous, pipelined operation and internal bank management to support high-throughput memory access patterns.

Designed for PC100/PC133-compliant systems, the device operates up to 133 MHz with a typical read access time of 5.4 ns (CL = 3) and supports 3.0–3.6 V single-supply operation and industrial temperature range (–40 °C to +85 °C), making it suitable for designs that require PC133-class synchronous memory with robust thermal tolerance.

Key Features

• Core / Memory Architecture 512 Mbit SDR SDRAM organized as 32M × 16 with four internal banks for improved row access handling and concurrent operations.
• Performance and Timing PC100- and PC133-compliant operation with a clock frequency up to 133 MHz and a typical access time of 5.4 ns (CL = 3). Programmable burst lengths (1, 2, 4, 8, or full page) and a 15 ns write cycle time for word/page operations.
• Synchronous, Pipelined Operation Fully synchronous device with all signals registered on the positive edge of the system clock and internal pipelining that allows column address changes every clock cycle.
• Refresh and Power Management Auto refresh, self-refresh modes and a 64 ms / 8192-cycle refresh requirement; single 3.3 V ±0.3 V supply (specified 3.0–3.6 V).
• Signal Compatibility LVTTL-compatible inputs and outputs supporting standard parallel SDRAM interfacing.
• Package and Thermal 54-pin TSOP II (400 mil, 10.16 mm width) plastic package with industrial operating temperature range of –40 °C to +85 °C (TA).

Typical Applications

• Embedded memory expansion — Provides 512 Mbit of parallel SDRAM for systems requiring PC100/PC133 synchronous memory and standard 3.3 V supply operation.
• Industrial control systems — Industrial temperature range (–40 °C to +85 °C) supports deployment in thermally demanding environments that need reliable SDRAM storage.
• Legacy and retrofit designs — 54-pin TSOP II package and parallel interface suit designs that use standard PC100/PC133-class SDRAM footprints and timing.

Unique Advantages

• PC133-class compatibility: Built to PC100/PC133 timing with 133 MHz clock support and 5.4 ns access time (CL = 3), enabling integration into systems targeting those performance levels.
• Flexible burst and pipelined access: Programmable burst lengths and pipelined internal operation allow column address changes every clock cycle for efficient block transfers.
• Robust temperature range: Industrial-grade operating range (–40 °C to +85 °C) supports deployment where extended thermal tolerance is required.
• Standard supply and IO levels: Single 3.0–3.6 V supply with LVTTL-compatible inputs/outputs for straightforward system integration.
• Compact TSOP II package: 54-pin 400 mil TSOP II (10.16 mm width) package balances board space and pin count for parallel SDRAM applications.

Why Choose MT48LC32M16A2P-75 IT:C?

The MT48LC32M16A2P-75 IT:C offers a PC100/PC133-compliant SDRAM solution with 512 Mbit density, low-latency access (5.4 ns at CL = 3), and industry-temperature operation. Its fully synchronous, pipelined architecture with internal banks and programmable burst lengths makes it suitable for systems that require predictable, high-throughput parallel memory behavior.

This device is appropriate for designers needing a 3.3 V parallel SDRAM in a standard 54-pin TSOP II package with industrial thermal range—providing a straightforward memory option for embedded, industrial, and retrofit applications where PC133-class synchronous DRAM is required.

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