MT48LC4M16A2P-6 IT:G TR
| Part Description |
IC DRAM 64MBIT PAR 54TSOP II |
|---|---|
| Quantity | 998 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.5 ns | Grade | Industrial | ||
| Clock Frequency | 167 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 16 | ||
| Moisture Sensitivity Level | 2 (1 Year) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC4M16A2P-6 IT:G TR – IC DRAM 64MBIT PAR 54TSOP II
The MT48LC4M16A2P-6 IT:G TR is a 64 Mbit synchronous DRAM device organized as 4M × 16 with a parallel memory interface. It implements a fully synchronous, pipelined architecture with internal banks to optimize row access and precharge behavior.
This part is offered in a 54‑pin TSOP II package and supports an industrial operating temperature range of −40°C to +85°C with a supply range of 3.0 V to 3.6 V, providing a compact, voltage‑tolerant SDRAM option for systems requiring parallel DRAM storage at up to a 167 MHz clock frequency and 5.5 ns access time.
Key Features
- Memory Organization — 64 Mbit total capacity arranged as 4M × 16 with 4 internal banks, delivering parallel DRAM storage in a compact density.
- Fully Synchronous SDRAM — All signals are registered on the positive edge of the system clock; internal pipelined operation allows the column address to change every clock cycle.
- Programmable Burst and Refresh — Supports programmable burst lengths (1, 2, 4, 8, or full page) and standard auto refresh with a 64 ms, 4,096‑cycle refresh requirement.
- Auto and Self‑Refresh Modes — Includes Auto Precharge (including concurrent auto precharge) and both standard and low‑power self‑refresh modes.
- Performance — Specified clock frequency up to 167 MHz with an access time of 5.5 ns and a write cycle time (word/page) of 12 ns.
- Voltage and I/O — Single +3.3 V nominal supply (specified 3.0 V to 3.6 V) with LVTTL‑compatible inputs and outputs.
- Package — 54‑pin TSOP II (0.400", 10.16 mm width) plastic package for surface‑mount applications.
- Operating Temperature — Industrial temperature range: −40°C to +85°C (TA).
Unique Advantages
- Compact TSOP II package: 54‑pin 0.400" (10.16 mm) TSOP II package minimizes PCB footprint while providing a parallel DRAM interface.
- Flexible burst and refresh control: Programmable burst lengths and Auto/Self‑Refresh support enable tuning for different access patterns and power profiles.
- Pipelined internal architecture: Internal banks and pipelined operation allow column addresses to be changed each clock cycle for efficient throughput.
- Industrial temperature rating: −40°C to +85°C operating range supports use in temperature‑sensitive environments.
- Wide supply tolerance: 3.0 V to 3.6 V supply range (nominal +3.3 V) provides tolerance for typical 3.3 V system rails.
- LVTTL‑compatible signaling: Standard LVTTL inputs and outputs simplify interfacing with common system logic levels.
Why Choose IC DRAM 64MBIT PAR 54TSOP II?
The MT48LC4M16A2P-6 IT:G TR delivers a straightforward 64 Mbit parallel SDRAM solution based on a fully synchronous, pipelined architecture with internal banks and programmable burst modes. Its specified performance figures—167 MHz clock frequency and 5.5 ns access time—combine with standard LVTTL I/O and a 3.0 V to 3.6 V supply to fit designs that require reliable parallel DRAM memory in a small TSOP II package.
With industrial temperature operation and standard auto/self‑refresh features, this device is suited to applications that demand stable DRAM behavior across temperature and supply variations while retaining flexible access patterns and compact board integration.
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